JPH01103709A - Electronic parts setting device - Google Patents

Electronic parts setting device

Info

Publication number
JPH01103709A
JPH01103709A JP62262247A JP26224787A JPH01103709A JP H01103709 A JPH01103709 A JP H01103709A JP 62262247 A JP62262247 A JP 62262247A JP 26224787 A JP26224787 A JP 26224787A JP H01103709 A JPH01103709 A JP H01103709A
Authority
JP
Japan
Prior art keywords
pattern
mounting
board
parts
data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62262247A
Other languages
Japanese (ja)
Other versions
JPH0774969B2 (en
Inventor
Toshikatsu Okumura
利勝 奥村
Atsushi Kura
倉　惇
Yoshio Tanabe
田辺　芳男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP62262247A priority Critical patent/JPH0774969B2/en
Priority to US07/257,959 priority patent/US4914808A/en
Priority to KR1019880013514A priority patent/KR910002054B1/en
Priority to EP88117236A priority patent/EP0312116B1/en
Priority to DE88117236T priority patent/DE3880065T2/en
Publication of JPH01103709A publication Critical patent/JPH01103709A/en
Publication of JPH0774969B2 publication Critical patent/JPH0774969B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Numerical Control (AREA)

Abstract

PURPOSE:To efficiently set parts by changing the parts setting order in each pattern in accordance with pattern layout at the time of setting parts of plural equal patterns on one substrate. CONSTITUTION:After all flags are reset, an offset counter is set to zero. Thereafter, a step counter is set to zero and a backward sequence flag is cleared when a first offset command indicates the forward sequence. When it indicates the backward sequence, the step counter is set to the value obtained by adding one to the number of steps of mount data and the backward sequence flag is set. In case of the forward sequence, the step counter is counted up one by one to set parts of corresponding mount data to prescribed positions. In case of the backward sequence, the step counter is counted down one by one to set parts of corresponding mount data to prescribed positions.

Description

【発明の詳細な説明】 イ）産業上の利用分野 本発明は電子部品の装着装置に関する。[Detailed description of the invention] b) Industrial application field The present invention relates to an electronic component mounting device.

口）従来の技術 プリント基板上への重子部品装着における自動化が近年
進みつつあり、これに関する自動装着装置も種々開発さ
れている。例えば特開昭６０−１２７９９号のようにロ
ータリー式インデックステーブル周辺に吸着ノズルを多
数設け、所定吸着位置で部品を吸着するとともに、この
インデックステーブルを間欠回転して、基板との部品装
着位置まで運搬し、基板が載置σれているＸＹ子テーブ
ル移動させることで所望の基板位置に部品を載置するも
のが示きれている。こうした装着装置において、その動
作は通常プログラム制御されているが一枚基板上に同一
パターンで複数パターン繰り返して電子部品の装着を行
うときは、同一装着動作を繰り返すようにしていた。(2) Conventional technology Automation of mounting heavy components onto printed circuit boards has been progressing in recent years, and various automatic mounting devices related to this have been developed. For example, as in Japanese Patent Application Laid-Open No. 60-12799, a large number of suction nozzles are installed around a rotary index table, and parts are suctioned at predetermined suction positions, and the index table is intermittently rotated to transport the parts to the position where they are mounted on the board. However, a method is shown in which a component is placed on a desired board position by moving the XY child table on which the board is placed. In such a mounting device, the operation thereof is usually program-controlled, but when electronic components are mounted in a plurality of identical patterns onto a single board, the same mounting operation is repeated.

ハ）発明が解決しようとする問題点 然し乍ら、このような装着装置においては、一つの基板
上に形成される複数の同一装着パターンの内、あるパタ
ーンの最後の部品装着位置と、次の装着パターンの最初
の部品装着位置が大きく離れ、ＸＹテーブル移動に時間
を要すると云う問題があった。c) Problems to be solved by the invention However, in such a mounting device, among a plurality of identical mounting patterns formed on one substrate, the last component mounting position of a certain pattern and the next mounting pattern There was a problem in that the initial parts mounting positions were far apart and it took time to move the XY table.

