JPH0344997A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH0344997A JPH0344997A JP17903289A JP17903289A JPH0344997A JP H0344997 A JPH0344997 A JP H0344997A JP 17903289 A JP17903289 A JP 17903289A JP 17903289 A JP17903289 A JP 17903289A JP H0344997 A JPH0344997 A JP H0344997A
- Authority
- JP
- Japan
- Prior art keywords
- conductive material
- wiring board
- printed wiring
- insulating
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 27
- 239000011810 insulating material Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000010030 laminating Methods 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 239000012779 reinforcing material Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000007788 roughening Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 7
- 238000010276 construction Methods 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 description 16
- 238000003475 lamination Methods 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- SDIXRDNYIMOKSG-UHFFFAOYSA-L disodium methyl arsenate Chemical compound [Na+].[Na+].C[As]([O-])([O-])=O SDIXRDNYIMOKSG-UHFFFAOYSA-L 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- -1 nickel may be used Chemical compound 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、高密度プリント配線基板を精度良く形成する
方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for forming a high-density printed wiring board with high precision.
従来、プリント配線基板、特に樹脂系基板においては、
導電材である銅箔（１８〜７０μｍ）と絶縁材であるガ
ラス基材−エポキシ樹脂又は紙基材−フェノール樹脂等
とをラミネート或はプレスにより積層或は熱圧着して形
成している。Conventionally, printed wiring boards, especially resin-based boards,
It is formed by laminating or thermocompression bonding a copper foil (18 to 70 μm), which is a conductive material, and a glass base material-epoxy resin or paper base material-phenol resin, etc., which is an insulating material, by laminating or pressing.
ところで、上記のようなプリント配線基板に使用した銅
箔を１８μｍ程度以下に薄く形成することは加工上非常
に困難であり、エツチングによるパターンニングの際、
銅箔層が厚いほどアンダーエツチングが大きくなり、パ
ターン幅を細くできないという問題点があった。By the way, it is extremely difficult to form the copper foil used in the above-mentioned printed wiring boards as thin as about 18 μm or less, and when patterning by etching,
There was a problem that the thicker the copper foil layer, the greater the underetching, making it impossible to reduce the pattern width.
又、微細加工を有効に行なう手段としてレーザービーム
加工等の光を用いた加工による場合、銅箔は反射率が高
いので加工効率が悪く、そのため高出力を要し、高精細
な加工ができないという問題点があった。In addition, when processing using light such as laser beam processing is an effective means of microfabrication, the processing efficiency of copper foil is low due to its high reflectance, which requires high output power, making it impossible to perform high-definition processing. There was a problem.
本発明は、上記のような問題点を解消するためになされ
たもので、導電材料を絶縁材料に対して極めて薄く積層
形成することにより、高密度化、高精度化を可能とした
プリント配線基板の製造方法を提供することを目的とす
る。The present invention was made to solve the above-mentioned problems, and provides a printed wiring board that enables high density and high precision by laminating a conductive material extremely thinly on an insulating material. The purpose is to provide a manufacturing method for.
〔課題を解決するための手段］
上記の課題を解決するために、本発明のプリント配線基
板の製造方法は、導電材料と絶縁材料を積層してなるプ
リント配線基板の製造方法において、絶縁性保持部材に
導電材料を接合し、さらに前記導電材料に絶縁材料を積
層形成し、しかる後前記保持部材を剥離することにより
除去することを特徴とする。[Means for Solving the Problems] In order to solve the above problems, the method for manufacturing a printed wiring board of the present invention includes a method for manufacturing a printed wiring board formed by laminating a conductive material and an insulating material. The method is characterized in that a conductive material is bonded to the member, an insulating material is layered on the conductive material, and then the holding member is removed by peeling off.
