JPH0346229U - - Google Patents

Info

Publication number
JPH0346229U
JPH0346229U JP10646989U JP10646989U JPH0346229U JP H0346229 U JPH0346229 U JP H0346229U JP 10646989 U JP10646989 U JP 10646989U JP 10646989 U JP10646989 U JP 10646989U JP H0346229 U JPH0346229 U JP H0346229U
Authority
JP
Japan
Prior art keywords
metal ring
electronic component
ceramic body
attached
ground electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10646989U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10646989U priority Critical patent/JPH0346229U/ja
Publication of JPH0346229U publication Critical patent/JPH0346229U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,b,c,dは本考案に係る電子部品
の製造工程を示した正面図および斜視図、第2図
は従来例を示した正面図である。 10……セラミツク体、12……電極(アース
電極)、13……金属製キヤツプ、20……金属
輪、21……樹脂モールド。
FIGS. 1a, b, c, and d are a front view and a perspective view showing the manufacturing process of an electronic component according to the present invention, and FIG. 2 is a front view showing a conventional example. DESCRIPTION OF SYMBOLS 10... Ceramic body, 12... Electrode (earth electrode), 13... Metal cap, 20... Metal ring, 21... Resin mold.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 筒状のセラミツク体の両端部に一端盲状の金属
製のキヤツプが冠着され、前記セラミツク体の略
中央部にアース電極が形成された電子部品におい
て、前記アース電極部分に金属輪が被着されると
ともに、該金属輪の周辺近傍に該金属輪を部分的
に露出させた外面に平面部を有する樹脂モールド
が施されていることを特徴とする電子部品。
An electronic component in which a metal cap with one end blind is attached to both ends of a cylindrical ceramic body, and a ground electrode is formed approximately in the center of the ceramic body, and a metal ring is attached to the ground electrode portion. An electronic component characterized in that a resin mold is applied near the periphery of the metal ring and has a flat surface on the outer surface of the metal ring that partially exposes the metal ring.
JP10646989U 1989-09-11 1989-09-11 Pending JPH0346229U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10646989U JPH0346229U (en) 1989-09-11 1989-09-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10646989U JPH0346229U (en) 1989-09-11 1989-09-11

Publications (1)

Publication Number Publication Date
JPH0346229U true JPH0346229U (en) 1991-04-30

Family

ID=31655198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10646989U Pending JPH0346229U (en) 1989-09-11 1989-09-11

Country Status (1)

Country Link
JP (1) JPH0346229U (en)

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