二）　問題点を解決するための手段 本発明はこのような点に鑑みて為されたものであって、
所定の装着パターンのＮＣデータを記憶するパターン記
憶部と、上記装着パターンを基板のどの位置に形成する
かを記憶するパターン位置記憶部と、このパターン位置
記憶部と対応して設けられ、上記装着パターンにおける
部品の装着順序を指定する順序指定部と、電子部品を基
板上の所定位置へ運搬する運搬機構と、この運搬機構を
制御してパターン位置記憶部に記憶された基板位置に上
記順序指定部で指定された順序で上記パターン記憶部の
装着パターンに応じた電子部品の装着を行わしめる制御
手段と、を有している。2) Means for solving the problems The present invention has been made in view of the above points,
A pattern storage section that stores NC data of a predetermined mounting pattern, a pattern position storage section that stores where on the board the mounting pattern is formed, and a pattern position storage section that is provided corresponding to the pattern position storage section, an order specifying section for specifying the mounting order of components in the pattern; a transport mechanism for transporting the electronic components to a predetermined position on the board; and a transport mechanism for controlling the transport mechanism to specify the order in the board position stored in the pattern position storage section. and control means for mounting electronic components according to the mounting pattern in the pattern storage section in the order specified by the pattern storage section.

ホ）　作用 パターンの配置状態に応じて、各パターンにおける部品
装着順序を変えて部品装着の効率化を図ることが出来る
。e) It is possible to improve the efficiency of component mounting by changing the order of component mounting in each pattern depending on the arrangement of the action patterns.

へ）　実施例 第２図は、本発明電子部品の装着装置を示す要部斜視図
であって、（２＞’（２＞・・・はチップ状電子部品（
１）（１）・・・が収納された電子部品収納帯（テープ
）であり、各々テープリール（３）（３）・・・に巻回
されている。（４）（４）・・・はこれ等テープリール
（ａ）（ａ）・・・から電子部品収納帯（２）（２）・
・・を送出する送出ユニットである。（１１）はこれ等
のテープリール（３）（３）・・・及び送出ユニット（
４）（４）・・・が配設きれたテープ移動台、（Ｔ）は
間欠回転可能なターンテーブル、（５）（５）・・・は
このターンテーブル（Ｔ）外周部に設けられた吸着ノズ
ルを示し、上記テープ移動台（１１）の移動状態に応じ
て選択された電子部品収納帯（２）から電子部品（５）
を吸着しターンテーブル（Ｔ）の回転により運搬する。Embodiment 2 is a perspective view of the main parts of the electronic component mounting apparatus of the present invention, in which (2>'(2>... is a chip-shaped electronic component (
1) (1) . . . are electronic component storage bands (tapes) in which the electronic components are stored, and are wound around tape reels (3) (3) . . . . (4) (4)... are these tape reels (a) (a)... to electronic parts storage belt (2) (2).
This is a sending unit that sends out... (11) indicates these tape reels (3) (3)... and the sending unit (
4) (4)... is installed on the tape moving table, (T) is a turntable that can be rotated intermittently, and (5) (5)... is provided on the outer periphery of this turntable (T). It shows a suction nozzle and picks up electronic components (5) from the electronic component storage belt (2) selected according to the moving state of the tape moving table (11).
is attracted and transported by the rotation of the turntable (T).

（６）は上記吸着ノズル（５）で吸着された部品（１）
のＸＹ丈方向ずれ及び回転角の補正を行う位置決め装置
、（９）はプリント基板（１０）が配置されるＸＹ子テ
ーブル示し、パルスモータ（７）及び（８）により水平
方向移動が自在に行われる。即ち、吸着された電子部品
（１）は、ターンテーブル（Ｔ）の間欠回転により位置
決め装置（６）で吸着状態の補正が行われた後、ＸＹ子
テーブル９）上に運搬されて、乙のＸＹ子テーブル９）
上のプリント基板（１０）上へ搭載きれる。そして基板
（１０）上へ搭載する搭載位置の調整はＸＹ子テーブル
９）の水平移動で行われる。(6) is the part (1) that was sucked by the suction nozzle (5) above.
A positioning device that corrects deviations in the XY length direction and rotation angle of the board, (9) indicates an XY child table on which the printed circuit board (10) is placed, and can be freely moved in the horizontal direction by pulse motors (7) and (8). be exposed. That is, the suctioned electronic component (1) is corrected in the suction state by the positioning device (6) by intermittent rotation of the turntable (T), and then transported onto the XY child table 9) and placed on the XY child table 9)
It can be mounted onto the upper printed circuit board (10). The mounting position on the substrate (10) is adjusted by horizontally moving the XY child table 9).

