JPH0339204A - Processing method of ceramic material - Google Patents

Processing method of ceramic material

Info

Publication number
JPH0339204A
JPH0339204A JP17494789A JP17494789A JPH0339204A JP H0339204 A JPH0339204 A JP H0339204A JP 17494789 A JP17494789 A JP 17494789A JP 17494789 A JP17494789 A JP 17494789A JP H0339204 A JPH0339204 A JP H0339204A
Authority
JP
Japan
Prior art keywords
main surface
cut
ceramic
vinyl tape
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17494789A
Other languages
Japanese (ja)
Inventor
Yoshihiro Nimata
二俣 義浩
Takeo Sasaki
佐々木 丈夫
Yoshihiro Ohinata
大日向 義宏
Hiroshi Sasaki
博 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP17494789A priority Critical patent/JPH0339204A/en
Publication of JPH0339204A publication Critical patent/JPH0339204A/en
Pending legal-status Critical Current

Links

Landscapes

  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

PURPOSE:To mass-produce ceramic spacers highly precisely and inexpensively, by a method wherein after fixation of a forced out end part of a vinyl tape stuck to a main surface of a ceramic body to a holding board and cut of a small piece on the other surface is formed down to a depth of at least 90% of a thickness of a ceramic sheet. CONSTITUTION:A vinyl tape 3 is stuck to a main surface of a ceramic sheet whose both surfaces are ground, both sides of the ceramic sheet are forced out from a work 1 and fixed to a magnetic chuck 5 while pressing the work 1 with a block 4. The work 1 is fixed with adhesion of the tape 3 and pressure of the block 4. Then a cut 6 is formed in aimed size into the other side main surface 7 with a cutter. A depth of the cut is made at least 90% of a thickness of the work, especially about 90-95%. then the other main surface 7 is ground, the cut 6 is exposed and divided into small pieces 8 which are in aimed size.

Description

【発明の詳細な説明】 【a業上の利用分野] 本発明はセラミックス材料の加工方法に関する。詳しく
は、微細で高精度を要する電子材料焼成用スペーサなど
のセラミックスの小ピースをセラミックス板から効率よ
く切り出して製造する方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application in Industry] The present invention relates to a method for processing ceramic materials. More specifically, the present invention relates to a method for efficiently cutting out and manufacturing small pieces of ceramics, such as spacers for firing electronic materials, which are fine and require high precision, from a ceramic plate.

[従来の技術] PLZT等の電子材料などを焼成する場合、被焼成物を
セッターと称される棚板状部材の上に並べ、該セッター
を積み重ねて焼成炉中に装入して焼成を行なうようにし
ている。この際、各セッターの間にはスペーサを介在さ
せ、セッターの間に適当な間隙があくようにする。この
種のスペーサとしては、セラ稟ツクス製の棒状体や片状
体などの小ピースが用いられている。
[Prior Art] When firing electronic materials such as PLZT, the objects to be fired are arranged on a shelf-like member called a setter, and the setters are stacked and charged into a firing furnace to perform firing. That's what I do. At this time, a spacer is interposed between each setter so that an appropriate gap is left between the setters. As this type of spacer, small pieces such as rod-shaped bodies or pieces made of ceramics are used.

従来、このセラ主ツクス製の小ピースは、1個ずつプレ
ス成形又は押出成形したものをカットして焼成すること
により製造されることが多い。
Conventionally, small pieces made of ceramics are often manufactured by press-molding or extrusion molding one by one, cutting the pieces, and then firing them.

【発明が解決しようとする課lit!]上記従来の製造
方法では製造された小ピースの精度が低いという問題が
あった。また、焼成品を加工して高精度仕上げする場合
、スペーサが小さい程、手間がかかり、かつ被加工対象
物を固定するブロックも適当なものがなかった。なお、
大量製造の装置ではバキュームチャックなどの治具があ
るが、相当高価な装置となり、経済的コストは合わない
[The problem that the invention aims to solve! ] The conventional manufacturing method described above has a problem in that the precision of the small pieces manufactured is low. Furthermore, when processing a fired product to achieve a high-precision finish, the smaller the spacer, the more time and effort it takes, and there is no suitable block for fixing the workpiece. In addition,
For mass production equipment, there are jigs such as vacuum chucks, but these are fairly expensive equipment and are not economically viable.

