JPH0341756A - Connecting lead of circuit component - Google Patents

Connecting lead of circuit component

Info

Publication number
JPH0341756A
JPH0341756A JP17628089A JP17628089A JPH0341756A JP H0341756 A JPH0341756 A JP H0341756A JP 17628089 A JP17628089 A JP 17628089A JP 17628089 A JP17628089 A JP 17628089A JP H0341756 A JPH0341756 A JP H0341756A
Authority
JP
Japan
Prior art keywords
elastic absorbing
board
lead
connection lead
make
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17628089A
Other languages
Japanese (ja)
Inventor
Mika Kawa
香和　美加
Yoshiyuki Mizumo
義之 水藻
Shunji Oku
奥　俊二
Masayuki Yoshii
雅之 吉井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Minolta Co Ltd
Original Assignee
Minolta Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minolta Co Ltd filed Critical Minolta Co Ltd
Priority to JP17628089A priority Critical patent/JPH0341756A/en
Publication of JPH0341756A publication Critical patent/JPH0341756A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Landscapes

  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To make it possible to absorb stress such as bending and external shock in connecting circuit components such as ICs and a board, to improve the mounting efficiency of the circuit components on the board and to make it possible to make a device compact by providing elastic absorbing parts which can be expanded and contracted freely for connecting leads. CONSTITUTION:A U-shaped elastic absorbing part is provided at a connecting part, or an S-shaped elastic absorbing part is provided. When the elastic absorbing part having an allowance for free expansion and contraction is provided at the connecting lead 2 in this way, stress can be absorbed in the connecting lead 2 even if an IC 1 is provided at a bending part and the stress due to the bending occurs. Separating force is not applied to the contact part between the connecting lead 2 and a pattern part 3 of a flexible board 4. The elastic absorbing parts can be provided for both of two connecting leads. The elastic absorbing part can be provided at one lead.

Description

【発明の詳細な説明】 （産業上の利用分野〉 本発明は、基板と回路部品を接続する接続リードに関す
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a connection lead for connecting a board and a circuit component.

（従来の技術） カメラの回路基板にＩＣ等の部品を搭載する場合、第４
図に示すように、フレキシブル基板４の曲げ部付近に組
み込むと１曲げの応力により、ＩＣ１の接続リード２を
フレキシブル基板４から外そうとする力が働く、シかし
、第６［２Ｉに示すように、従来の接続リード２は弾性
吸収部を設けていないために、外部からの力を吸収する
ことができない、そのために上記のようにＩＣＩの接続
り−１２をフレキシブル基板４から外そうとする力が働
いた場合、接続リード２がフレキシブル基板４から外れ
てしまうと云う問題があった。従って、従来は第５図に
示すように、平坦な部分にＩＣＩを搭載していたので、
搭載箇所が制限され、搭載効率の向上が図れず、カメラ
の小型化をＩｉＩ！害していたと云う問題があった。(Prior art) When mounting components such as ICs on the circuit board of a camera, the fourth
As shown in the figure, when the IC 1 is assembled near the bending part of the flexible substrate 4, the stress of one bend causes a force that tries to detach the connection lead 2 of the IC 1 from the flexible substrate 4. As the conventional connection lead 2 does not have an elastic absorption part, it cannot absorb external force. Therefore, as described above, it is necessary to remove the ICI connection 12 from the flexible substrate 4. There is a problem in that when such force is applied, the connection lead 2 may come off from the flexible substrate 4. Therefore, conventionally, the ICI was mounted on a flat part as shown in Figure 5.
The mounting location is limited, and the mounting efficiency cannot be improved, making it difficult to downsize the camera! There was a problem that it was being damaged.

（発明が解決しようとする課題） 本発明は、曲げ部のような箇所にでも、回路部品が搭載
できるようにして、基板に対する回路部品の搭載効率の
向上を図り、カメラの小型（ヒを可能にしようとするも
のである。(Problems to be Solved by the Invention) The present invention improves the mounting efficiency of circuit components on a board by making it possible to mount circuit components even in places such as bent portions, thereby making it possible to reduce the size of the camera. This is what we are trying to do.

（課題を解決するための手段） 基板と回路部品とを接続する接続リードにおいて、中間
部に０字状或はＳ字状の弾性吸収部を設けた。(Means for Solving the Problems) In a connection lead that connects a board and a circuit component, a 0-shaped or S-shaped elastic absorption part is provided in the middle part.

（作用） 本発明は、接続リードに上下左右に伸縮自在の弾性吸収
部を設けることで、基板にＩＣ等の回路部品を接続する
時に、基板と回路部品との位置間１系に変化があっても
、その変化によって生じるタト力を上記弾性吸収部によ
って吸収することが可能となり、基板と接続リードとの
接続力を一定に保つことができると云うものであり、こ
のことにより、基板に設置する回路部品の位置の制限が
なくなり、基板の部品搭載効率を向上させることができ
るようになった。(Function) By providing the connection lead with an elastic absorbing portion that can be expanded and contracted vertically and horizontally, the present invention prevents a change in the positional system between the board and the circuit component when connecting a circuit component such as an IC to the board. However, the elastic absorption part can absorb the force caused by the change, and the connection force between the board and the connection lead can be kept constant. This eliminates restrictions on the location of circuit components, making it possible to improve the efficiency of mounting components on the board.