第１図は、こうした電子部品装着装置の制御部を示すブ
ロック図であって、（１２）はテープ移動台（１１）の
移動や送出ユニット（４）（４）・・・の送出駆動を行
う部品供給駆動部、（１３）は上記ＸＹ子テーブル９）
のパルスモータ（７）（８）を駆動するＸＹテーブル駆
動部、（１４）は上記位置決め装置（６〉を駆動する位
置決め駆動部、（１５）は上記ターンテーブル（Ｔ）の
間欠回転動作や吸着ノズル（５）（５）・・・の吸着動
作を制御するノズル駆動部、（１６〉はＸＹ子テーブル
９）上へのプリント基板の設定及び排出を行う基板搬送
部、（１７）はバソフンやキーボード等との接続を行う
外部ターミナルであって、これ等部品供給駆動部（１２
）乃至外部ターミナル（１７）は中央処理装置（以下、
ＣＰＵと称ずバ１８）により制御される。（１９）は上
記ＣＰ　Ｕ（１８）に結ばれたメモリ部を示し、第３図
のように装着番号、部品装着位置のＸＹ座標、部品の方
向、部品種類等の部品装着情報として与えられるマウン
トデータと、このパターンを形成するプリント基板上の
位置、方向及び該パターンの部品装着シーケンスを示す
オフセットデータと、から成るＮＣデータが記憶されて
いる。尚、ここでＦはマウントデータの終了及び繰り返
しパターンを、Ｐは類シーケンスを、Ｑは逆シーケンス
を、Ｅは全てのデータの終了を示す。また、このメモリ
部（１９）にはマウントデータの指示アドレスを示すス
テップカウンタ、及びオフセットデータの指示アドレス
を示すオフセットカウンタ、逆シーケンスフラグを立て
る逆シーケンスフラグ領域及びエンドフラグを立てるエ
ンドフラグ領域が設けられている。FIG. 1 is a block diagram showing the control section of such an electronic component mounting apparatus, in which (12) moves the tape moving table (11) and drives the sending units (4), (4), etc. Component supply drive unit, (13) is the above XY child table 9)
(14) is a positioning drive unit that drives the above-mentioned positioning device (6), (15) is an XY table drive unit that drives the pulse motors (7) and (8), and (15) controls the intermittent rotational operation and suction of the turntable (T). A nozzle drive unit that controls the suction operation of the nozzles (5), (16) a board transfer unit that sets and discharges printed circuit boards onto the XY child table 9, and (17) a bath fan and It is an external terminal for connecting with a keyboard, etc., and is connected to a component supply drive unit (12
) to the external terminal (17) are central processing units (hereinafter referred to as
It is controlled by a CPU 18). (19) indicates a memory unit connected to the CPU (18), and as shown in FIG. NC data is stored, which is composed of data and offset data indicating the position and direction on the printed circuit board forming this pattern and the component mounting sequence of the pattern. Here, F indicates the end and repeat pattern of the mount data, P indicates the similar sequence, Q indicates the reverse sequence, and E indicates the end of all data. The memory unit (19) is also provided with a step counter that indicates the specified address of mount data, an offset counter that indicates the specified address of offset data, a reverse sequence flag area for setting a reverse sequence flag, and an end flag area for setting an end flag. It is being

次に、このような電子部品の装着装置において第４図の
流れ因を参照しながら、その動作を説明する。まず、全
てのフラグをリセットした後、オフセットカウンタを０
にする。その後、最初のオフセットコマンドがＰ（類シ
ーケンス）かどうかを判定し、類シーケンスなら、ステ
ップカウンタを０にして逆シーケンスフラグをクリアす
るとともに、逆シーケンスであればステップカウンタを
マウントデータのステップ数に１を加えた値に設定して
逆シーケンスフラグをセットする。そして、類シーケン
スのときはステップカウンタを１つずつアップさせなが
ら対応するマウントデータの部品を所定の位置に装着し
て行く。他方、逆シークンスのときはステップカウンタ
を１つずつダウン許せながら対応するマウントデータの
部品を所定の位置に装着していく。Next, the operation of such an electronic component mounting apparatus will be explained with reference to the flow factors shown in FIG. First, after resetting all flags, set the offset counter to 0.
Make it. After that, determine whether the first offset command is P (class sequence), and if it is a class sequence, set the step counter to 0 and clear the reverse sequence flag, and if it is a reverse sequence, set the step counter to the number of steps in the mount data. Add 1 and set the reverse sequence flag. Then, in the case of a similar sequence, the parts of the corresponding mount data are mounted at predetermined positions while incrementing the step counter one by one. On the other hand, in the case of reverse sequence, parts with corresponding mount data are mounted at predetermined positions while allowing the step counter to go down one by one.

