JPH01133952A - Method for cutting planar brittle material - Google Patents
Method for cutting planar brittle materialInfo
- Publication number
- JPH01133952A JPH01133952A JP29382787A JP29382787A JPH01133952A JP H01133952 A JPH01133952 A JP H01133952A JP 29382787 A JP29382787 A JP 29382787A JP 29382787 A JP29382787 A JP 29382787A JP H01133952 A JPH01133952 A JP H01133952A
- Authority
- JP
- Japan
- Prior art keywords
- brittle material
- plate
- cut
- planar
- spherical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 29
- 238000005520 cutting process Methods 0.000 title claims description 25
- 238000000034 method Methods 0.000 title claims description 11
- 239000000919 ceramic Substances 0.000 claims abstract description 14
- 238000005452 bending Methods 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 4
- 239000010432 diamond Substances 0.000 claims abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 5
- 239000011521 glass Substances 0.000 description 14
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012634 fragment Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 235000014653 Carica parviflora Nutrition 0.000 description 1
- 241000243321 Cnidaria Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
(産業上の利用分野)
本発明は集積回路や太陽電池の基板の生産におけるよう
に、ガラス板や各種セラミックス板等の切断加工を主と
し、しかも多量生産を必要とする産業分野に係る板状脆
性材料の切断方法に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention is mainly used for cutting processing of glass plates and various ceramic plates, such as in the production of integrated circuits and solar cell substrates. This invention relates to a method for cutting plate-like brittle materials used in industrial fields that require mass production.
(従来の技術)
一般にガラス板やセラミックス板の切断に際しては、予
めダイヤモンドカッターのような工具で、板の一面に切
断すべき形状の条痕を設け、その条痕の左、右部を把持
し、人力で、上記条痕に曲げモーメントを加えることに
より、その切断が行なわ几でいto
(発明が解決しようとする問題点)
従来の曲げ加工による切断は、上述のように人力により
行なわnているので、生産性に乏L7ぐ、セラミックス
等の切断を伴なう各種産業では、その切断の隘路となっ
ていた。(Prior art) Generally, when cutting a glass plate or a ceramic plate, a tool such as a diamond cutter is used to cut a strip in the shape of the shape to be cut on one side of the plate in advance, and the left and right parts of the strip are gripped. (Problem to be Solved by the Invention) Cutting by the conventional bending process is performed manually by applying a bending moment to the scratches as described above. As a result, productivity is poor, and it has become a bottleneck in various industries that involve cutting ceramics and the like.
本発明はこのような点に鑑み、比較的簡単な手段により
、セラミックスを含む板状脆性材料の切設加工に卦ける
生産性を飛躍的に向上させt切断方法を得ることを目的
とする・
〔発明の構成〕
(問題点を解決する友めの手段)
本発明はセラミックスを含む板状脆性材料(以下工作物
とよぶ)の−面に、予めダイヤモンドカッターのような
工具で切断すべき形状の条痕を設け、次に同じ曲率をも
ち、雌形の球面をもつ加圧板と雌形の球面をもつ加圧板
の球面で形成さ几た球面座により、上記工作物をその条
痕が雌形の球面と当接可能にして挾持した状態で、上記
球面間に押圧荷重を加え、工作物を各球面に沿って変形
させることにより、工作物を上記条痕に沿っt縦断面内
で、曲げ加工により切断することを特徴とする板状脆性
材料の切断方法としたものである。In view of these points, it is an object of the present invention to provide a T-cutting method that dramatically improves productivity in cutting plate-like brittle materials including ceramics by relatively simple means. [Structure of the Invention] (Another Means for Solving Problems) The present invention provides a method for cutting a shape to be cut in advance with a tool such as a diamond cutter on the surface of a plate-like brittle material (hereinafter referred to as a workpiece) containing ceramics. Then, a spherical seat with the same curvature and formed by a pressure plate with a female-shaped spherical surface and a spherical surface of the pressure plate with a female-shaped spherical surface is applied to the workpiece so that the grooves are female. By applying a pressing load between the spherical surfaces and deforming the workpiece along each spherical surface while the workpiece is held in a state where it can come into contact with the spherical surface of the shape, the workpiece is moved along the above-mentioned striations within a vertical section of t. This is a method for cutting a plate-like brittle material, which is characterized by cutting by bending.
このように本発明においては、工作物を球面座で挾持し
て、球面に沿って変形させているので、工作物内には自
動的に球面の曲率に比例した曲げモーメントを誘起し、
まtその曲げによる引張応力は条痕を設けた面に発生し
、しかも条痕部では作物の切断は、予め設けておいた条
痕に沿ったすべての縦断面でほとんど同時に、しかも確
実に行なわ几る。In this way, in the present invention, since the workpiece is held between the spherical seats and deformed along the spherical surface, a bending moment proportional to the curvature of the spherical surface is automatically induced in the workpiece.
Moreover, the tensile stress caused by the bending is generated on the surface where the striations are provided, and at the striations, the cutting of the crop is carried out almost simultaneously and reliably in all longitudinal sections along the pre-formed striations. Reduce.
(実施例)
以下、添付した図面を参照して、本発明の一実施例につ
いて説明する。(Example) Hereinafter, an example of the present invention will be described with reference to the attached drawings.
