JPH0342074A - Drying method - Google Patents
Drying methodInfo
- Publication number
- JPH0342074A JPH0342074A JP17558189A JP17558189A JPH0342074A JP H0342074 A JPH0342074 A JP H0342074A JP 17558189 A JP17558189 A JP 17558189A JP 17558189 A JP17558189 A JP 17558189A JP H0342074 A JPH0342074 A JP H0342074A
- Authority
- JP
- Japan
- Prior art keywords
- article
- organic solvent
- solvent
- speed
- pulling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 title claims abstract description 11
- 239000003960 organic solvent Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 13
- 238000009835 boiling Methods 0.000 claims description 5
- 239000002904 solvent Substances 0.000 abstract description 7
- 238000007654 immersion Methods 0.000 abstract description 3
- 150000001298 alcohols Chemical class 0.000 abstract description 2
- 150000002170 ethers Chemical class 0.000 abstract description 2
- 150000002576 ketones Chemical class 0.000 abstract description 2
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000013020 steam cleaning Methods 0.000 description 3
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 2
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＩＣ実装後のプリント基板に代表される物品
の乾燥方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for drying an article, typified by a printed circuit board, after IC mounting.
〔従来技術及び発明が解決しようとする課題〕各種の電
子機器に用いられるプリント基板は、その製造工程中に
ハンダ付は工程を有している。ハンダ付は工程ではハン
ダの接着性を良好にするために通常ロジン等の７ラツク
スが用いられている。こりフラックスは、回路腐食やＩ
Ｃの誤動作の原因と々るためハンダ付は工程の後に洗浄
によって除去される。[Prior Art and Problems to be Solved by the Invention] Printed circuit boards used in various electronic devices include a soldering process during their manufacturing process. In the soldering process, 7 lux, such as rosin, is usually used to improve the adhesion of the solder. Stiff flux can cause circuit corrosion and I
The solder is removed by cleaning after the process, as it may cause malfunction.
プリント基板の洗浄は１通常、水又は有機溶媒が用いら
れている。例えは、プリント基板を純水又はトリクロロ
エタン若しくはフロン−１１３等の有機溶媒中に浸漬す
る方法が採用されている。これらの方法によって上記σ
ノフラツクスは比較的良好に除去し得る。しかしながら
、プリント基板を有機溶媒中に浸漬する方法を採用した
場合、有機溶媒中から引き上げた後のプリント基板の表
面にしみが発生することがあった。また、プリント基板
を純水中に浸漬する洗浄方法を採用した場合にも、洗浄
後に水切りのために用いられる有機溶媒中にプリント基
板を浸漬した後引き上げると、上記と同機の問題が生じ
た。For cleaning printed circuit boards, water or an organic solvent is usually used. For example, a method has been adopted in which the printed circuit board is immersed in pure water or an organic solvent such as trichloroethane or Freon-113. By these methods, the above σ
Nofrax can be removed relatively well. However, when a method of immersing a printed circuit board in an organic solvent is adopted, stains may occur on the surface of the printed circuit board after it is lifted out of the organic solvent. Furthermore, even when a cleaning method was adopted in which the printed circuit board was immersed in pure water, the same problem as above occurred when the printed circuit board was immersed in an organic solvent used for draining water after cleaning and then pulled out.
上記り問題の対策としては、有機溶媒中から引き上げた
プリント基板に、さらに有機溶媒による蒸気洗浄を施す
という方法が採用されている。しかしながら、蒸気洗浄
を行なうとなると、−工程増えるために作業が繁雑にな
る上、設備上のコスト高になるといった欠点があった。As a countermeasure to the above-mentioned problem, a method has been adopted in which the printed circuit board taken out of the organic solvent is further subjected to steam cleaning using an organic solvent. However, steam cleaning has disadvantages in that the work becomes complicated due to the additional steps, and the equipment costs are high.
〔１！１題を解決するためり手段〕
本発明者らは、上記した課題を解決するために穂々検討
を加えた結果、洗浄又は水切りに使用する有機溶媒の温
度とプリント基板の有機溶媒中からの引き上げ速度とを
適当１ｘ値に選択することによって、プリント基板の表
面にしみな発生させることなく容易に乾燥させ得ること
を見出し、本発明を完成させるに至った。[1! Means for Solving Problem 1] As a result of extensive research in order to solve the above-mentioned problems, the present inventors found that the temperature of the organic solvent used for cleaning or draining and the organic solvent of the printed circuit board. The present inventors have discovered that by selecting an appropriate 1x value for the pulling speed from the inside, it is possible to easily dry the printed circuit board without causing stains on the surface thereof, and have completed the present invention.