上記の方法においては、導電材料に絶縁性保持部材が接
合されることにより、絶縁材料の積層工程において上記
絶縁性保持部材が導電材料を保護するため、導電材料を
極薄状に形成しても該導電材料が折れたり破れたりする
ことがなく、極薄導電層の形成が可能となる。In the above method, since the insulating holding member is bonded to the conductive material, the insulating holding member protects the conductive material in the process of laminating the insulating material, so even if the conductive material is formed into an extremely thin shape, The conductive material does not bend or tear, making it possible to form an extremely thin conductive layer.
以下、本発明の実施例について図面を参照しながら説明
する。Embodiments of the present invention will be described below with reference to the drawings.
第１図（ａ）〜（ｉ）は、本発明の実施例に係るプリン
ト配線基板の製造プロセスを模式的に示した図である。FIGS. 1(a) to 1(i) are diagrams schematically showing a manufacturing process of a printed wiring board according to an embodiment of the present invention.
第１図（ａ）において、ｌは加工性をもたすための補強
材となる保持部材であり、本実施例では耐熱性に優れか
つ柔軟性を有する約５０ＩＬｍ厚の樹脂フィルム（テト
ラ−１００３Ｍ３０ＭＲ−東京スリッター社／ソマール
工業製）を使用しである。そして、第１図（ｂ）に示す
ように、保持部材１上に離形性を良くするための溶剤系
ワックス層２を塗布する。次に、第１図（Ｃ）に示すよ
うに、上記ワックスを塗布した保持部材１のワックス層
２側に約５μｍ厚の極薄銅箔４を重ね、ラミネートロー
ラー３で圧着ラミネートすることにより張合せ、第１図
（ｄ）に示す積層品を形成する。次に、第１図（ｅ）に
示すように、上記積層品を例えば過硫酸アンモニウムの
ｌｏＷＴ％の溶液に５分間（常温）浸漬することにより
酸化処理してソフトエツチングした後、亜塩素酸ナトリ
ウム４０ｇ／β・ リン酸三ナトリウム５ｇ／４、水酸
化ナトリウム１５ｇ／ｎの溶液を８５℃に加熱したもの
に３〜７分間浸漬する。これにより、銅箔４の表面を粗
化〜酸化被膜形成して絶縁材に対する密着性を優れたも
のにする。こうして形成された銅箔付き保持部材１０の
酸化被膜形成された面を、第１図（ｆ）に示すように向
かい合わせ、この間に絶縁材となる半硬化タイプの樹脂
−ガラスシート６（プリプレグＴＬＰ−５５１東芝ケミ
カルズ社製）を数枚挟んで１７０℃、３０ Ｋｇ／ Ｃ
ｒｒ＋’で９０分間加熱圧着する。そして、第１図（ｇ
）に示すように、保持部材フィルム１とワックス２とを
剥離することによ−り第１図（ｈ）に示す極薄銅張り積
層板１１が形成される。In FIG. 1(a), l is a holding member that serves as a reinforcing material to provide workability. - manufactured by Tokyo Slitter Co., Ltd./Somar Kogyo Co., Ltd.). Then, as shown in FIG. 1(b), a solvent-based wax layer 2 is applied onto the holding member 1 to improve mold releasability. Next, as shown in FIG. 1(C), an ultra-thin copper foil 4 with a thickness of approximately 5 μm is layered on the wax layer 2 side of the holding member 1 coated with the wax, and is laminated by pressure bonding with a laminating roller 3. Together, a laminate shown in FIG. 1(d) is formed. Next, as shown in FIG. 1(e), the above-mentioned laminate was oxidized and soft-etched by immersing it in a loWT% solution of ammonium persulfate for 5 minutes (at room temperature), and then 40 g of sodium chlorite was applied. /β・ Immerse for 3 to 7 minutes in a solution of 5 g/4 trisodium phosphate and 15 g/n sodium hydroxide heated to 85°C. As a result, the surface of the copper foil 4 is roughened to form an oxide film to provide excellent adhesion to the insulating material. The surfaces on which the oxide film of the holding member 10 with copper foil formed in this way are formed face each other as shown in FIG. -551 manufactured by Toshiba Chemicals Corporation) at 170℃, 30 Kg/C.
