JPH0343783B2 - - Google Patents
Info
- Publication number
- JPH0343783B2 JPH0343783B2 JP58172885A JP17288583A JPH0343783B2 JP H0343783 B2 JPH0343783 B2 JP H0343783B2 JP 58172885 A JP58172885 A JP 58172885A JP 17288583 A JP17288583 A JP 17288583A JP H0343783 B2 JPH0343783 B2 JP H0343783B2
- Authority
- JP
- Japan
- Prior art keywords
- module
- card
- layer
- resin
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W74/01—
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H10W70/699—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W74/00—
-
- H10W90/754—
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58172885A JPS6065552A (ja) | 1983-09-21 | 1983-09-21 | Icカードおよびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58172885A JPS6065552A (ja) | 1983-09-21 | 1983-09-21 | Icカードおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6065552A JPS6065552A (ja) | 1985-04-15 |
| JPH0343783B2 true JPH0343783B2 (index.php) | 1991-07-03 |
Family
ID=15950122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58172885A Granted JPS6065552A (ja) | 1983-09-21 | 1983-09-21 | Icカードおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6065552A (index.php) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6265270U (index.php) * | 1985-10-15 | 1987-04-23 | ||
| CN1079053C (zh) * | 1996-06-17 | 2002-02-13 | 三菱电机株式会社 | 制造薄ic卡的方法及其结构 |
| WO1997048562A1 (en) * | 1996-06-17 | 1997-12-24 | Mitsubishi Denki Kabushiki Kaisha | Method for producing thin ic cards and construction thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5113625A (ja) * | 1974-07-19 | 1976-02-03 | Kubota Ltd | Konbain |
-
1983
- 1983-09-21 JP JP58172885A patent/JPS6065552A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6065552A (ja) | 1985-04-15 |
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