JPS62145337U - - Google Patents
Info
- Publication number
- JPS62145337U JPS62145337U JP1986032787U JP3278786U JPS62145337U JP S62145337 U JPS62145337 U JP S62145337U JP 1986032787 U JP1986032787 U JP 1986032787U JP 3278786 U JP3278786 U JP 3278786U JP S62145337 U JPS62145337 U JP S62145337U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- attached
- semiconductor device
- semiconductor
- electrically insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/681—
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W74/00—
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- H10W90/754—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986032787U JPH0739234Y2 (ja) | 1986-03-07 | 1986-03-07 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986032787U JPH0739234Y2 (ja) | 1986-03-07 | 1986-03-07 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62145337U true JPS62145337U (cg-RX-API-DMAC10.html) | 1987-09-12 |
| JPH0739234Y2 JPH0739234Y2 (ja) | 1995-09-06 |
Family
ID=30839797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986032787U Expired - Lifetime JPH0739234Y2 (ja) | 1986-03-07 | 1986-03-07 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739234Y2 (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6344745A (ja) * | 1986-08-11 | 1988-02-25 | Ibiden Co Ltd | 電子部品搭載用基板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5836500A (ja) * | 1981-08-28 | 1983-03-03 | マックス株式会社 | 製図ヘッドの符号化用ディスク取付装置 |
| JPS6218084A (ja) * | 1985-07-16 | 1987-01-27 | 新藤電子工業株式会社 | 半導体素子実装用プリント配線板の製造方法 |
| JPS6239032A (ja) * | 1985-08-14 | 1987-02-20 | Matsushita Electric Works Ltd | 電子素子用チツプキヤリア |
-
1986
- 1986-03-07 JP JP1986032787U patent/JPH0739234Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5836500A (ja) * | 1981-08-28 | 1983-03-03 | マックス株式会社 | 製図ヘッドの符号化用ディスク取付装置 |
| JPS6218084A (ja) * | 1985-07-16 | 1987-01-27 | 新藤電子工業株式会社 | 半導体素子実装用プリント配線板の製造方法 |
| JPS6239032A (ja) * | 1985-08-14 | 1987-02-20 | Matsushita Electric Works Ltd | 電子素子用チツプキヤリア |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6344745A (ja) * | 1986-08-11 | 1988-02-25 | Ibiden Co Ltd | 電子部品搭載用基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739234Y2 (ja) | 1995-09-06 |