尚、１つずつの部品装着はオフセットカウンタで指示さ
れるオフセットデータのＸＹＪ！Ｉ！標位置及びθ回転
方向を基準として、ステップカウンタで指示きれるマウ
ントデータの装着位置データで表わせれるＸＹ座標位置
及び装着方向データで表わされるθ回転方向に部品デー
タで表わ許れる部品を装着する動作が行われる。即ち、
部品データに応じて移動台〈１１）を移動させて吸着ノ
ズル（５）に部品（１）を選択吸着せしめ、装着方向デ
ータに応じて、上記位置決め装置（６）で部品（１）の
位置決めとともに方向設定を行い、装着位置データに応
じて、上記ＸＹ子テーブル９）を動作させてプリント基
板（１０）の部品装着位置を吸着ノズル（５）直下に移
動させ部品の装着を行う。In addition, the installation of each component is performed using the offset data XYJ! specified by the offset counter. I! An operation to mount a part that is allowed as represented by part data in the θ rotation direction represented by the XY coordinate position and mounting direction data, which are represented by the mounting position data of the mount data that can be specified by the step counter, with reference to the target position and θ rotation direction. will be held. That is,
According to the component data, the moving table (11) is moved to selectively adsorb the component (1) to the suction nozzle (5), and the positioning device (6) positions the component (1) according to the mounting direction data. The direction is set, and the XY child table 9) is operated according to the mounting position data to move the component mounting position of the printed circuit board (10) directly below the suction nozzle (5) to mount the component.

こうして、１パタ一ン分の装着が終了すると、次のオフ
セットコマンドの内容を見て上述と同様に類シーケンス
であればステップカウントをカウントアツプしながら順
次部品装着を行い、逆シーケンスであればステップカウ
ンタをカウントダウンしながら順次部品の装着を行う。In this way, when the mounting for one pattern is completed, the contents of the next offset command are checked and parts are mounted sequentially while counting up the step count if it is a similar sequence as described above, and if it is a reverse sequence, the parts are mounted sequentially. Parts are installed one by one while counting down the counter.

こうした装着動作が繰り返きれて最後の部品装着パター
ンを終了すると終了コマンド（Ｅ）を検出してマウント
動作を終了する。When this mounting operation is repeated and the last component mounting pattern is completed, an end command (E) is detected and the mounting operation is ended.

このような装着装置で例えば基板上に第５図のように同
一装着パターンで類シーケンスで電子部品のマウントを
２パターン分行う場合はＮＣデータは第６図のようにな
る。また、基板上に第７図のように同一装着パターンで
類シーケンス、逆シーケンスの２パタ一ン電子部品のマ
ウントを行う場合はＮＣデータは第８図のようになる。When using such a mounting apparatus to mount two electronic components on a board in the same mounting pattern in a similar sequence as shown in FIG. 5, for example, the NC data will be as shown in FIG. 6. Further, when electronic components are mounted on a board in two patterns in the same mounting pattern in a similar sequence and in a reverse sequence as shown in FIG. 7, the NC data becomes as shown in FIG.

さらに、第９図に示すように同一装着パターンで順ンー
ケンス、類シーケンス、類シーケンス、逆シーケンスの
４パターンの電子部品のマウントを行う場合、ＮＣデー
タは第１０図のようになる。Furthermore, when electronic components are mounted in four patterns of forward sequence, similar sequence, similar sequence, and reverse sequence using the same mounting pattern as shown in FIG. 9, the NC data becomes as shown in FIG.

