JPH0348232U - - Google Patents

Info

Publication number
JPH0348232U
JPH0348232U JP1989108936U JP10893689U JPH0348232U JP H0348232 U JPH0348232 U JP H0348232U JP 1989108936 U JP1989108936 U JP 1989108936U JP 10893689 U JP10893689 U JP 10893689U JP H0348232 U JPH0348232 U JP H0348232U
Authority
JP
Japan
Prior art keywords
hybrid
board
wire
semiconductor chips
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989108936U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989108936U priority Critical patent/JPH0348232U/ja
Publication of JPH0348232U publication Critical patent/JPH0348232U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/50
    • H10W90/753
    • H10W90/754

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP1989108936U 1989-09-18 1989-09-18 Pending JPH0348232U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989108936U JPH0348232U (enExample) 1989-09-18 1989-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989108936U JPH0348232U (enExample) 1989-09-18 1989-09-18

Publications (1)

Publication Number Publication Date
JPH0348232U true JPH0348232U (enExample) 1991-05-08

Family

ID=31657545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989108936U Pending JPH0348232U (enExample) 1989-09-18 1989-09-18

Country Status (1)

Country Link
JP (1) JPH0348232U (enExample)

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