JPH0341477Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field This invention relates to a heat sink used for cooling semiconductor elements and heat collecting circuit ICs.

Conventional technology Conventionally, semiconductor elements and heat collecting circuits used in electronics-related products such as audio amplifiers and OA equipment have been attached to heat sinks made of aluminum (including aluminum alloys). For example, the container is shown in Figure 5~
As shown in FIG. 7, a large number of tongue-like fins 12 are cut and raised on one side of the plate-shaped base 11 by one cutting blade 17 of a cutting machine, and a heat-generating material such as a semiconductor element is formed on the other side. 13 was attached with a tuft pin screw 14. The plate-shaped base 11 has a thickness of, for example, about 3.3 to 3.6 mm in order to form an effective threaded portion that engages with such a tuft pin screw 14, which requires a large amount of material for the radiator and increases costs. There was a problem. Therefore, the conventional plate-shaped base 11 has a single blade 17 as shown in FIG.
It was considered that the effective thread part of the mounting screw 14 would be too short, resulting in a thread failure, and the heat-generating material 13 such as a semiconductor element could be cut into a thickness of about 2.2 mm, for example, on the base 11. There was a problem that it could not be firmly fixed.

Purpose of the invention The purpose of this invention is to solve the above-mentioned problems and provide a heat sink that can securely fix heat-generating objects such as semiconductor elements with screws, is lightweight, and has low manufacturing costs. It is in.

Structure of the Device In order to achieve the above-mentioned object, this device has a thick portion having a thickness that can form a female screw portion for mounting a heat generating element such as a semiconductor element, and a thick portion having a thinner thickness and having at least one side. The gist of the heat radiator is a radiator that includes a plate-like base made of a thin-walled portion formed by cutting and raising tongue-like fins.

Embodiment Next, an embodiment of this invention will be described based on the drawings.

In FIGS. 1 and 2 showing a first embodiment of this invention, the heat sink according to this invention has a thick part 1a having a thickness that can form a female threaded part 6 for screwing in a heat generating object such as a semiconductor element, It has a plate-like base 1 having a thickness smaller than this and having a thin part 1b formed by cutting and raising tongue-like fins 2 on one side. A heating element 3, such as a semiconductor element, is closely attached to the base 1 by screwing, for example, a tuft pin screw 4 into a pilot hole 5 made in the thick portion 1a of the plate-like base 1. The female threaded part 6 formed by screwing in the tatsupin screw 4 has a length that allows the tatsupin screw 4 to be screwed in effectively, and therefore the thick part 1a has a thickness of about 3.3 to 3.6 mm. ing. On the other hand, the thin portion 1b has a thickness of about 2.2 mm, thereby making it possible to reduce the weight and cost of the heat sink. Plate base 1
A pair of fixing legs 8, 8 are provided at the lower end of the holder.

For example, as shown in FIG. 3, the radiator is made by cutting the fins 2 of the fin-up surface of the radiator material made of extruded aluminum material with two blades 7, 7, leaving the center part, as seen from the front. It is manufactured by raising it up, and the uncut portion at the center is the thick wall portion 1a, and the cut portion is the thick wall portion 1b.

FIG. 4 shows a second embodiment of this invention. Here, the difference from the first embodiment is that the upper and lower side edges of the plate-shaped base 1 are thick-walled parts 1a,
1a, and the intermediate portion thereof is a thin portion 1b. Since the other points of this second embodiment are the same as those of the first embodiment, the same parts are given the same reference numerals in the drawings.

Incidentally, in each of the above embodiments, a tuft pin screw 4 is used, but it is of course possible to use a small screw.

Further, in each of the above embodiments, the tongue-like fin 2 is provided on one side of the thin wall portion 1b on which the heating element 3 is not attached, but even on the side where the heating element 3 is attached, In some cases, tongue-like fins 2 are provided in the portions other than the fins.

As described above, the heat sink according to this invention has a thick part 1a having a thickness that can form the female screw part 6 for attaching a heat generating element such as a semiconductor element, and a tongue-shaped part having a thickness thinner than this part 1a and having a tongue-like shape on at least one side. Since it is equipped with a plate-like base 1 consisting of a thin wall portion 1b formed by cutting and raising the fins 2,
It is possible to significantly reduce the weight and cost of the heat sink, and the heat generating element 3 such as a semiconductor element can be securely fixed to the base 1 with the screw 4.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a heat radiator showing a first embodiment of this invention, showing a state before a heat generating element such as a semiconductor element is attached. FIG. 2 is a partially enlarged horizontal longitudinal sectional view of the heat radiator, showing the state after the heat generating element is attached.
FIG. 3 is a perspective view of the heat radiator in a state where the tongue-like fins are cut and raised. FIG. 4 is a perspective view of a heat radiator showing a second embodiment of this invention, showing the state after the heat generating element is attached. FIG. 5 is a perspective view of a conventional heat radiator, showing a state before a heat generating element is attached. FIG. 6 is a partially enlarged plan view of the heat radiator, showing the state after the heat generating element is attached. FIG. 7 is a perspective view of the heat radiator in a state where the tongue-like fins are cut and raised. 1... plate-shaped base, 2... tongue-shaped fin, 3...
Heat-generating substances such as semiconductor elements, 4... Tatsu pin screws, 6...
...Female thread part.

Claims (1)

[Scope of utility model registration request] A thick wall portion 1a having a thickness capable of forming a female threaded portion 6 for screwing in a screw for attaching a heat generating element such as a semiconductor element, and a thin wall portion having a thickness thinner than this and formed by cutting and raising tongue-like fins 2 on at least one side. 1b
A radiator comprising a plate-like base 1 consisting of.