JPH0346514Y2 - - Google Patents
Info
- Publication number
- JPH0346514Y2 JPH0346514Y2 JP1985128258U JP12825885U JPH0346514Y2 JP H0346514 Y2 JPH0346514 Y2 JP H0346514Y2 JP 1985128258 U JP1985128258 U JP 1985128258U JP 12825885 U JP12825885 U JP 12825885U JP H0346514 Y2 JPH0346514 Y2 JP H0346514Y2
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- circuit element
- bent
- portions
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 32
- 238000005452 bending Methods 0.000 description 6
- 238000009958 sewing Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
〈産業上の利用分野〉
この考案は一般に電子機器等に使用されるフレ
キシブル基板に対する回路素子の取付構造に関す
る。[Detailed Description of the Invention] <Industrial Field of Application> This invention generally relates to a structure for mounting circuit elements on a flexible substrate used in electronic equipment and the like.
〈従来の技術〉
一般に、電子機器においてその小形軽量化に伴
い、狭い機器空間内に屈曲させて装備することが
でき、配線の合理化の行えるプリント配線板とし
てフレキシブル基板が用いられている。このフレ
キシブル基板にLED等の回路素子を取付ける場
合、はんだ付け等の電気的接続のみによつて回路
素子を自立させるには、取付け強度が十分ではな
く、且つ、取付け作業が煩雑なものであつた。<Prior Art> In general, as electronic devices become smaller and lighter, flexible substrates are used as printed wiring boards that can be bent and installed in narrow device spaces and can streamline wiring. When attaching circuit elements such as LEDs to this flexible board, the attachment strength was not sufficient to allow the circuit elements to stand on their own through electrical connections such as soldering, and the installation work was complicated. .
このため、このようなフレキシブル基板への回
路素子の取付けは、第7図に示すようにLED等
の回路素子1の各脚部2,4に、導電性ゴムから
なる可撓性取付部材23を夫々嵌装し、この可撓
性取付部材23をフレキシブル基板6に形成され
た回路パターン11,13に対面させるととも
に、可撓性取付部材23とフレキシブル基板6と
を、上方支持部材20と下方支持部材22との間
に介装させて圧接し、回路素子1の取付けと回路
パターン11,13への電気的接続とがなされて
いた。そして、上方支持部材20に設けられたガ
イド孔21により回路素子1の取付位置を規定
し、その立設を行う構成が一般に行われていた。 For this reason, in order to attach a circuit element to such a flexible board, as shown in FIG. The flexible mounting member 23 is made to face the circuit patterns 11 and 13 formed on the flexible substrate 6, and the flexible mounting member 23 and the flexible substrate 6 are connected to the upper support member 20 and the lower support member 20. The circuit element 1 is mounted and electrically connected to the circuit patterns 11 and 13 by interposing and press-contacting the circuit element 1 with the member 22. Generally, the mounting position of the circuit element 1 is defined by the guide hole 21 provided in the upper support member 20, and the circuit element 1 is erected.
〈考案が解決しようとする問題点〉
しかし、このような従来構成のフレキシブル基
板に対する回路素子の取付構造は、フレキシブル
基板6に対する取付強度上の問題は解消したもの
の、回路素子1の脚部2,4に可撓性取付部材2
3を嵌装する作業が煩しいものであり、また、嵌
装のしかたによつては可撓性取付部材23の電気
抵抗がばらつくため、回路素子1が適正な動作を
なし得ないおそれがあつた。<Problems to be solved by the invention> However, although the structure for mounting circuit elements on a flexible board with such a conventional configuration has solved the problem of mounting strength to the flexible board 6, the leg parts 2 of the circuit element 1, 4, flexible mounting member 2
The work of fitting 3 is cumbersome, and the electrical resistance of the flexible mounting member 23 varies depending on the fitting method, so there is a risk that the circuit element 1 may not operate properly. Ta.
また、可撓性取付部材23のフレキシブル基板
6上の回路パターン11,13への位置決めが上
方および下方支持部材20,22間に圧着挾持さ
れて行われ、更に、上方支持部材20と下方支持
部材22との関係は相対的なものであるため、回
路素子の位置決め取付け作業は、まだなお煩雑な
ものであつた。 Further, the flexible mounting member 23 is positioned to the circuit patterns 11 and 13 on the flexible substrate 6 by being clamped between the upper and lower support members 20 and 22, and furthermore, the flexible mounting member 23 is held between the upper and lower support members 20 and 22, and Since the relationship with 22 is relative, the positioning and mounting work of the circuit elements is still complicated.