Heat and press at rr+' for 90 minutes. And Figure 1 (g
), by peeling off the holding member film 1 and the wax 2, an ultra-thin copper-clad laminate 11 shown in FIG. 1(h) is formed.
さらに、第１図（ｉ）に示すように、上記の基板１１に
対して孔明け→スルーホールメッキ−パターンレジスト
形成−エツチング−ソルダーレジスト形成という一連の
工程を経てプリント配線板１２を得る。Further, as shown in FIG. 1(i), a printed wiring board 12 is obtained by performing a series of steps on the substrate 11: drilling, through-hole plating, pattern resist formation, etching, and solder resist formation.
比較例：
次に、従来の積層法による銅張り積層板１３と本実施例
による極薄銅張り積層板１１との比較について説明する
。Comparative Example: Next, a comparison between the copper-clad laminate 13 made by the conventional lamination method and the ultra-thin copper-clad laminate 11 according to this example will be described.
従来の積層工程として、第２図（ａ）に示すように、あ
らかじめ片側な粗化〜酸化処理した銅箔４（１８〜７０
μｍ厚）とプリプレグ６゛（０，１〜０．２ｍｍ厚）の
数枚とを所定条件にて加熱圧着することにより第２図（
ｂ）に示す銅張り積層板１３を形成する。As shown in FIG. 2(a), in the conventional lamination process, a copper foil 4 (18 to 70
Figure 2 (
A copper-clad laminate 13 shown in b) is formed.
このような従来の積層工程においては、粗化〜酸化処理
した銅箔４を直ちにプリプレグとレイアップして積層す
るため、使用された銅箔が薄いとレイアップの時点で圧
力が加わった際に銅箔が折れたり破れたりして加工性が
極めて悪く、安定した形成が不可能である。In such a conventional lamination process, the roughened and oxidized copper foil 4 is immediately laid up and laminated with the prepreg, so if the copper foil used is thin, it will cause damage when pressure is applied at the time of layup. The copper foil is bent or torn, resulting in extremely poor workability, making stable formation impossible.
これに対して、本実施例方法によれば、銅箔に強靭かつ
柔軟性のある保持部材が付与されていることにより、積
層工程中に銅箔が折れたり破れたりすることがなく、１
０μｍ厚以下の極薄銅箔層を形成することが可能となる
。On the other hand, according to the method of this embodiment, since the copper foil is provided with a strong and flexible holding member, the copper foil does not bend or tear during the lamination process.
It becomes possible to form an ultra-thin copper foil layer with a thickness of 0 μm or less.
なお、上記実施例においては、第１図（ａ）において、
保持部材６として樹脂フィルムを用いであるが、本発明
においては、紙、可撓性セラミック等の他のものを用い
ても良い。又、第１図（Ｃ）において、導電材として銅
箔な用いであるが、本発明においては、アルミニウム、
ニッケル等地の金属を用いても良く、又導電材層の形成
に金属箔の定圧ラミネートという手段を用いているが、
金属メッキ、金属材のＣＶＤ等他の手段を用いることも
可能である。さらに、第１図（ｆ）におけるプレプレグ
材６としては、ガラス−エポキシ材に限らず、紙−フェ
ノール材、ポリイミド材等を用いることもできる。In addition, in the above embodiment, in FIG. 1(a),
Although a resin film is used as the holding member 6, in the present invention, other materials such as paper and flexible ceramic may also be used. In addition, in FIG. 1(C), copper foil is used as the conductive material, but in the present invention, aluminum,
Metals such as nickel may be used, and constant pressure lamination of metal foils is used to form the conductive material layer.
It is also possible to use other means such as metal plating and CVD of metal materials. Furthermore, the prepreg material 6 in FIG. 1(f) is not limited to glass-epoxy material, but may also be paper-phenol material, polyimide material, or the like.