これ以外に、例えば第１１図のように複数の同一装着パ
ターンの内いくつかを向きを変えて印刷する場合、第１
２図のように該当するオフセットデータの方向データＯ
を所望の角度に設定することで所定の傾きを与えること
が出来る。In addition, when printing some of the same mounting patterns in different orientations as shown in FIG. 11, for example, the first
Direction data O of the corresponding offset data as shown in Figure 2
A predetermined inclination can be given by setting to a desired angle.

尚、上述したＮＣデータの書き換えは、外部ターミナル
に接続したキーボード（図示せず）やパーソナルコンピ
ュータ等で行なわれる。Incidentally, the above-mentioned rewriting of the NC data is performed using a keyboard (not shown) or a personal computer connected to an external terminal.

（ト〉　発明の効果 以上述べた如く本発明電子部品の装着装置は所定の装着
パターンのＮＣデータを記憶するパターン記憶部と、上
記装着パターンを基板のどの位置に形成するかを記憶す
るパターン位置記憶部と、このパターン位置記憶部と対
応して設けられ、上記装着パターンにおける部品の装着
順序を指定する順序指定部と、電子部品を基板上の所定
位置へ運搬する運搬機構と、この運搬機構を制御してパ
ターン位置記憶部に記憶きれた基板位置に上記順序指定
部で指定された順序で上記パターン記憶部の装着パター
ンに応じた電子部品の装着を行わしめる制御手段と、を
有していいるので、一つの基板上に同一パターンで複数
パターンの部品装着を行う場合、パターンの配置状態に
応じて、各パターンにおける部品装着順序を変えて部品
装着の効率化を図ることが出来る。(G) Effects of the Invention As described above, the electronic component mounting apparatus of the present invention includes a pattern storage unit that stores NC data of a predetermined mounting pattern, and a pattern position that stores where on the board the mounting pattern is to be formed. a storage section, an order specifying section provided corresponding to the pattern position storage section and specifying the mounting order of the components in the mounting pattern, a transport mechanism for transporting the electronic components to a predetermined position on the board, and the transport mechanism. control means for mounting electronic components in accordance with the mounting pattern in the pattern storage section in the order specified by the order designation section at the board positions completely stored in the pattern position storage section. Therefore, when mounting components in a plurality of patterns using the same pattern on one board, it is possible to improve the efficiency of component mounting by changing the order of mounting components in each pattern according to the arrangement state of the patterns.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明電子部品の装着装置の制御部のブロック
図、第２図は本発明電子部品の装着装置の要部斜視図、
第３図はＮＣデータの設定状態を示す状態模式図、第４
図は本発明の動作を示す流れ図、第５図、第７図、第９
図、第１１図は基板上への部品の装着状態及び装着順序
例を示す模式図、第６図、第８図、第１０図、第１２図
はＮＣデー夕の設定例を示す模式図である。 （１）（１）・・・電子部品、（２）（２）・・・電子
部品収納帯、（３）（３）・・・テープリール、（４）
（４）・・・送出ユニット、（５）（５）・・・吸着ノ
ズル、（６）・・・位置決め装置、（７）（８）・・・
パルスモータ、（９）・・・ＸＹテーブル、（１０）・
・・プリント基板、（１１）・・・テープ移動台、（１
２）・・・部品供給駆動部、（１３〉・・・ＸＹテーブ
ル駆動部、（１４）・・・位置決め駆動部、（１５）・
・・ノズル駆動部、（１６）・・・基板搬送部、（１７
）・・・外部ターミナル、（１８）・・・中央処理装置
、（１９）・・・メモリ部、（Ｔ）・・・ターンテーブ
ル。FIG. 1 is a block diagram of the control unit of the electronic component mounting apparatus of the present invention, and FIG. 2 is a perspective view of the main parts of the electronic component mounting apparatus of the present invention.
Figure 3 is a state schematic diagram showing the setting state of NC data;
The figures are flowcharts showing the operation of the present invention, Figures 5, 7, and 9.
Fig. 11 is a schematic diagram showing an example of the mounting state and mounting order of parts on a board, and Figs. 6, 8, 10, and 12 are schematic diagrams showing an example of setting the NC data. be. (1)(1)...Electronic parts, (2)(2)...Electronic parts storage band, (3)(3)...Tape reel, (4)
(4)... Sending unit, (5) (5)... Adsorption nozzle, (6)... Positioning device, (7) (8)...
Pulse motor, (9)...XY table, (10)...
... Printed circuit board, (11) ... Tape moving stand, (1
2)...Component supply drive unit, (13>...XY table drive unit, (14)...Positioning drive unit, (15)...
... Nozzle drive section, (16) ... Substrate transport section, (17
)...External terminal, (18)...Central processing unit, (19)...Memory section, (T)...Turntable.

