JPS633163Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a heat sink structure for cooling a bursting element mounted on an electronic device.

Conventional heat sinks have been formed by extruding aluminum material, as shown in FIGS. 1a, b, and c. That is, both the fins 1 and the base 2 of the heat sink were made by extruding and forming aluminum material. However, the increasing density of components in electronic devices
With the increase in heat generation density, there are many cases where heat sinks such as those shown in FIGS. 1a, b, and c cannot cope with the problem as described below. In other words, in order to lower the temperature of the heating element, it is necessary to widen the surface area of the heat sink, but due to the manufacturing method of heat sinks made of extruded aluminum, there are limits to the thickness and spacing of the fins, so it is difficult to use within a limited volume. Due to surface area limitations, power consumption limits had to be lowered to keep the temperature of electronic components below a specified value. This goes against the above requirement,
To meet these demands, heat sinks with large surface areas within small volumes have become necessary.

Figures 1a, b, and c are perspective, front, and side views of an example of a conventional heat sink, and the dimensions shown in the figures are for an example constructed by extrusion of aluminum. This heatsink has a height of 15
The fin 1 has a thickness of 1.5 mm and a height of 11.5 mm.
mm, with intervals of 5 mm, base 2
has a thickness of 3.5mm. Therefore, on base 2 there are 11
It consists of fins 1, and the surface area is 15150
mm ² . The fin efficiency of this heat sink is 98-99%.

FIG. 2 shows an embodiment of the heat sink shown in FIG. 1, in which a heat sink consisting of fins 1 and a base 2 is bonded with adhesive 3 to a substrate 4 on which a heat generating element 5 is mounted, and the heat generated by the heat generating element 5 is transferred to the heat sink. Heat is radiated by

As described above, conventional heat sinks have the disadvantage that a heat sink with a sufficient surface area cannot be constructed within a predetermined volume. Furthermore, when attempting to reduce the thermal resistance between the heat sink and the substrate, thermal distortion occurs due to the difference in coefficient of thermal expansion, resulting in the disadvantage that the substrate 4 is likely to crack or peel.

The present invention provides a heat sink with sufficient surface area within a given volume.

The heat sink of the present invention consists of a single metal plate with multiple rectangular slits formed in it, and a base formed by bending it to keep it flat, and a comb-like shape by bending it perpendicular to the base. a plurality of fins formed therein, and the slit is continuous from the base to the fins.

Next, the present invention will be explained in detail with reference to the drawings.

FIGS. 3a, 3b, and 3c show a top view, front view, and side view of an embodiment of the present invention, which is a heat sink formed by bending a metal plate. This heat sink is realized with approximately the same volume as the heat sinks shown in FIGS. 1a, b, and c. The heat sink is made by bending a 0.15 mm copper plate so that the interval between the fins 1 is 3.8 mm, and its volume is 15 mm in height, 50 mm in length, and 51 mm in width, which is slightly smaller than the one shown in FIG. The thickness of the fins of this heat sink is 0.3 mm, the height is 14.85 mm, and the number of fins 1 is 14. Furthermore, four slits 6 are cut in the base 2. The gap between the fins of this heat sink is 3.5 mm, which is the same as that in Figure 1. The surface area of this heat sink is
The efficiency of 23290 mm ² fins is 95-97%, and the heat sinks shown in Figure 3 a, b, c are the same as those shown in Figure 1 a, b,
It has a surface area approximately 1.5 times larger than that of the heat sink shown in c, and a fin efficiency of 95% or more is sufficient. That is, the thermal resistance with respect to the refrigerant becomes approximately 1/1.5, and it becomes possible to apply 1.5 times the power consumption to the heating element 4.
Furthermore, if the fin spacing is made smaller as shown in FIGS. 3a, b, and c, the surface area increases and higher power can be applied.
When a heat sink is bonded to the surface of the heating element 4, if the slit 6 is provided, thermal strain caused by the difference in thermal expansion coefficients can be reduced, and the heat sink can be bonded and used as required.

As explained above, the present invention uses a thin metal plate bent into a comb-like shape as a heat sink, which allows the heat generating element to handle higher power.Furthermore, by providing a slit in the base, the heat sink can be placed on the surface of the heat generating element. It has the effect of reducing thermal distortion when bonded together.

[Brief explanation of the drawing]

Figures 1a, b, and c are respectively a perspective view, a front view, and a side view of a conventional example; Figure 2 is a front view of the mounting example of the heat sink shown in Figure 1; Figures 3a, b,
c are a top view, a front view, and a side view of an embodiment of the present invention, respectively. 1...Fin, 2...Base, 3...Adhesive,
4...Substrate, 5...Heating element, 6...Slit.

Claims (1)

[Scope of claim for utility model registration] A base made of a single metal plate with a plurality of rectangular slits formed by bending it to maintain a flat surface;
A heat sink structure comprising: a plurality of fins bent perpendicularly to the base to form a comb tooth shape; and the slits are continuous from the base to the fins.