以上より比較的小さなセラミックス素材の加工には、コ
スト高がさけられない状況となっていた。
As described above, processing of relatively small ceramic materials has become unavoidable due to high costs.

本発明は、大規模な装置を用いず既存の設備でしかも、
効率的に、安価にスペーサを製造する方法を提供するこ
とを目的とする。
The present invention does not require large-scale equipment and can be done using existing equipment.
It is an object of the present invention to provide a method for efficiently manufacturing spacers at low cost.

[課題を解決するための手段] 本発明は、セラミックス板を加工して多数の小ピースを
製造する方法において、セラミックス体の一方の主面に
ビニールテープを貼着すると共に、このビニールテープ
の端部をセラミックス板からはみ出させ、このはみ出た
部分を保持盤に固定した後、他方の面から切り出すべき
小ピースの大きさに対応する切込を、セラミックス板の
厚さの90%以上の深さにまで形成し、次いでセラミッ
クス板を保持盤から剥し、他方の主面にビニールテープ
を貼着すると共に、このビニールテープの端部をセラミ
ックス板からはみ出させ、このはみ出た部分を保持盤に
固定した後、該他方の主面を研削し、前記切込が該他方
の主面に現われるまでこの研削を行うことによりセラミ
ックス板を小ピースに分割することを特徴とするもので
ある。
[Means for Solving the Problems] The present invention provides a method for manufacturing a large number of small pieces by processing a ceramic plate, in which a vinyl tape is attached to one main surface of a ceramic body, and an edge of the vinyl tape is attached to one main surface of a ceramic body. After protruding from the ceramic plate and fixing this protruding part to the holding plate, make a cut corresponding to the size of the small piece to be cut out from the other side to a depth of at least 90% of the thickness of the ceramic plate. The ceramic plate was then peeled off from the holding plate, a vinyl tape was affixed to the other main surface, the end of the vinyl tape was allowed to protrude from the ceramic plate, and this protruding part was fixed to the holding plate. After that, the other main surface is ground, and this grinding is performed until the cut appears on the other main surface, thereby dividing the ceramic plate into small pieces.

[作用] 本発明の加工方法をその作用と共に詳細に説明すると次
の通りである。
[Function] The processing method of the present invention will be explained in detail together with its function as follows.

先ず、必要に応じセラミックスの平板(以下、ワークと
いうことがある。)の上下両面を研磨し、一方の主面に
ビニールテープを張りつける。
First, if necessary, both the top and bottom of a ceramic flat plate (hereinafter referred to as the work) are polished, and vinyl tape is attached to one main surface.

この際、ビニールテープを端部をワークからはみ出させ
、このはみ出た部分を鉄ブロック等により、平面研削盤
のマグネチックチャックの台等の保持盤上に固定する。
At this time, the end of the vinyl tape is allowed to protrude from the workpiece, and this protruding portion is fixed onto a holding plate such as the base of a magnetic chuck of a surface grinder using an iron block or the like.

次に適当なサイズにカッター等を用いて切り込みを入れ
るが、このとき、ワークの厚さの10%以下、好ましく
は5〜10%を切り残しておく。
Next, a cut to an appropriate size is made using a cutter or the like, but at this time, 10% or less of the thickness of the workpiece, preferably 5 to 10%, is left uncut.

次にワークを保持盤からとり外し、他方の主面に同様の
ビニールテープを張りつけ、同様にしてマグネチックチ
ャックの台等の保持盤上にブロック等で固定する。
Next, the workpiece is removed from the holding plate, a similar vinyl tape is applied to the other main surface, and the workpiece is similarly fixed on a holding plate such as the base of a magnetic chuck with a block or the like.

