JPS62168601U - - Google Patents
Info
- Publication number
- JPS62168601U JPS62168601U JP5696486U JP5696486U JPS62168601U JP S62168601 U JPS62168601 U JP S62168601U JP 5696486 U JP5696486 U JP 5696486U JP 5696486 U JP5696486 U JP 5696486U JP S62168601 U JPS62168601 U JP S62168601U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- fitting portion
- cap
- terminal
- cap fitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Details Of Resistors (AREA)
Description
第１図は本考案の一実施例を示す電子部品の縦
断面図、第２図は同上素体の正面図、第３図は縦
来の電子部品の素体の正面図、第４図は同上電子
部品の縦断面図、第５図は同上塗膜が垂れ下がつ
た状態を示す縦断面図である。
１１……素体、１２……キヤツプ嵌合部、１３
……端子キヤツプ、１４……塗膜。
Fig. 1 is a vertical cross-sectional view of an electronic component showing an embodiment of the present invention, Fig. 2 is a front view of the same element body, Fig. 3 is a front view of the element body of the conventional electronic component, and Fig. 4 is a longitudinal sectional view of an electronic component showing an embodiment of the present invention. FIG. 5 is a vertical cross-sectional view of the electronic component same as above, and FIG. 11...Element body, 12...Cap fitting part, 13
...Terminal cap, 14...Coating film.
Claims (1)
ヤツプ嵌合部を形成し、この素体の両端キヤツプ
嵌合部に端子キヤツプを嵌合し、この両端の端子
キヤツプ間の前記素体の外周面に塗膜を形成した
ことを特徴とした電子部品。 A small-diameter cap fitting portion with a step is formed at both ends of the electronic component element, a terminal cap is fitted into the cap fitting portion at both ends of the element, and the element is connected between the terminal caps at both ends. An electronic component characterized by having a coating film formed on the outer peripheral surface of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986056964U JPH0536241Y2 (en) | 1986-04-16 | 1986-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986056964U JPH0536241Y2 (en) | 1986-04-16 | 1986-04-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62168601U true JPS62168601U (en) | 1987-10-26 |
| JPH0536241Y2 JPH0536241Y2 (en) | 1993-09-14 |
Family
ID=30886243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986056964U Expired - Lifetime JPH0536241Y2 (en) | 1986-04-16 | 1986-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536241Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324513A (en) * | 2005-05-19 | 2006-11-30 | Koa Corp | Method for forming protective film for resistor having lead wire and apparatus for forming protective film |
-
1986
- 1986-04-16 JP JP1986056964U patent/JPH0536241Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0536241Y2 (en) | 1993-09-14 |