即ち、本発明は、沸点より１０〜５０℃低い温度に保持
された有機溶媒中に物品を浸漬した後、該物品を５０α
／ａｍ以下の速度で有機溶媒中から引き上げることを特
徴とする物品の乾燥方法である。That is, in the present invention, after immersing an article in an organic solvent maintained at a temperature 10 to 50 °C lower than the boiling point, the article is heated to 50 α
This is a method for drying an article, which is characterized in that the article is pulled up from an organic solvent at a speed of less than /am.
本発明で用いられる有機溶媒は、使用条件下で液体であ
れば公知りものが（ｌ’Ｊら制限なく採用される。有機
溶媒は、沸点より１０〜５０℃低い温度に保持され、そ
の中に乾燥の対象である物品が浸漬される。従って、乾
燥の対象である物品が熱をきらう場合には、沸点があま
り高くない有機溶媒を採用することが好ましい。通常は
、沸点が５０〜９０℃の範囲である有板溶媒が好適に採
用される。本発明において特に好適な有機溶媒を具体的
に例示すると、メタノール、エタノール、イソプロパツ
ール及びブタノール等のアルコール類ニジメチルエーテ
ル、ジエチルエーテル等のエーテル類；アセトン、メチ
ルイソブチルケトン等のケトン類；トリクロロエタン、
ジクロロエタン等の塩素化炭化水素類；フロン−１１３
等の塩素化フッ素化炭化水素類等が挙げられる。The organic solvent used in the present invention may be any known organic solvent as long as it is liquid under the conditions of use (l'J et al., et al.). The article to be dried is immersed in the water. Therefore, if the article to be dried is sensitive to heat, it is preferable to use an organic solvent that does not have a very high boiling point. Usually, the boiling point is 50 to 90. ℃ range is preferably used.Specifically, particularly suitable organic solvents in the present invention include alcohols such as methanol, ethanol, isopropanol and butanol, dimethyl ether, diethyl ether, etc. Ethers; ketones such as acetone and methyl isobutyl ketone; trichloroethane,
Chlorinated hydrocarbons such as dichloroethane; Freon-113
Examples include chlorinated fluorinated hydrocarbons such as.
本発明において、上記の有機溶媒は、沸点よりｌＯ〜５
０℃低温度に保持されていなければｋらない。この状態
は有機溶媒が比較的揮発しやすい状態である。有機溶媒
の温度が上記範囲よりも低い場合には、後述する特定の
速度で物品を引き上げることによっても十分に乾燥させ
ることができず、一方、上記範囲よりも高い場合には、
有機溶媒中に気泡が発生し、該気泡の物品への付着によ
って洗浄又は水切りが不十分とｋるために好ましく々い
Ｏ
本発明においては、上記の温度範囲に保持された有１ａ
溶媒中に、乾燥の対象とｋる物品がまず浸漬される。浸
漬の時間は特に制限されたいが、物品の洗浄又は水切り
を十分に行たつためには通常１２０秒以上浸漬すること
が好ましい。In the present invention, the above-mentioned organic solvent has a boiling point of 10 to 5
If it is not kept at a low temperature of 0°C, it will not burn. In this state, the organic solvent is relatively easily volatilized. If the temperature of the organic solvent is lower than the above range, it will not be possible to sufficiently dry the article even by pulling up the article at a specific speed described below, whereas if it is higher than the above range,
This is preferable because air bubbles are generated in the organic solvent and adhesion of the air bubbles to the article may result in insufficient cleaning or draining.
The article to be dried is first immersed in the solvent. Although the immersion time is not particularly limited, it is usually preferable to immerse the article for 120 seconds or more in order to sufficiently wash or drain the article.
その後、有機溶媒中から物品が引き上げられるが、本発
明においてはその引き上げ速度を５０ｃｍ／ｍｍ以下に
することが会費である。Thereafter, the article is pulled up from the organic solvent, but in the present invention, the fee is to keep the pulling rate at 50 cm/mm or less.
引き上げ速度が上記値よりも大きい場合には、乾燥が不
十分となり、物品の表面にしみが発生する。物品り引き
上げ速度は、有機溶媒の温度が低いときには遅くするこ
とが好ましく、有機溶媒の温度が高いときには連くする
ことができる。引き上げ速度があまりに遅い場合には、
単位時間当りの処理能力が低くなるため、十分な乾燥と
処理能力とを考慮すると、一般には、１〜４０傷／ＩＩ
Ｉｍ、さらには５〜３０ｃｓ／■の範囲となるように有
機溶媒の温度条件との関係で引き上げ速度を決定するこ
とが好ましい。If the pulling rate is higher than the above value, drying will be insufficient and stains will appear on the surface of the article. It is preferable that the article lifting speed be slowed down when the temperature of the organic solvent is low, and can be increased when the temperature of the organic solvent is high. If the lifting speed is too slow,
Since the processing capacity per unit time is low, considering sufficient drying and processing capacity, generally 1 to 40 scratches/II
It is preferable to determine the pulling rate in relation to the temperature condition of the organic solvent so that Im is in the range of 5 to 30 cs/■.
