JP2604167B2 - Component mounting method and component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Industrial application field The present invention sequentially takes out electronic components from a component supply unit,
The present invention relates to a component mounting method and a component mounting apparatus for repeatedly mounting the component on a multi-panel board mounted on a moving XY table.

(B) Conventional technology A conventional component mounting method for repeatedly mounting components on a multi-surface substrate is, for example, a mounting method of a six-surface substrate having the same pattern as shown in FIG. When different components are mounted in a mixed manner, they are mounted in ascending order of components in the order shown in the drawings. The above operation was repeated five times to complete the component mounting process of the six-chamfered substrate.

The program for designating the mounting position shown in FIG. 5 will be described below.

The control command “P” indicates the presence or absence of a repetitive pattern, and steps M _{1 to} M ₃ with “P” are data indicating the mounting position of the first pattern.

Steps M _{4 to} M ₉ from “P” to “E” command are first.
Offset value of the pattern position with respect to the pattern of
M ₄ indicates that chamfering is six up ~M _9, when mounted in the mounting coordinates (x ₁ + x ₂ of the second pattern shown in M _5, y ₁ +
_{0), (x 2 + x} 1, y 2 +0), will be mounted with the _{(x 3 + x 1, y} 3 +0).

The "E" command is a command indicating the end of the program.

(C) Problems to be solved by the invention Therefore, in a multi-panel board, most of the previously mounted pattern is moved at high speed by the XY table when small components are mounted on the next pattern. There was a drawback that displacement occurred.

(D) Means for Solving the Problems For this reason, the present invention provides a plurality of components having different sizes on a multi-panel board mounted on an XY table which sequentially takes out electronic components from a component supply unit and moves horizontally. And mounting the components so as to form the same pattern, wherein at least one group is divided into an arbitrary group consisting of a plurality of types of components according to the size, The operation of sequentially mounting components in the same pattern for each group in the order of small groups is sequentially repeated on all patterns, and the moving speed of the XY table at the time of mounting components is slowed down as the size of the component becomes larger. Is what you do.

The present invention also provides a component mounting method for sequentially taking out electronic components from a component supply unit and mounting them so that a plurality of the same patterns in which a plurality of types of components are mixed are formed on a multi-plane board mounted on an XY table that moves horizontally. In the apparatus, an identical pattern storage unit that stores NC data indicating a component mounting position for each step to form the same pattern, and a pattern position storage unit that stores at which position on the substrate the pattern is formed. , Stored in the same pattern storage unit.
A division data storage unit that stores division data for dividing the steps of the NC data into an arbitrary plurality of groups; and a movement speed storage unit that stores the movement speed of the XY table for each group divided by the division data. While moving the XY table at the speed of the group stored in the moving speed storage unit to the position where each pattern stored in the pattern position storage unit is to be formed, the component mounting in the group divided by the classification data is sequentially performed. A control unit is provided for controlling the repetitive operation to be repeated in the order of groups in the NC data stored in the same pattern storage unit.

(E) Operation According to the above-described configuration, when a plurality of types of components having different sizes are mixedly mounted on each pattern of the multi-surface board, at least one group of the plurality of types of components is formed according to the size. Divide into arbitrary groups consisting of a plurality of types of components, repeat the operation of sequentially mounting components in the same pattern for each group in the order of smaller size, sequentially on all patterns, and the XY table at the time of component mounting The electronic component (2) is mounted on the multiple substrate without displacement by lowering the moving speed of the component as the group of the components becomes larger.

Further, according to the above-described configuration, the control unit sequentially stores the component mounting in the group of the steps of the NC data, which is arbitrarily divided by the division data, in the moving speed storage unit to the position where each pattern stored in the pattern position storage unit is to be formed. Control is performed such that the operation of repeating the XY table while moving at the speed of the stored group is repeated in the order of the groups in the NC data stored in the same pattern storage unit.

(F) Embodiment One embodiment of the present invention will be described below in detail with reference to FIGS.

