JPH0348206U - - Google Patents
Info
- Publication number
- JPH0348206U JPH0348206U JP10988889U JP10988889U JPH0348206U JP H0348206 U JPH0348206 U JP H0348206U JP 10988889 U JP10988889 U JP 10988889U JP 10988889 U JP10988889 U JP 10988889U JP H0348206 U JPH0348206 U JP H0348206U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- base
- lead
- lead terminal
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Description
第１図は、この考案の一実施例に係る電子部品
を示す側面図である。第２図は、第１図のリード
端子の根本部の拡大断面図である。第３図および
第４図は、それぞれ、従来の電子部品の例を示す
側面図である。
４……ベース、６……電子部品本体、８……リ
ード線、１０……リード端子、１０ａ……つば状
部、１２……半田溜り、２２……実施例に係る電
子部品。
FIG. 1 is a side view showing an electronic component according to an embodiment of this invention. FIG. 2 is an enlarged sectional view of the root portion of the lead terminal in FIG. 1. FIGS. 3 and 4 are side views showing examples of conventional electronic components, respectively. 4...Base, 6...Electronic component main body, 8...Lead wire, 10...Lead terminal, 10a...Brim portion, 12...Solder pool, 22...Electronic component according to the example.
Claims (1)
ベースの下面に複数本のリード端子をその一端側
をベース内に埋め込んで立設し、かつ電子部品本
体からのリード線をリード端子の根本部に巻き付
けて半田付けした構造を電子部品において、前記
各リード端子の一端側につば状部を設け、このリ
ード端子のつば状部側を当該つば状部の表面が露
出するように前記ベース内に埋め込み、そのよう
なリード端子の根本部に前記電子部品本体からの
リード線を巻き付けて半田付けしていることを特
徴とする電子部品。 The electronic component body is mounted on a resin base, one end of which is embedded in the base, and a plurality of lead terminals are placed upright on the bottom surface of the base, and the lead wires from the electronic component body are connected to the base of the lead terminals. In an electronic component having a structure in which the lead terminal is wrapped around and soldered, a flange-like part is provided on one end side of each lead terminal, and the flange-like part side of the lead terminal is inserted into the base so that the surface of the flange-like part is exposed. An electronic component characterized in that a lead wire from the electronic component body is wrapped and soldered around the root portion of the embedded lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10988889U JPH0348206U (en) | 1989-09-19 | 1989-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10988889U JPH0348206U (en) | 1989-09-19 | 1989-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348206U true JPH0348206U (en) | 1991-05-08 |
Family
ID=31658447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10988889U Pending JPH0348206U (en) | 1989-09-19 | 1989-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348206U (en) |
-
1989
- 1989-09-19 JP JP10988889U patent/JPH0348206U/ja active Pending