尚、本発明における上記の物品は、鉛直方向に引き上げ
るのが通常である。しかし、鉛直方向にある角度をなす
方向に引き上げてもよく、そり場合り引き上げ速度は、
鉛直方向の速度成分で表わされる。Note that the above-mentioned article in the present invention is usually pulled up in the vertical direction. However, it may also be pulled up in a direction that forms a certain angle to the vertical direction, and the warping and pulling speed is
It is expressed as a velocity component in the vertical direction.
本発明の乾燥方法は、前記したＩＣ実装のプリント基板
に適用できるほか、シリコンウェハー、セラ主ツタ基板
、ガラス基板等の乾燥にも適用することができる。The drying method of the present invention can be applied not only to the above-mentioned IC-mounted printed circuit board, but also to drying silicon wafers, ceramic main vine substrates, glass substrates, and the like.
（効 果〕
本発明の乾燥方法によれば、有機溶媒中への浸漬及び引
き上げによって洗浄又は水切りされた物品を容易に乾燥
させることができ、有機溶媒中から引き上げた物品にし
みが発生することはない。こσノために、本発明によれ
は一槽で洗浄又は水９Ｊりと乾燥とを兼ねることができ
、従来のよった洗浄又は水切りりあとり蒸気洗浄は不要
とたり、工程の簡略化が可能とｋる。(Effects) According to the drying method of the present invention, articles that have been washed or drained by immersion in an organic solvent and pulled up can be easily dried, and stains do not occur on the articles pulled out of the organic solvent. For this reason, according to the present invention, one tank can be used for both cleaning or drying with 9 J of water, eliminating the need for conventional cleaning or steam cleaning after draining, and simplifying the process. It is possible to convert
以下に本発明の詳細な説明するために実施例及び比較例
を掲げるが、本発明はこれらの実施例に限定されるもり
ではない。Examples and comparative examples are listed below to explain the present invention in detail, but the present invention is not limited to these examples.
実施例
プリント基板を表１に示した温度のインプロピルアルコ
ール中に３分間浸漬した後、表１に示した速度で鉛直方
向に引き上げ、光学ＷＪａｔｓにより表面のしみの有無
を観察した。The printed circuit board of the example was immersed in inpropyl alcohol at the temperature shown in Table 1 for 3 minutes, then pulled up in the vertical direction at the speed shown in Table 1, and the presence or absence of stains on the surface was observed using optical WJats.
その結果を表１に示した。また、インプロピルアルコー
ルに力１えてエタノールを使用した場合についても上記
と同様に行ない、そり結果を表１に併記した。The results are shown in Table 1. Furthermore, the same procedure as above was carried out when ethanol was used instead of inpropyl alcohol, and the warping results are also shown in Table 1.
表 （注） ・は比較例である。table (note) * is a comparative example.
特許出駄人 偉山口達株式会社patent maker Izanguchi Tatsu Co., Ltd.
Claims (1)
溶媒中に物品を浸漬した後、該物品を５０ｃｍ／ｍｍ以
下の速度で有機溶媒中から引き上げることを特徴とする
物品の乾燥方法。(1) A method for drying an article, which comprises immersing the article in an organic solvent maintained at a temperature 10 to 50° C. lower than the boiling point, and then pulling the article out of the organic solvent at a speed of 50 cm/mm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17558189A JPH0342074A (en) | 1989-07-10 | 1989-07-10 | Drying method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17558189A JPH0342074A (en) | 1989-07-10 | 1989-07-10 | Drying method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0342074A true JPH0342074A (en) | 1991-02-22 |
Family
ID=15998589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17558189A Pending JPH0342074A (en) | 1989-07-10 | 1989-07-10 | Drying method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0342074A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020093211A (en) * | 2018-12-12 | 2020-06-18 | 株式会社ワールド機工 | Sealed-type washing device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61270399A (en) * | 1985-05-23 | 1986-11-29 | Seiko Epson Corp | Method for removing water after washing |
-
1989
- 1989-07-10 JP JP17558189A patent/JPH0342074A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61270399A (en) * | 1985-05-23 | 1986-11-29 | Seiko Epson Corp | Method for removing water after washing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020093211A (en) * | 2018-12-12 | 2020-06-18 | 株式会社ワールド機工 | Sealed-type washing device |
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