(1) is a tape reel. A tape (3) in which chip-shaped electronic components (2) are sealed at equal intervals is wound around the tape reel (1). In this embodiment, three types of electronic components having a small component (2A), a medium component (2B), and a large component (2C) are used.

Reference numeral (4) denotes a component supply table movable to the left and right. The component supply table (4) has a plurality of the tapes (3) and a tape sending unit (5) provided corresponding to each tape (3).
Is placed.

The rotary disk (6) is provided with a plurality of vacuum chucks (7) that take out the component (2) from the tape delivery unit (5), adsorb and transport the component (2).

(8) is a positioning table, and the positioning table (8) is rotated in accordance with the mounting direction of the multiple substrate (9), with the center of the component (2) aligned with the center position of the vacuum chuck (7). I do.

(10) is an XY table, which has an X table (11) and a Y table (12) that move in the horizontal direction.

(13) is a transmission shaft for rotating the turntable (6), (1)
4) is a component supply drive unit for driving the component supply table (4), (1)
Reference numeral 5) denotes an index driving unit for intermittently rotating the rotary disk (6). (16) is the positioning table drive unit, (17) is
The XY table driving section moves the XY table (10) by a predetermined amount. (18) is the first interface, (19) is a CPU for central processing, (20) is an address counter, (21)
Is a memory for storing data for NC (Numerical control), (22)
Indicates a personal computer main body, (23) indicates a second interface, and (24) indicates a start switch.

Hereinafter, the operation of the present invention will be described in detail with reference to the drawings.

As shown in FIGS. 1 to 4, first, the start switch (2
4) is turned on, the address counter (20) is cleared, and the address counter (20) is sequentially incremented.

Here, the component supply table (4) moves, the tape feeding unit (5) indicated by the address counter (20) moves to the suction position, and the chip-like electronic component (2) is taken out by the vacuum chuck (7).

Next, the turntable (6) is driven, and the component (2) is moved toward the positioning table (8). The component (2) positioned by the positioning table (8) is mounted at a predetermined position on the multi-panel board (9) placed on the XY table (10) in the order shown in FIG. At this time, small parts (2A), medium parts (2B), large parts (2
Among the three types of electronic components, C), small components (2A) and medium components (2
B) is regarded as one group, and the parts of the large parts (2C) are distinguished as other groups, and the groups are sequentially mounted on all the patterns in the order of smaller groups. Here, the large component (2C) includes a component having a high center of gravity such as a cylindrical electrolytic capacitor.

In the memory (21), the moving speed of the XY table (10) is set to be high when components of a small group are mounted, and the moving speed is reduced when the components of a large group are mounted. Based on the stored data on the moving speed, the CPU (19) can interface (18)
Command to the XY table drive unit (17) via.

In the present embodiment, three types of component sizes and two mounting speeds are used. However, the present invention is not limited to this. Four or more types of component sizes and three or more mounting speeds are used. You may do it.

Hereinafter, a program for designating a mounting position according to the present invention shown in FIG. 3 will be described.

The control command “H” indicates that components of different sizes are mixed, and “” indicates the start of an offset between patterns.

The steps before the “Q” command indicate the mounting position of the first pattern.

In "H" command later before the Q command, i.e. in this case was put off H later repeatedly showed a large group component size of M ₃ only the size of different kinds of components mixed mounting, yet XY The table (10) is controlled to move at a low speed.

As described above, according to the embodiment of the present invention, when a plurality of types of components having different sizes are mixed and mounted, the moving speed of the XY table can be increased, that is, components of a small group of components. By performing component mounting from the beginning and providing a function of speeding down step by step, high-speed and highly reliable component mounting can be performed.

In addition, the setting of the control command of the program can be used in common with the conventional type, which greatly contributes to the mounting method.

