JPH0347000B2 - - Google Patents

Description

Detailed Description of the Invention (a) Field of Industrial Application The present invention relates to a mounting device that automatically mounts chip-shaped electronic components such as resistors, capacitors, and diodes onto a printed circuit board, and particularly relates to a mounting device that automatically mounts chip-shaped electronic components such as resistors, capacitors, diodes, etc. If the electronic component is within the size range, the electronic component is mounted as is, and if the electronic component exceeds the certain size, the printed circuit board is rotated by 1/2, that is, 180 degrees, and the mounting operation is performed.

(b) Conventional technology Electronic components such as resistors, capacitors, and diodes, which generally do not have lead wires, are becoming more and more chipped.
In electronic devices that use low-power electronic components,
In particular, receiver tuners, etc., mostly use chip-shaped electronic components, and mounting devices that automatically attach them to printed circuit boards have begun to be widely adopted.

Therefore, as an example, as shown in Japanese Utility Model Application No. 57-48672, adhesive is applied to the parts mounting position of the printed circuit board using a dispenser prior to the mounting process of chip-shaped electronic components, and then the printed circuit board is placed on an XY table. The electronic components taken out from the tape reel are suctioned and attached to a predetermined location on the board using a vacuum chuck.

In this case, if the size of the printed circuit board is within a certain range, the XY table is moved and the electronic components are sequentially mounted by rotating a rotary disk to which a vacuum chuck is attached.

(c) Problems to be Solved by the Invention In the above-described configuration, if the size of the printed circuit board increases, the movable range of the XY table must be increased, and the apparatus becomes large-scale.

Therefore, an object of the present invention is to make the device compact without making it large-scale.

(d) Means for Solving the Problems For this purpose, the present invention provides a mounting device for chip-shaped electronic components that automatically mounts chip-shaped electronic components at predetermined positions on a printed circuit board by sucking the chip-shaped electronic components using a suction means. A board table that can be rotated 180 degrees with the printed circuit board placed on it is placed on an XY table that moves horizontally to mount the electronic components on any position on the board, and the electronic components can be mounted on a large printed circuit board. When mounting the electronic component, the mounting area of the board is divided into two, and the electronic component is mounted on one of the areas, and then the board table is turned over and the electronic component is mounted on the other area.

(e) Effect When mounting a chip-shaped electronic component on a large printed circuit board using a suction means, the moving distance of the horizontally movable XY table may become large.

In this case, by dividing the mounting area of the board into two, first mounting the component on one area of the board on the board table without inverting the board table placed on the XY table by 180 degrees,
Then, flip it 180 degrees and attach it to the other area.

(F) Embodiments The present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a chip-shaped electronic component mounting device of the present invention, and FIG. 2 is an explanation of the operation of the same device shown in FIG. 1. 3 is a flowchart showing the working procedure of FIGS. 1 and 2, and FIG. 4 is a state showing the data contents stored in the memory to explain the same device of the present invention. Figure, Figure 5 A, B,
C shows a plan view of the main part for explaining the apparatus, and FIG. 6 shows a plan view of the main part for explaining the rotation of the substrate table in the apparatus.

In the drawing, 1 is a tape in which chip-shaped electronic components 2 are encapsulated at equal intervals, 3 is a tape reel around which the tape is wound, and 4 is a delivery unit that sends out the tape at a predetermined pitch. A tape feeding unit provided corresponding to each tape is placed on a component supply table 5 which is movable left and right.

Reference numeral 6 denotes a rotary plate equipped with a vacuum chuck 7 for taking out the electronic component from the tape delivery unit, adsorbing it and transporting it, and 8 a rotary plate for aligning the center of the electronic component with the center position of the vacuum chuck, and a printed circuit board 9.
a positioning table that rotates according to the mounting direction of the
The timing belt 12 is driven by the pulse motor 11.
13 is an XY table equipped with an X table 14 and a Y table 15, each of which moves in the horizontal direction; 16 is a drive unit that indexes and rotates the rotary disk into four parts;
Reference numeral 17 denotes a component supply table drive section, 18 a positioning table drive section, and 19 an index drive section for driving the drive unit 16. Reference numeral 20 indicates an XY table drive unit for driving each drive source of the XY table 13, 21 indicates a substrate table drive unit, 22 indicates a first interface, and 23 indicates a central information processing unit.
CPU, 24 is an address counter, 25 is a memory for storing data for NC (numerical control), 26 is a computer main body such as a personal computer, 2
7 is a second interface, and 28 is a start switch.

