JPH0339854U - - Google Patents
Info
- Publication number
- JPH0339854U JPH0339854U JP10135589U JP10135589U JPH0339854U JP H0339854 U JPH0339854 U JP H0339854U JP 10135589 U JP10135589 U JP 10135589U JP 10135589 U JP10135589 U JP 10135589U JP H0339854 U JPH0339854 U JP H0339854U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- jig
- sectional
- view
- taken along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案実施例に係る半導体パツケー
ジのリードピン保護用治具を示す平面図、第１図
ｂは同図ａ中Ａ部の拡大図である。第２図は第１
図ａ中のＢ−Ｂ線断面図である。第３図はピン孔
の他の実施例を示す部分拡大断面図である。第４
図ａ，ｂは本考案の治具の使用方法を説明するた
めの断面図、第５図は本考案の治具をＰＧＡパツ
ケージに取り付けた状態を示す部分拡大断面図で
ある。第６図〜第９図は本考案の治具における半
導体パツケージとの取付手段のさまざまな実施例
を示しており、第６図ａ、第７図ａ、第８図ａは
それぞれ平面図、第６図ｂは同図ａ中のＣ−Ｃ線
断面図、第７図ｂは同図ａ中のＤ−Ｄ線断面図、
第８図ｂは同図ａ中のＥ−Ｅ線断面図、第９図ａ
は分解斜視図、第９図ｂは部分断面図である。
１０……治具、１１……貫通孔、１２……ピン
孔、１３……溝、１４……取付具、１５……ボル
ト、１６……固定具、１７……ボルト、１８……
スライド固定具、１９……偏心回転体、２０……
カバー、２１……留具、３０……ＰＧＡパツケー
ジ、３１……リードピン。
FIG. 1a is a plan view showing a jig for protecting lead pins of a semiconductor package according to an embodiment of the present invention, and FIG. 1b is an enlarged view of section A in FIG. 1a. Figure 2 is the first
It is a sectional view taken along the line BB in figure a. FIG. 3 is a partially enlarged sectional view showing another embodiment of the pin hole. Fourth
Figures a and b are cross-sectional views for explaining how to use the jig of the present invention, and Fig. 5 is a partially enlarged cross-sectional view showing the jig of the present invention attached to a PGA package. 6 to 9 show various embodiments of the mounting means for the semiconductor package in the jig of the present invention, and FIG. 6a, FIG. 7a, and FIG. 8a are plan views, respectively. Figure 6b is a sectional view taken along the line CC in Figure a, Figure 7b is a sectional view taken along the line D-D in Figure A,
Figure 8b is a sectional view taken along the line E-E in Figure 9a, Figure 9a
9 is an exploded perspective view, and FIG. 9b is a partial sectional view. 10...Jig, 11...Through hole, 12...Pin hole, 13...Groove, 14...Mounting tool, 15...Bolt, 16...Fixing tool, 17...Bolt, 18...
Slide fixture, 19... Eccentric rotating body, 20...
Cover, 21...fastener, 30...PGA package cage, 31...lead pin.
Claims (1)
パツケージのリードピン配置に対応した複数のピ
ン孔を備え、かつ半導体パツケージとの取付手段
を具備したことを特徴とする半導体パツケージの
リードピン保護用治具。 A jig for protecting lead pins of a semiconductor package, which is made of a ceramic plate-like body, has a plurality of pin holes corresponding to the lead pin arrangement of a PGA type semiconductor package, and has means for attaching to the semiconductor package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989101355U JP2510569Y2 (en) | 1989-08-30 | 1989-08-30 | Jig for protecting lead pin of semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989101355U JP2510569Y2 (en) | 1989-08-30 | 1989-08-30 | Jig for protecting lead pin of semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0339854U true JPH0339854U (en) | 1991-04-17 |
| JP2510569Y2 JP2510569Y2 (en) | 1996-09-11 |
Family
ID=31650313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989101355U Expired - Lifetime JP2510569Y2 (en) | 1989-08-30 | 1989-08-30 | Jig for protecting lead pin of semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2510569Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006199520A (en) * | 2005-01-18 | 2006-08-03 | Zikusu Kogyo Kk | Ceramic tool and method of manufacturing the same |
| US7887899B2 (en) | 2005-08-25 | 2011-02-15 | Sumitomo Electric Industries, Ltd. | Anisotropic conductive sheet, production method thereof, connection method and inspection method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62274646A (en) * | 1986-05-22 | 1987-11-28 | Nec Corp | Terminal correcting jig |
| JPS6447050U (en) * | 1987-09-16 | 1989-03-23 |
-
1989
- 1989-08-30 JP JP1989101355U patent/JP2510569Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62274646A (en) * | 1986-05-22 | 1987-11-28 | Nec Corp | Terminal correcting jig |
| JPS6447050U (en) * | 1987-09-16 | 1989-03-23 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006199520A (en) * | 2005-01-18 | 2006-08-03 | Zikusu Kogyo Kk | Ceramic tool and method of manufacturing the same |
| US7887899B2 (en) | 2005-08-25 | 2011-02-15 | Sumitomo Electric Industries, Ltd. | Anisotropic conductive sheet, production method thereof, connection method and inspection method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2510569Y2 (en) | 1996-09-11 |