(G) Effects of the Invention As described above, the present invention provides a method for mounting a plurality of types of components having different sizes in a mixed manner on each pattern of a multi-surface board by a component mounting apparatus. After repeatedly mounting the parts on the pattern by moving the XY table at a high speed, and then mounting the parts of the next large group of parts at the same time by moving the XY table at a low speed, the parts having the large size are repeated. Compared to mounting the next smaller component, the component can be mounted at a higher speed without positional displacement.
Each time one component is mounted, the pattern is changed, and compared to the case where components taken out from the same component supply unit are mounted,
The pattern is large, the distance between the mounting positions of the same component for each pattern is long, and the movement time of the component supply unit is shorter than the time that the XY table moves, or a pad mark that prohibits component mounting on the pattern. There is a case where the XY table has to move greatly after jumping over this pattern, and the moving time of the parts supply unit is shorter or shorter.
If there is more than one component type that can move at the same speed in the pattern, the multiple components are mounted consecutively in the same pattern, so the XY table requires less time to move and the XY table moves. Components can be mounted without loss of productivity due to time.

Also, when the control unit stores data indicating the presence of the division in the division presence / absence data storage unit, the component mounting in the step group of the NC data divided by the division data is stored in the pattern position storage unit. The operation of repeating the operation while moving the XY table at the speed of the group sequentially stored in the moving speed storage unit to the position where each pattern is to be formed is repeated in the order of the group in the NC data stored in the same pattern storage unit. In order to make the same pattern by mounting the board on each pattern of the multi-panel board and mixing multiple types of parts with different sizes to make the same pattern, for each group with different speed The operation of mounting components of the same speed in the same pattern is repeated on all patterns, and this operation is performed sequentially from a group of components with the highest speed. In order to realize that, it is not necessary to fill in all the steps of mounting components on the multi-panel board of NC data, that is, it is not necessary to develop data at all mounting points, making it easy to create NC data it can.

In addition, since the groups of the same pattern can be arbitrarily divided by the division data, the optimum grouping can be performed with good flexibility for each type of substrate.

[Brief description of the drawings]

FIG. 1 is a view showing a component mounting apparatus to which the method of the present invention is applied,
FIG. 2 is a block diagram for explaining the device, FIG. 3 is a diagram showing a program for designating a mounting position in the device,
FIG. 4 is a view showing the order in which a plurality of types of components having different sizes are mounted on a six-chamfered board (9) having the same pattern in the same apparatus. FIGS. 5 and 6 are conventional examples, and FIG. FIG. 6 is a diagram showing a conventional program for designating a mounting position, and FIG. 6 is a diagram showing an order of mounting a plurality of types of components having different sizes on a conventional six-chamfered board (9). (10) XY table, (18) Interface,
(19) CPU.

Claims (2)

(57) [Claims] An electronic component is sequentially taken out from a component supply unit, and a plurality of types of components having different sizes are mixedly mounted on a multi-panel board mounted on an XY table that moves horizontally and mounted in the same pattern. In the component mounting method, at least one group of the plurality of types of components is divided into an arbitrary group including a plurality of types of components according to a size, and the groups are arranged in the same pattern for each group in ascending order of size. A component mounting method, wherein an operation of sequentially mounting components is repeatedly performed sequentially on all patterns, and a moving speed of the XY table at the time of mounting components is reduced as the group of components becomes larger. 2. A component mounting method in which electronic components are sequentially taken out from a component supply unit and mounted on a multi-panel board mounted on an XY table which is horizontally moved so that a plurality of the same patterns in which a plurality of types of components are mixed are formed. In the apparatus, an NC indicating a component mounting position for each step to form the same pattern
A same pattern storage unit for storing data, a pattern position storage unit for storing where the pattern is formed on the substrate, and a plurality of groups of NC data stored in the same pattern storage unit. A divided data storage unit that stores divided data for dividing the data into XY data for each of the groups divided by the divided data.
A moving speed storage unit for storing the moving speed of the table, and the component mounting in the group divided by the classification data are sequentially stored in the moving speed storage unit at positions where the respective patterns stored in the pattern position storage unit are to be formed. And a control unit for controlling an operation of repeating the operation of moving the XY table at the speed of the group in the order of the group in the NC data stored in the same pattern storage unit. apparatus.