JPH01155618U - - Google Patents
Info
- Publication number
- JPH01155618U JPH01155618U JP5187188U JP5187188U JPH01155618U JP H01155618 U JPH01155618 U JP H01155618U JP 5187188 U JP5187188 U JP 5187188U JP 5187188 U JP5187188 U JP 5187188U JP H01155618 U JPH01155618 U JP H01155618U
- Authority
- JP
- Japan
- Prior art keywords
- convex portion
- central conductor
- concave
- buttuthing
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
Landscapes
- Insulators (AREA)
Description
第１図は本考案のモールドブツシングの一実施
例を示す半断面図、第２図は本考案のモールドブ
ツシングの他の実施例を示す半断面図、第３図お
よび第４図はそれぞれ異る従来のモールドブツシ
ングを示す半断面図である。
１，８，９……中心導体、２……絶縁層、３…
…気密部、４……Ｏリング、５……取り付け板、
７……接着層。
FIG. 1 is a half-sectional view showing one embodiment of the molded bushing of the present invention, FIG. 2 is a half-sectional view showing another embodiment of the molded bushing of the present invention, and FIGS. 3 and 4 are respectively FIG. 3 is a half-sectional view showing a different conventional molded bushing. 1, 8, 9...center conductor, 2...insulating layer, 3...
...Airtight part, 4...O ring, 5...Mounting plate,
7...adhesive layer.
Claims (1)
テーパー状の凹部または凸部を形成し、この凹部
または凸部を含む前記中心導体の外周部に絶縁注
形材料により絶縁層を形成させたことを特徴とす
るモールドブツシング。 A gently tapered concave or convex portion is formed in a part of the central conductor along the longitudinal direction, and an insulating layer is formed using an insulating casting material on the outer periphery of the central conductor including the concave or convex portion. Features molded buttuthing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5187188U JPH01155618U (en) | 1988-04-18 | 1988-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5187188U JPH01155618U (en) | 1988-04-18 | 1988-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01155618U true JPH01155618U (en) | 1989-10-25 |
Family
ID=31277887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5187188U Pending JPH01155618U (en) | 1988-04-18 | 1988-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01155618U (en) |
-
1988
- 1988-04-18 JP JP5187188U patent/JPH01155618U/ja active Pending