〈考案の目的〉
この考案の目的は、フレキシブル基板の正確な
位置に回路素子を位置決めし得るとともに、フレ
キシブル基板の可撓性を利用して、回路素子をフ
レキシブル基板上に自立させ、前記従来例の如く
上方支持部材と下方支持部材との相対的な関係に
より回路素子を取付けることなく、簡単な取付け
作業によりフレキシブル基板に対し回路素子を取
付け得る取付構造を提供するものである。<Purpose of the invention> The purpose of this invention is to be able to position a circuit element at an accurate position on a flexible substrate, and also to make the circuit element independent on the flexible substrate by utilizing the flexibility of the flexible substrate, and to solve the problem of the conventional example described above. The present invention provides a mounting structure in which a circuit element can be mounted on a flexible substrate by a simple mounting operation without mounting the circuit element due to the relative relationship between the upper support member and the lower support member.
〈問題点を解決するための手段〉
この考案は上記問題を解決するためになされた
ものであり、
少なくとも一対の端子部を含む所定の回路パタ
ーンが形成されたフレキシブル基板に、前記各端
子部に接続される一対の脚部を有する回路素子を
取付ける取付構造であって、前記フレキシブル基
板の前記端子部近傍に形成され、前記各脚部が縫
い差し可能に設けられるとともに、脚部と端子部
とを接続した状態で位置決め固定する複数個の位
置決め孔を形成し、前記脚部がフレキシブル基板
の一つの位置決め孔を介して一方の面より他方の
面に挿通された後、他の位置決め孔を介して他方
の面より一方の面側に挿通されたフレキシブル基
板に対する回路素子の取付構造。<Means for Solving the Problems> This invention was devised to solve the above problems, and includes a flexible substrate on which a predetermined circuit pattern including at least one pair of terminal portions is formed, and a circuit pattern formed on each terminal portion. A mounting structure for mounting a circuit element having a pair of legs to be connected, the mounting structure being formed near the terminal section of the flexible substrate, each leg section being sewnable, and connecting the legs and the terminal section. A plurality of positioning holes are formed to position and fix the flexible substrate in a connected state, and after the leg is inserted from one side to the other side through one positioning hole of the flexible substrate, it is inserted through the other positioning hole. A structure for mounting circuit elements on a flexible board that is inserted into one side of the board rather than the other.
〈作用〉
この考案は、上記のように構成されたものであ
り、回路素子の一対の脚部の折曲部が、夫々一方
の位置決め孔より他方の位置決め孔へ向けて縫い
差し状に挿通され、折曲部の先端部分が端子部に
おいて電気的に接続される。<Function> This device is constructed as described above, and the bent portions of the pair of legs of the circuit element are inserted in the shape of a sewing insert from one positioning hole to the other positioning hole. , the tip portions of the bent portions are electrically connected at the terminal portions.
このとき、折曲部はその基部と先端部分とがフ
レキシブル基板上面に支承され、その中央部は両
位置決め孔間のフレキシブル基板下面に弾性的に
押圧され、上下により拘束された状態となる。 At this time, the base and tip of the bent portion are supported by the upper surface of the flexible substrate, and the central portion thereof is elastically pressed against the lower surface of the flexible substrate between the two positioning holes, and is restrained by the upper and lower sides.
この拘束により、回路素子はその折曲部をフレ
キシブル基板面に平行して支持され、且つ、その
取付け位置を位置決め孔と、端子部との電気的接
続とにより規定され、フレキシブル基板上に自立
されて取付けが行われるものである。 Due to this restraint, the circuit element is supported with its bent part parallel to the surface of the flexible board, and its mounting position is defined by the positioning hole and the electrical connection with the terminal part, and the circuit element is free-standing on the flexible board. Installation is performed by
〈実施例〉
以下、この考案の実施例を図面に基づいて説明
する。第1図はこの考案の一実施例を示す正面
図、第2図はその平面図、第3図は第1図のA部
拡大断面図、第4図は第2図のイ−イ線矢視断面
図である。第1図に示すように、機器の図示しな
い函体内に略平面状にフレキシブル基板6が装備
されている。<Example> Hereinafter, an example of this invention will be described based on the drawings. Fig. 1 is a front view showing an embodiment of this invention, Fig. 2 is a plan view thereof, Fig. 3 is an enlarged sectional view of section A in Fig. 1, and Fig. 4 is an arrow indicated by the line A--A in Fig. 2. FIG. As shown in FIG. 1, a flexible substrate 6 is installed in a substantially planar shape inside a box (not shown) of the device.