続いて、該他方の主面を切り残し分だけ研削し、前記切
込を該他方の主面に露出させることにより、平板状のセ
ラミックスを各小ピースに分割する。これにより、目的
とするスペーサ等の小ピースを得ることができる0本発
明方法によると、この小ビーズの大きさは、立方形状で
は0.5mm角まで製造することができる。
Subsequently, the other main surface is ground by the amount left uncut to expose the cuts on the other main surface, thereby dividing the flat ceramic into small pieces. According to the method of the present invention, the size of the small beads can be up to 0.5 mm square in a cubic shape.

(0,5mm角以下では、テープの粘着力とワークの接
着面積の関係から、研削中にワークが動いてしまい、固
定が難しいことが多い、)角柱形状ではアスペクト比2
以下まで容易に製造できる。
(If the size is less than 0.5 mm square, the workpiece will move during grinding due to the relationship between the adhesive strength of the tape and the adhesion area of the workpiece, and it is often difficult to fix it.) For prismatic shapes, the aspect ratio is 2.
The following can be easily manufactured.

本発明で用いるビニールテープは市販のものでよく、テ
ープ素材は硬めの0.1mm厚前後のものがよい。
The vinyl tape used in the present invention may be commercially available, and the tape material is preferably a hard material with a thickness of about 0.1 mm.

本発明では、最大200mmx150mm程度の大きさ
のセラミックス板まで加工することができる。
According to the present invention, it is possible to process ceramic plates up to a maximum size of about 200 mm x 150 mm.

[実施例] 以下、図面を用いて実施例を説明する。[Example] Examples will be described below with reference to the drawings.

本実施例方法では、まずセラミックス板(ワーク)1の
両面を研削する。なお、この際、一方の主面2はテープ
が付く程度に研削すればよい。
In the method of this embodiment, first both sides of the ceramic plate (work) 1 are ground. In addition, at this time, one main surface 2 may be ground to the extent that the tape is attached.

次に、第1図の如く、ビニールテープ3を該−方の主面
に張り、両サイドをワーク1よりはみ出させ、ブロック
4でワーク1を押えながら、マグネチックチャック5に
固定する。ワーク1はテープ3の粘着力と、ブロック4
の圧力により固定される。
Next, as shown in FIG. 1, a vinyl tape 3 is applied to the main surface of the - side so that both sides protrude from the workpiece 1, and the workpiece 1 is fixed to the magnetic chuck 5 while being held down by the block 4. Work 1 uses the adhesive strength of tape 3 and block 4.
It is fixed by the pressure of

次に、第2図の如く、他方の主面7にカッターで目的の
大きさ(外形寸法)に切込6を入れるが、製造すべき小
ピースの形状に応じ立方形、長方形などいろいろな形状
寸法に対応できる(第3図(a)、(b)、(C)参照
)、切込の深さはワーク厚さの90%以上、とりわけ9
0〜95%とする。
Next, as shown in Fig. 2, a cut 6 is made on the other main surface 7 to the desired size (external dimensions) using a cutter. Depending on the shape of the small piece to be manufactured, a cut 6 can be made in various shapes such as cubic or rectangular. (see Figures 3 (a), (b), and (C)), the depth of cut should be at least 90% of the workpiece thickness, especially 9.
0 to 95%.

次にワーク1をマグネチックチャック5から取り外し、
他方の主面7をビニールテープ3及びブロック4により
マグネチックチャック5に固定する(第4図)、その後
、第5図の如く該他方の主面7を研削し、切込6が該他
方の主面7に露出するようにする。これにより該ワーク
lは目的寸法の小ピース(例えばスペーサ)8に分割さ
れる。
Next, remove the workpiece 1 from the magnetic chuck 5,
The other main surface 7 is fixed to the magnetic chuck 5 with the vinyl tape 3 and the block 4 (Fig. 4), and then the other main surface 7 is ground as shown in Fig. 5, so that the notches 6 are It should be exposed on the main surface 7. As a result, the work l is divided into small pieces (for example, spacers) 8 having the desired dimensions.