Claims (1)

【特許請求の範囲】[Claims] １）複数の同一パターンで一枚の基板上に電子部品を装
着する電子部品の装着装置において、上記所定の装着パ
ターンのＮＣデータを記憶するパターン記憶部と、上記
装着パターンを基板のどの位置に形成するかを記憶する
パターン位置記憶部と、このパターン位置記憶部と対応
して設けられ、上記装着パターンにおける部品の装着順
序を指定する順序指定部と、電子部品を基板上の所定位
置へ運搬する運搬機構と、この運搬機構を制御してパタ
ーン位置記憶部に記憶された基板位置に上記順序指定部
で指定された順序で上記パターン記憶部の装着パターン
に応じた電子部品の装着を行わしめる制御手段と、を有
して成る電子部品の装着装置。1) In an electronic component mounting apparatus that mounts electronic components on a single board using a plurality of identical patterns, a pattern storage unit that stores NC data of the predetermined mounting pattern, and a position on the board to place the mounting pattern. a pattern position storage section for storing information on whether to form electronic components; an order specifying section provided corresponding to the pattern position storage section for specifying the mounting order of the components in the mounting pattern; and transporting the electronic components to a predetermined position on the board. a transport mechanism for controlling the transport mechanism to mount electronic components in accordance with the mounting pattern in the pattern storage unit in the order specified in the order designation unit at the board positions stored in the pattern position storage unit; An electronic component mounting device comprising: a control means;
JP62262247A 1987-10-16 1987-10-16 Electronic component mounting device Expired - Fee Related JPH0774969B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62262247A JPH0774969B2 (en) 1987-10-16 1987-10-16 Electronic component mounting device
US07/257,959 US4914808A (en) 1987-10-16 1988-10-14 Automatic electronic parts mounting apparatus for repeatedly mounting in forward and reverse sequences
KR1019880013514A KR910002054B1 (en) 1987-10-16 1988-10-16 Installing device of electromagnetic appliance
EP88117236A EP0312116B1 (en) 1987-10-16 1988-10-17 Automatic electronic parts mounting apparatus
DE88117236T DE3880065T2 (en) 1987-10-16 1988-10-17 Automatic assembly device for electronic components.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62262247A JPH0774969B2 (en) 1987-10-16 1987-10-16 Electronic component mounting device

Publications (2)

Publication Number Publication Date
JPH01103709A true JPH01103709A (en) 1989-04-20
JPH0774969B2 JPH0774969B2 (en) 1995-08-09

Family

ID=17373121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62262247A Expired - Fee Related JPH0774969B2 (en) 1987-10-16 1987-10-16 Electronic component mounting device

Country Status (2)

Country Link
JP (1) JPH0774969B2 (en)
KR (1) KR910002054B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0434999A (en) * 1990-05-30 1992-02-05 Okuma Mach Works Ltd Electronic component installing device
WO2001024598A1 (en) * 1999-09-27 2001-04-05 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59177608A (en) * 1983-03-29 1984-10-08 Anritsu Corp Generating device of nc recording medium for automatic parts mounting machine
JPS62133503A (en) * 1985-12-05 1987-06-16 Fanuc Ltd Nc program generating method for multiple working

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59177608A (en) * 1983-03-29 1984-10-08 Anritsu Corp Generating device of nc recording medium for automatic parts mounting machine
JPS62133503A (en) * 1985-12-05 1987-06-16 Fanuc Ltd Nc program generating method for multiple working

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0434999A (en) * 1990-05-30 1992-02-05 Okuma Mach Works Ltd Electronic component installing device
WO2001024598A1 (en) * 1999-09-27 2001-04-05 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus
US6842974B1 (en) 1999-09-27 2005-01-18 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus

Also Published As

Publication number Publication date
KR890007624A (en) 1989-06-20
KR910002054B1 (en) 1991-04-01
JPH0774969B2 (en) 1995-08-09

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