フレキシブル基板6は、実施例では柔軟性のあ
るポリエステルまたはポリイミドからなるベース
フイルム上の銅箔が張り合せられ、これにエツチ
ング等の公知の方法によつて、回路パターン1
1,13を形成して所定の回路が構成されてい
る。 In the embodiment, the flexible substrate 6 has a copper foil laminated on a base film made of flexible polyester or polyimide, and a circuit pattern 1 is formed on this by a known method such as etching.
1 and 13 to form a predetermined circuit.
このフレキシブル基板6は、所定位置に、回路
パターン11,13に連続した端子部12,14
が形成されており、端子部12には、その近傍に
後述する回路素子1の折曲部3が挿通可能な所定
径の位置決め孔7,8が、端子部12と一列に連
なるように所定間隔をおいて穿設されている。ま
た、端子部14には、上述と同様に所定径の位置
決め孔9,10が、端子部14と一列に連なるよ
うに所定間隔をおいて穿設されている。そして、
端子部12、位置決め孔7,8と端子部14、位
置決め孔9,10とは、所定の間隔を隔てて平行
するように設けられている。 This flexible substrate 6 has terminal portions 12 and 14 continuous to the circuit patterns 11 and 13 at predetermined positions.
is formed in the terminal portion 12, and positioning holes 7, 8 of a predetermined diameter through which the bent portion 3 of the circuit element 1, which will be described later, can be inserted are formed near the terminal portion 12 at a predetermined interval so as to be in line with the terminal portion 12. It is drilled at the same time. In addition, positioning holes 9 and 10 of a predetermined diameter are bored in the terminal portion 14 at a predetermined interval so as to be in line with the terminal portion 14, as described above. and,
The terminal portion 12 and the positioning holes 7 and 8 and the terminal portion 14 and the positioning holes 9 and 10 are provided in parallel with each other at a predetermined interval.
回路素子1は、実施例では一対の脚部2,4を
有するLEDからなり、脚部2,4は折曲基部3
a,5aにおいて、略直角に同一方向へ平行して
折り曲げられ、折曲部3,5が形成されている。 In the embodiment, the circuit element 1 consists of an LED having a pair of legs 2 and 4, and the legs 2 and 4 are connected to a bent base 3.
a, 5a are bent substantially at right angles in parallel in the same direction to form bent portions 3, 5.
この回路素子1は、フレキシブル基板6の上面
側より折曲部3,5を夫々位置決め孔7,9に挿
入し、更にフレキシブル基板6の下面側から位置
決め孔8,10に夫々縫い差し状に挿入する。そ
して、折曲部3,5の先端部分3c,5cを夫々
端子部12,14に到達させ、先端部分3c,5
cを端子部12,14に夫々低温はんだ15等に
よりはんだ付けされて電気的に接続される。 This circuit element 1 is constructed by inserting the bent portions 3 and 5 into the positioning holes 7 and 9 from the upper surface of the flexible substrate 6, and then inserting them into the positioning holes 8 and 10 from the lower surface of the flexible substrate 6 in a sewn-in manner. do. Then, the tip portions 3c, 5c of the bent portions 3, 5 reach the terminal portions 12, 14, respectively, and the tip portions 3c, 5c reach the terminal portions 12, 14, respectively.
c are soldered to the terminal portions 12 and 14 using low-temperature solder 15 or the like to be electrically connected.
このように所要個数の回路素子が、所要個数の
位置決め孔により保持されてフレキシブル基板6
上に取付けられる。 In this way, the required number of circuit elements are held by the required number of positioning holes on the flexible substrate 6.
mounted on top.
尚、回路素子1は、第2図における上下方向の
位置については、位置決め孔の設定位置により位
置決めされ、また同じく左右方向については、位
置決め孔の設定位置および折曲部の長さにより位
置決めされる。更に、回路素子1の高さは脚部
2,4の長さにより規定され、夫々随意に調整可
能である。 In addition, the circuit element 1 is positioned in the vertical direction in FIG. 2 by the set position of the positioning hole, and similarly in the left and right direction, it is positioned by the set position of the positioning hole and the length of the bent part. . Furthermore, the height of the circuit element 1 is determined by the lengths of the legs 2 and 4, and can be adjusted at will.