この小ピース8をビニールテープ3から剥すことにより
、スペーサ等の製品を得ることができる。
By peeling off this small piece 8 from the vinyl tape 3, a product such as a spacer can be obtained.

この方法によると、立方形の場合で0.5mm角まで切
出可能である。ワークは通常10100mmX150程
度の大きさであるから、5mm角のスペーサの場合、6
00個を高精度で簡単に製造できる。
According to this method, it is possible to cut out cubes up to 0.5 mm square. The size of the workpiece is usually about 10100mm x 150mm, so in the case of a 5mm square spacer, 6
00 pieces can be easily manufactured with high precision.

[発明の効果] 本発明方法によると、セラ友ツタススペーサを高精度、
低コストで量産可能である。この製造に際しては特別な
治具類を必要とせず、作業設備が簡易である。
[Effects of the Invention] According to the method of the present invention, the Cerayu Tutus spacer can be manufactured with high precision.
It can be mass-produced at low cost. This manufacturing does not require any special jigs and the working equipment is simple.

【図面の簡単な説明】[Brief explanation of drawings]

第1図ないし第5図の各図は実施例方法の説明図である
。 1・・・セラミックス板(ワーク)、 3・・・ビニールテープ、 4・・・ブロック、 5・・・マグネチックチャック、 6・・・切込、 8・・・小ピース。
Each of FIGS. 1 to 5 is an explanatory diagram of an embodiment method. 1... Ceramic plate (work), 3... Vinyl tape, 4... Block, 5... Magnetic chuck, 6... Notch, 8... Small piece.

Claims (1)

【特許請求の範囲】[Claims] セラミックス板を加工して多数の小ピースを製造する方
法において、セラミックス体の一方の主面にビニールテ
ープを貼着すると共に、このビニールテープの端部をセ
ラミックス板からはみ出させ、このはみ出た部分を保持
盤に固定した後、他方の面から切り出すべき小ピースの
大きさに対応する切込を、セラミックス板の厚さの90
%以上の深さにまで形成し、次いでセラミックス板を保
持盤から剥し、他方の主面にビニールテープを貼着する
と共に、このビニールテープの端部をセラミックス板か
らはみ出させ、このはみ出た部分を保持盤に固定した後
、該他方の主面を研削し、前記切込が該他方の主面に現
われるまでこの研削を行うことによりセラミックス板を
小ピースに分割することを特徴とするセラミックス材料
の加工方法。
In the method of manufacturing a large number of small pieces by processing a ceramic plate, a vinyl tape is pasted on one main surface of the ceramic body, the end of the vinyl tape is made to protrude from the ceramic plate, and this protruding part is After fixing it to the holding plate, make a cut corresponding to the size of the small piece to be cut out from the other side.
% or more in depth, then peel off the ceramic plate from the holding plate, attach vinyl tape to the other main surface, let the end of this vinyl tape protrude from the ceramic plate, and remove this protruding part. After fixing to a holding plate, the other main surface is ground, and the grinding is performed until the notch appears on the other main surface, thereby dividing the ceramic plate into small pieces. Processing method.
JP17494789A 1989-07-06 1989-07-06 Processing method of ceramic material Pending JPH0339204A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17494789A JPH0339204A (en) 1989-07-06 1989-07-06 Processing method of ceramic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17494789A JPH0339204A (en) 1989-07-06 1989-07-06 Processing method of ceramic material

Publications (1)

Publication Number Publication Date
JPH0339204A true JPH0339204A (en) 1991-02-20

Family

ID=15987514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17494789A Pending JPH0339204A (en) 1989-07-06 1989-07-06 Processing method of ceramic material

Country Status (1)

Country Link
JP (1) JPH0339204A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004046053A1 (en) * 2002-11-19 2004-06-03 Thk Co., Ltd. Method of cutting glass substrate material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004046053A1 (en) * 2002-11-19 2004-06-03 Thk Co., Ltd. Method of cutting glass substrate material

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