以上説明したように、本発明のプリント配線基板の製造
方法によれば、保持部材上に導電材料の極薄層を形成し
、これを積層段階で絶縁材料側に転写、一体化するとい
う方法をとるため、膜厚１０μｍ以下の極薄導電層を有
する積層板が得られる。この積層板に対してはレーザー
を用いた微小孔明け、切断などの加工を低出力により行
なうことができ、バターニングの際、アンダーエツチン
グが起こらないため、細線化が可能である等プリント配
線板の高密度化、高精度化が可能となる。As explained above, according to the method for manufacturing a printed wiring board of the present invention, an extremely thin layer of conductive material is formed on the holding member, and this is transferred and integrated onto the insulating material side in the lamination step. As a result, a laminate having an extremely thin conductive layer with a thickness of 10 μm or less can be obtained. This laminated board can be processed using a laser at low power, such as drilling micro holes and cutting, and since underetching does not occur during patterning, it is possible to make thinner lines, etc. for printed wiring boards. It is possible to achieve higher density and higher precision.
第１図（ａ）〜（ｉ）は、本発明の実施例に係るプリン
ト配線基板の製造プロセスを模式的に示した断面図であ
る。
第２図（ａ）〜（ｂ）は、従来の積層工程とこれにより
得られた銅張り積層板の断面図である。
１・・・保持部材
２・・・離形性ワックス
３・・・ラミネートローラー
４・・・銅箔
５・・・粗化〜酸化処理面
６・・・絶縁材
７・・・ソルダーレジストFIGS. 1(a) to 1(i) are cross-sectional views schematically showing the manufacturing process of a printed wiring board according to an embodiment of the present invention. FIGS. 2(a) to 2(b) are cross-sectional views of a conventional lamination process and a copper-clad laminate obtained thereby. 1... Holding member 2... Release wax 3... Laminating roller 4... Copper foil 5... Roughened to oxidized surface 6... Insulating material 7... Solder resist
Claims
線基板の製造方法において、絶縁性保持部材に導電材料
を接合し、さらに前記導電材料に絶縁材料を積層形成し
、しかる後前記保持部材を剥離することにより除去する
ことを特徴とするプリント配線基板の製造方法。
記絶縁材料を積層形成する際に密着性を向上するための
粗化処理を施すことを特徴とする請求項１記載のプリン
ト配線基板の製造方法。
ニッケル等の金属材料を用いることを特徴とする請求項
１記載のプリント配線基板の製造方法。
脂を含浸したもの、補強剤としての紙に樹脂を含浸した
もの、又はセラミック焼結体を用いることを特徴とする
請求項１記載のプリント配線基板の製造方法。
け、この上に導電材料を圧着、蒸着、又はメッキするこ
とにより接合することを特徴とする請求項１記載のプリ
ント配線基板の製造方法。
熱と圧力を与えて半硬化状態の絶縁材料を溶融、硬化す
ることにより熱圧着形成することを特徴とする請求項１
記載のプリント配線基板の製造方法。
2. The method of manufacturing a printed wiring board according to claim 1, wherein a metal material such as nickel is used.
Claim 1 characterized in that the thermocompression bonding is performed by applying heat and pressure to melt and harden the insulating material in a semi-hardened state.
A method of manufacturing the printed wiring board described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17903289A JPH0344997A (en) | 1989-07-13 | 1989-07-13 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17903289A JPH0344997A (en) | 1989-07-13 | 1989-07-13 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0344997A true JPH0344997A (en) | 1991-02-26 |
Family
ID=16058921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17903289A Pending JPH0344997A (en) | 1989-07-13 | 1989-07-13 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0344997A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8000634B2 (en) | 2005-02-28 | 2011-08-16 | Brother Kogyo Kabushiki Kaisha | Image forming apparatus and cartridge |
-
1989
- 1989-07-13 JP JP17903289A patent/JPH0344997A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8000634B2 (en) | 2005-02-28 | 2011-08-16 | Brother Kogyo Kabushiki Kaisha | Image forming apparatus and cartridge |
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