第5図は、この考案の他の実施例を示す平面図
で、反対方向へ向けて折曲形成された折曲部の構
成を除いて、第1の実施例と同じである。 FIG. 5 is a plan view showing another embodiment of the present invention, which is the same as the first embodiment except for the structure of the bent portion which is bent in the opposite direction.
即ち、この第2実施例の回路素子1の脚部2,
4は、脚部2,4の基部を結ぶ線に直交する方向
に、且つ、折曲基部3a,5aにおいて、夫々反
対方向へ向けて略直角に折り曲げられて折曲部
3,5が形成されている。また、フレキシブル基
板6には、上記折曲部3,5の形成に対応して、
第1の実施例と同様に連設された端子部12、位
置決め孔7,8および同じく連設された端子部1
4、位置決め孔9,10が夫々所定位置に形成さ
れている。 That is, the leg portions 2 of the circuit element 1 of this second embodiment,
4 is bent at a substantially right angle in a direction perpendicular to a line connecting the bases of the legs 2 and 4, and in opposite directions at the bending bases 3a and 5a, respectively, to form bent portions 3 and 5. ing. In addition, in the flexible substrate 6, corresponding to the formation of the bent portions 3 and 5,
Terminal part 12, positioning holes 7 and 8, and terminal part 1 which are connected in the same way as in the first embodiment.
4. Positioning holes 9 and 10 are formed at predetermined positions, respectively.
そして、回路素子1の折曲部3を位置決め孔7
および8に縫い差し状に挿通し、次いで折曲部5
を位置決め孔9および10に縫い差し状に挿通し
て後、折曲部3,5の先端部分3c,5cを夫々
端子部12,14上に配し、先端部分3c,5c
と端子部12,14とが夫々電気的に接続され
る。 Then, the bent portion 3 of the circuit element 1 is inserted into the positioning hole 7.
and 8 in the shape of a sewing insert, and then the bent part 5
are inserted into the positioning holes 9 and 10 in the form of sewing inserts, and then the tip portions 3c and 5c of the bent portions 3 and 5 are placed on the terminal portions 12 and 14, respectively.
and the terminal portions 12 and 14 are electrically connected to each other.
この実施例においては、反対方向へ向けて折曲
形成された折曲部3,5により、回路素子1が安
定して自立される。 In this embodiment, the circuit element 1 is stably made self-supporting by the bent portions 3 and 5 which are bent in opposite directions.
第6図は、この考案の第3の実施例を示す平面
図で、反対方向へ向けて折曲形成され、且つ屈曲
部を有する折曲部の構成を除いて第1の実施例と
同じである。 FIG. 6 is a plan view showing a third embodiment of this invention, which is the same as the first embodiment except for the structure of the bending part which is bent in the opposite direction and has a bending part. be.
即ち、この実施例の回路素子1の脚部2,4
は、脚部2,4の基部を結ぶ線上に、折曲基部3
a,5aにおいて、夫々反対方向へ向けて略直角
に折り曲げられて折曲部3,5が形成されてい
る。そして、折曲部3,5には、折曲基部3a,
5aに近接して第6図における上下方向へ交互に
張出し状に形成された屈曲部3b,5bが設けら
れている。また、フレキシブル基板6には、上記
折曲部3,5の形成に対応して、第1の実施例と
同様に連設された端子部12、位置決め孔7,8
および同じく連設された端子部14、位置決め孔
9,10が夫々所定位置に形成されている。 That is, the legs 2 and 4 of the circuit element 1 of this embodiment
The bent base 3 is placed on the line connecting the bases of the legs 2 and 4.
At a and 5a, bent portions 3 and 5 are formed by bending at substantially right angles in opposite directions, respectively. The bent portions 3 and 5 include bent base portions 3a,
Bent portions 3b and 5b are provided adjacent to 5a and alternately project in the vertical direction in FIG. In addition, in the flexible substrate 6, corresponding to the formation of the bending parts 3 and 5, terminal parts 12 and positioning holes 7 and 8 are provided in series as in the first embodiment.
Terminal portions 14 and positioning holes 9 and 10, which are also connected in series, are formed at predetermined positions, respectively.
