JPH0343732U - - Google Patents

Info

Publication number
JPH0343732U
JPH0343732U JP10468989U JP10468989U JPH0343732U JP H0343732 U JPH0343732 U JP H0343732U JP 10468989 U JP10468989 U JP 10468989U JP 10468989 U JP10468989 U JP 10468989U JP H0343732 U JPH0343732 U JP H0343732U
Authority
JP
Japan
Prior art keywords
metal substrate
semiconductor element
bonding pad
electrically connected
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10468989U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10468989U priority Critical patent/JPH0343732U/ja
Publication of JPH0343732U publication Critical patent/JPH0343732U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/754—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP10468989U 1989-09-06 1989-09-06 Pending JPH0343732U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10468989U JPH0343732U (cg-RX-API-DMAC10.html) 1989-09-06 1989-09-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10468989U JPH0343732U (cg-RX-API-DMAC10.html) 1989-09-06 1989-09-06

Publications (1)

Publication Number Publication Date
JPH0343732U true JPH0343732U (cg-RX-API-DMAC10.html) 1991-04-24

Family

ID=31653476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10468989U Pending JPH0343732U (cg-RX-API-DMAC10.html) 1989-09-06 1989-09-06

Country Status (1)

Country Link
JP (1) JPH0343732U (cg-RX-API-DMAC10.html)

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