（実施例） 第１図に本発明の一実施例を示す、第１図において、ｌ
はＩＣ１２はＩＣＩの端子部とフレキシブル基板４のパ
ターン部３とを接続する接続リード、５はフレキシブル
基板４を保持するカメラボディー等の筐体である。(Example) FIG. 1 shows an example of the present invention.
IC12 is a connection lead that connects the terminal portion of the ICI and the pattern portion 3 of the flexible substrate 4, and 5 is a housing such as a camera body that holds the flexible substrate 4.

第２図及び第３図を用いて、本発明の主体である接続リ
ード２の説明を行う、第２図は接続リードに０字状の弾
性吸収部を設けたものであり、第３図はＳ字状に弾性吸
収部を設けたものである。The connection lead 2, which is the main subject of the present invention, will be explained using FIGS. 2 and 3. FIG. 2 shows the connection lead provided with a 0-shaped elastic absorption part, and FIG. This is an S-shaped elastic absorbing section.

このように接続リード２に伸縮自在のゆとりを持った弾
性吸収部を設けると、第１図に示すように、曲げ部の所
にＩＣＩを設置しても、曲げによる応力が発生しても、
接続リード２内で応力を吸収することができるので、接
続リード２とフレキシブル基板４のパターン部３との接
触部に外すような力がかからなくなる。なお、弾性吸収
部は、２本の接続リードの双方に設けても良いし、片方
だけに設けるものであってもかまわない。If the connecting lead 2 is provided with an elastic absorbing section that has a flexible elasticity, as shown in FIG.
Since stress can be absorbed within the connection lead 2, no force is applied to the contact portion between the connection lead 2 and the pattern portion 3 of the flexible substrate 4 to cause the connection lead 2 to come off. Note that the elastic absorbing portion may be provided on both of the two connection leads, or may be provided on only one of the two connection leads.

〈発明の効果〉 本発明によれば、接続リードに伸縮自在の弾性吸収部を
設けたことにより、ＩＣ等の回路部品と基板との接続に
おいて、曲げ等の応力や外的ショックを弾性吸収部で吸
収することが可能になり。<Effects of the Invention> According to the present invention, by providing the connection lead with a stretchable elastic absorbing portion, the elastic absorbing portion absorbs stress such as bending and external shock when connecting a circuit component such as an IC to a board. It becomes possible to absorb it.

基板における回路部品のｔｒｉｍ効率が向上し、装置の
小型化が可能になった。The efficiency of trimming circuit components on the board has improved, making it possible to downsize the device.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例の１ｌｌ１７ｉ面図、第２図
はＩＣに本発明の接続リードを接続した側面図、第３図
はＩＣに本発明の上記とは別形状の接続リードを接続し
た側面図、第４図は開げ部にＩＣを設置した時の従来例
のＩＩＩＩｔｌｒ面図、第５図は平坦部にＩＣを設置し
た時の従来例の側断面図、第２図はＩＣに従来例の接続
リードを接続した側面図である。 １・・・ＩＣ１２・・・接続リード、３・・・パターン
部、・・フレキシブル基板、５・・・筐体。Fig. 1 is a 1ll17i side view of an embodiment of the present invention, Fig. 2 is a side view of the connection lead of the present invention connected to an IC, and Fig. 3 is a side view of the connection lead of the present invention connected to the IC. The connected side view, Figure 4 is a IIItlr side view of the conventional example when the IC is installed in the opening, Figure 5 is a side sectional view of the conventional example when the IC is installed in the flat area, and Figure 2 is the side view of the conventional example when the IC is installed in the flat area. FIG. 2 is a side view of a conventional connection lead connected to an IC. 1... IC12... Connection lead, 3... Pattern part,... Flexible board, 5... Housing.

Claims (1)

【特許請求の範囲】[Claims] 中間部をＵ字形或はＳ字形としたことを特徴とする回路
部品の接続リード。A connection lead for circuit components, characterized in that the middle part is U-shaped or S-shaped.
JP17628089A 1989-07-07 1989-07-07 Connecting lead of circuit component Pending JPH0341756A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17628089A JPH0341756A (en) 1989-07-07 1989-07-07 Connecting lead of circuit component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17628089A JPH0341756A (en) 1989-07-07 1989-07-07 Connecting lead of circuit component

Publications (1)

Publication Number Publication Date
JPH0341756A true JPH0341756A (en) 1991-02-22

Family

ID=16010823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17628089A Pending JPH0341756A (en) 1989-07-07 1989-07-07 Connecting lead of circuit component

Country Status (1)

Country Link
JP (1) JPH0341756A (en)

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