そして、回路素子1の折曲部3を位置決め孔7
および8に縫い差し状に挿通し、次いで折曲部5
を位置決め孔9,10に縫い差し状に挿通して
後、折曲部3,5の先端部分3c,5cを夫々端
子部12,14上に配し、先端部分3c,5cと
端子部12,14とが夫々電気的に接続される。 Then, the bent portion 3 of the circuit element 1 is inserted into the positioning hole 7.
and 8 in the shape of a sewing insert, and then the bent part 5
are inserted into the positioning holes 9, 10 in the form of sewing inserts, and then the tip portions 3c, 5c of the bent portions 3, 5 are placed on the terminal portions 12, 14, respectively, and the tip portions 3c, 5c and the terminal portion 12, 14 are electrically connected to each other.
この実施例においては、反対方向へ向けて形成
された折曲部3,5と、折曲部3,5に設けられ
た屈曲部3b,5bとにより回路素子1が安定し
て自立される。 In this embodiment, the circuit element 1 is stably made self-supporting by the bent portions 3 and 5 formed in opposite directions and the bent portions 3b and 5b provided on the bent portions 3 and 5.
〈考案の効果〉
以上説明したようにこの考案のフレキシブル基
板に対する回路素子の取付構造は、回路素子の脚
部に折曲形成された折曲部を、フレキシブル基板
に設けられた端子部近傍に形成された複数個の位
置決め孔に縫い差し状に挿通して、回路素子を折
曲部と位置決め孔とを介して、脚部と端子部とを
電気的に接続した状態でフレキシブル基板上に位
置決め固定を行う構成なので、回路素子の取付け
位置を正確に位置決めすることが可能となり、且
つ、フレキシブル基板上に安定して自立させるこ
とができる。<Effects of the invention> As explained above, the mounting structure of the circuit element on the flexible board of this invention is such that the bent part formed on the leg of the circuit element is formed near the terminal part provided on the flexible board. The circuit element is inserted into the multiple positioning holes in the shape of a sewing insert, and the circuit element is positioned and fixed on the flexible board with the leg part and terminal part electrically connected through the bent part and the positioning hole. Since the circuit element is configured to do this, it is possible to accurately determine the mounting position of the circuit element, and it is also possible to stably stand up on the flexible substrate.
また、回路素子は、その脚部の折曲部がフレキ
シブル基板の位置決め孔部において縫い差し状態
になつて拘束支持されているので、取付けのため
の取付部材を必要とせず、且つ、回路素子の上下
両側に支持部材がない構造部分においても、回路
素子をフレキシブル基板上に安定して自立させる
ことができ、従つて機器設計の自由度が大幅に拡
大される。 In addition, since the bent portions of the circuit elements are sewn into the positioning holes of the flexible substrate and are restrained and supported, a mounting member is not required for mounting, and the circuit elements can be easily mounted. Even in a structural part where there are no supporting members on both the upper and lower sides, the circuit element can be stably made to stand on its own on the flexible substrate, and the degree of freedom in device design is therefore greatly expanded.
更に、回路素子の脚部と端子部との接続に、導
電性ゴム等の取付部材を介在させていないので、
接続部における導電性が向上し、且つ一定になる
ので、安定した電気接続を行うことができる。従
つて、回路素子がLEDの場合、その光度を一定
させることができる。 Furthermore, since no mounting member such as conductive rubber is used to connect the legs of the circuit element and the terminals,
Since the electrical conductivity at the connection part is improved and becomes constant, a stable electrical connection can be made. Therefore, when the circuit element is an LED, its luminous intensity can be made constant.
また、回路素子がフレキシブル基板に支持され
た状態ではんだ付けが行えるため、加熱による回
路パターンの剥離等フレキシブル基板の損傷に特
別の注意を要するはんだ付け作業の煩雑さが軽減
され、簡単な取付け作業により作業能率が向上す
るとともに、不良率が低減し均質な回路素子の取
付けが行えるなどその奏する効果は極めて大であ
る。 In addition, since soldering can be performed while the circuit elements are supported on the flexible board, the complexity of the soldering work, which requires special care to prevent damage to the flexible board such as peeling of the circuit pattern due to heating, is reduced, and the installation work is simple. As a result, work efficiency is improved, the defective rate is reduced, and circuit elements can be mounted with uniformity, which has extremely large effects.