Next, to explain the operation of the present invention, the first
2, and 3, first the start switch 28 is turned on and the address counter 2 is turned on.
4 is cleared, and the address counter 24 is sequentially incremented.

Here, the component supply table 5 is moved, the tape delivery unit 4 indicated by the address counter 24 is moved to the suction position, and the chip-shaped electronic component 2 is taken out by the vacuum chuck 7.

Next, the rotary disk 6 is intermittently driven by the index drive section 19, and the positioning table 8 centers and positions the electronic component 2 adsorbed on the chuck 7, and rotates it by θ in accordance with the mounting angle. Substrate table 1 by intermittent drive
Position above 0.

Here, the substrate table 10 and the XY table 1
Control No. 3 will be explained. address counter 2
The CPU determines whether the Y data of the first step in the memory 25 indicated by 4 is greater than the distance in the Y-axis direction of the reference value.
23, and if it is small, the board table 1
If 0 is inverted, the substrate table 10 is returned to its original position, and the X table 14 and Y table 15 of the XY table 13 are moved to the data position indicated by the counter 24.

On the other hand, if it is larger than the reference value, if the substrate table 10 is not inverted, the substrate table 10 is inverted.

If we talk about the case where it is reversed,
Since the printed circuit board 9 is inverted, the position reference point 29 is also inverted, so the X and Y data x _o and _yo at the step indicated by the address counter 24 must be corrected.

The distance of this reference point 29 in the X and Y axis directions is |x _a
When |, |y _a |, the correction values |x′ _o |, |y′ _o | after inversion are as shown by the broken lines in FIG. 6 as follows.

|x′ _o |=|2x _a |−|x _o | |y′ _o |=|2y _a |−|y _o | Move the XY table 13 to the corrected position. In this case, if the substrate table 10 is turned over and returned many times during one cycle, time will be wasted and loss will occur, so the NC data stored in the memory 25 in advance can be used to mount the board without turning it over. The computer main body 26 automatically rearranges the items so as to give priority to the items.

Next, the rotary disk 6 is driven to adhere the electronic component 9 to a predetermined position on the printed circuit board 9. It is determined whether or not there is an E (end mark) in the data indicated by the address counter 24, and if there is not, the process returns to the step of incrementing the address counter 24 described above. On the other hand, if there is an E mark and the substrate table 10 is in an inverted state, it is returned to its original position and the work of one process is completed. The X and Y data are as shown in FIG.
X ₁ , X ₂ , . . . , Y ₁ , Y ₂ . . . correspond to numbers R ₁ , R ₂ .

FIG. 5 shows an example in which the device of the present invention is used depending on the size of the printed circuit board, and A is the reference line 30.
In this case, for example, after the printed circuit board 9 has finished mounting the electronic components above the reference line 30, the board table 10 is turned over and the electronic components below the reference line 30 are mounted. An example of mounting is shown in FIG. 2B, in which electronic components are mounted on the lower part (cross-hatched part) beyond the reference line 30, after the board table 10 is reversed, as in the case of A above.

In the example shown in FIG. 3C, the electronic components 2 are mounted on the printed circuit board 9 until the end without inverting the board table 10.

(g) Effects of the Invention As described above, the present invention allows the movable range of the XY table for mounting electronic components to be smaller than that of the conventional method even when using a large-sized printed circuit board.
The XY table can be mounted on twice the area within the same movable range, making the device more compact.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a device for mounting chip-shaped electronic components according to the present invention, FIG. 2 is a block diagram for explaining the device, FIG. 3 is a flowchart for explaining the device, and FIG. The figure is a state diagram showing the data contents in the memory in the same device, FIG. 5 is a plan view of the main part for explaining the same device, and FIG. 6 is the main part for explaining the rotation of the substrate table in the same device. A plan view is shown. 2...Electronic parts, 3...Tape reel, 4...
Sending unit, 5...Component supply table, 6...Rotary disk, 7...Vacuum chuck, 9...Printed circuit board,
10...Substrate table.

Claims (1)

[Claims] 1. In a chip-shaped electronic component mounting device that automatically mounts a chip-shaped electronic component at a predetermined position on a printed circuit board by suctioning the chip-shaped electronic component using a suction means, the electronic component is mounted in a horizontal direction at an arbitrary position on the printed circuit board. A board table that can be rotated 180 degrees with the printed circuit board placed on it is placed on a moving XY table, and when mounting the electronic components on a large printed circuit board, the mounting area of the board is 1. A mounting device for chip-shaped electronic components, characterized in that the chip-shaped electronic components are mounted on one of the two areas, and then the board table is reversed and the chip-shaped electronic components are mounted on the other area.