第1図はこの考案の実施例のフレキシブル基板
に対する回路素子の取付構造の正面図、第2図は
同じく平面図、第3図は第1図のA部における拡
大断面図、第4図は第2図のイ−イ線矢視断面
図、第5図はこの考案の第2の実施例を示す平面
図、第6図は同じく第3の実施例を示す平面図、
第7図は従来のフレキシブル基板に対する回路素
子の取付構造を示す断面図である。
1……回路素子、2,4……脚部、3,5……
折曲部、6……フレキシブル基板、7,8,9,
10……位置決め孔、11,13……回路パター
ン、12,14……端子部。
Fig. 1 is a front view of the mounting structure for circuit elements on a flexible board according to an embodiment of this invention, Fig. 2 is a plan view thereof, Fig. 3 is an enlarged sectional view of section A in Fig. 2 is a sectional view taken along the line A--A, FIG. 5 is a plan view showing a second embodiment of this invention, and FIG. 6 is a plan view showing a third embodiment.
FIG. 7 is a sectional view showing a conventional structure for mounting circuit elements on a flexible substrate. 1...Circuit element, 2, 4...Legs, 3, 5...
Bending portion, 6...Flexible substrate, 7, 8, 9,
10... Positioning hole, 11, 13... Circuit pattern, 12, 14... Terminal portion.
Claims (1)
ーンが形成されたフレキシブル基板に、 前記各端子部に接続される一対の脚部を有する
回路素子を取付ける取付構造であって、 前記フレキシブル基板の前記端子部近傍に形成
され、前記各脚部が縫い差し可能に設けられると
ともに、脚部と端子部とを接続した状態で位置決
め固定する複数固の位置決め孔を形成し、 前記脚部がフレキシブル基板の一つの位置決め
孔を介して一方の面より他方の面に挿通された
後、他の位置決め孔を介して他方の面より一方の
面側に挿通されたことを特徴とするフレキシブル
基板に対する回路素子の取付け構造。[Claims for Utility Model Registration] A mounting structure for attaching a circuit element having a pair of legs connected to each of the terminal portions to a flexible substrate on which a predetermined circuit pattern including at least one pair of terminal portions is formed. , a plurality of positioning holes are formed near the terminal portion of the flexible substrate, each of the leg portions can be sewn into the flexible substrate, and a plurality of positioning holes are formed for positioning and fixing the leg portions and the terminal portion in a connected state; The legs are inserted from one side to the other side through one positioning hole of the flexible substrate, and then inserted from the other side to one side through another positioning hole. Mounting structure for circuit elements on flexible boards.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985128258U JPH0346514Y2 (en) | 1985-08-22 | 1985-08-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985128258U JPH0346514Y2 (en) | 1985-08-22 | 1985-08-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6236574U JPS6236574U (en) | 1987-03-04 |
JPH0346514Y2 true JPH0346514Y2 (en) | 1991-10-01 |
Family
ID=31023765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985128258U Expired JPH0346514Y2 (en) | 1985-08-22 | 1985-08-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0346514Y2 (en) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54141467U (en) * | 1978-03-27 | 1979-10-01 |
-
1985
- 1985-08-22 JP JP1985128258U patent/JPH0346514Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6236574U (en) | 1987-03-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0346514Y2 (en) | ||
US4118757A (en) | Pin extender strip for vertically mounting multi-pin electronic devices | |
US6191369B1 (en) | Printed circuit board having a marker trace for component alignment | |
JPH0229734Y2 (en) | ||
JPS5819153B2 (en) | How to connect printed circuit board and flexible cable | |
JPH05198911A (en) | Stereoscopic printed circuit board | |
JP3110655B2 (en) | How to assemble chain contact pin parts | |
JPH0823163A (en) | Mounting method for substrate | |
JPS5844602Y2 (en) | printed wiring board | |
JPS622783Y2 (en) | ||
JPH0510388Y2 (en) | ||
JPS6334264Y2 (en) | ||
JPS633194Y2 (en) | ||
JPH0537437Y2 (en) | ||
JPH0518075U (en) | Metal board mounting structure | |
JPH0658564U (en) | Printed circuit board assembly | |
JPH0648904Y2 (en) | Printed board for positioning | |
JPH0134452Y2 (en) | ||
JPH0537260Y2 (en) | ||
JPS5834774Y2 (en) | Printed circuit board for mounting electronic components | |
JP3432939B2 (en) | LED display | |
JPH05218607A (en) | Printed-circuit board | |
JPH04345083A (en) | Printed wiring board for three-dimensional mounting and its manufacture | |
US20050277313A1 (en) | Surface mountable pin assembly for a printed circuit board | |
JP2002204041A (en) | Mounting position detecting structure of electric component |