第1図のAI+ A2は曲率半径がRである雌形と雌形
の球面船、(hをもつアクリル樹脂(略称PMMA )
製の加圧板であり、Tは切断加工を行なうセラミックス
等の板状の工作物であって、こ几は上記2つの球面QI
Q2で形成さ几た球面座により挟持さ几ている。AI+A2 in Figure 1 is a female spherical vessel with a radius of curvature R, and an acrylic resin (abbreviated as PMMA) with h.
T is a plate-shaped workpiece made of ceramics or the like to be cut.
It is held between the spherical seats formed by Q2.
このとき、上記工作物Tの一面には、第1図、第2図に
示すように予め切断すべき形状の条痕Nが、ダイヤモン
ドカッターのような工具で設けてあり、まt工作物Tは
上記条痕NがA、で示す雌形の球面QIに当接可能なよ
うにしである。At this time, on one surface of the workpiece T, as shown in FIGS. is such that the groove N can come into contact with the female spherical surface QI indicated by A.
このような状態のもとで、上記各加工板A、 、A。Under such conditions, each of the above-mentioned processed plates A, , A.
間に押圧荷重Wを加えて、工作物Tを球面Q+ Qzに
沿って変形させれば、Tには一様な曲げモーメントラ誘
起し、その曲げによる引張応力は工作物に条痕を設けた
方の面に生じ、また条痕部では引張りによる応力集中を
生じる。If a pressing load W is applied between the two, and the workpiece T is deformed along the spherical surface Q+Qz, a uniform bending moment tra will be induced in T, and the tensile stress caused by the bending will create striations on the workpiece. This occurs on both sides, and stress concentration due to tension occurs at the striations.
セラミックス材料の引張強さは、圧縮強さに比べて、か
なり小さく、例へばソーダガラスの引張強さは約5すf
/mrr?であるのに対し、圧縮強さは約80”yf/
m75である。このため上述の球面の曲率半径Rを適当
に選べば工作物は条痕部の応力集中により切断さ几るが
、このとき工作物に誘起さ几ている曲げモーメントは一
様であるので、工作物の曲げによる切断は、予め切断す
べき形状に設けた一条痕に沿ったすべての縦断面で、同
様に起こる。The tensile strength of ceramic materials is much smaller than the compressive strength; for example, the tensile strength of soda glass is about 5 f.
/mrr? On the other hand, the compressive strength is about 80”yf/
It is m75. Therefore, if the radius of curvature R of the above-mentioned spherical surface is appropriately selected, the workpiece will be cut due to stress concentration in the grooves, but at this time, the bending moment induced in the workpiece is uniform, so Cutting an object by bending occurs in the same way in all longitudinal sections along a single line mark previously provided in the shape to be cut.
なお本発明による切断では、球面Q+ 、(hの曲率半
径Rの選定は次のようにし友。In cutting according to the present invention, the radius of curvature R of the spherical surface Q+ (h) is selected as follows.
R,< R< R,[11
ここにR1,R2は、条痕をも之ない工作物と、条痕を
もった工作物が、そ几ぞn曲げ破壊するときの曲率半径
であって、工作物の厚さをh、材料の引a”
(3)
R,=ゴーπh
ただしEは工作物のヤング率
αは条痕部の応力集中係数
上記(1)式で示すようにR> R,であるので、工作
物の切断は条痕以外のところでは起こらないし、R〈R
1であるので、工作物の切断はすべての条痕に沿った縦
断面で確実に起こる。R, < R < R, [11 Here, R1 and R2 are the radius of curvature when the workpiece without scratches and the workpiece with scratches bend and fail, The thickness of the workpiece is h, the thickness of the material is a”
(3) R, = Go πh where E is the Young's modulus α of the workpiece and the stress concentration coefficient of the striations. As shown in equation (1) above, R > R, so the workpiece is cut other than the striations. It doesn't happen at R〈R
1, it is ensured that the cutting of the workpiece occurs in the longitudinal section along all the striations.
(実験例〕
以下、実験例としてソーダガラス板とアルミナセラミッ
クス板の切断例について述べる。こ几ら材料のヤング率
Eと引張強さσbは次のようになる。(Experimental Example) As an experimental example, an example of cutting a soda glass plate and an alumina ceramic plate will be described below.The Young's modulus E and tensile strength σb of these materials are as follows.
ソーダガラス: E=70001Lp、7’/m77J
σb= 5’yf/mmアルミナセラミックス: E
= 280001Lp、7”/m7%σb=21に77
m’実験では、切断すべき形状の条痕は、普通のガラス
切りで設けた。そのときの条痕の応力集中係数はα中4
.5であった。Soda glass: E=70001Lp, 7'/m77J
σb=5'yf/mm Alumina ceramics: E
= 280001Lp, 7”/m7%σb=21 to 77
In the m' experiment, the grooves in the shape to be cut were created using an ordinary glass cutter. At that time, the stress concentration factor of the striations is 4 in α
.. It was 5.
(実験例I)
工作物は厚さh ” 1.1 uで1辺がtoommの
ソーダガラスの正方形板である。こ几に第3図に示すよ
うな条痕を設けて、24板の小長方形板を同時切断する
ことを試みtoこのガラス板が曲げにより破壊するとき
の曲率半径を、上記(2)式及び(3)式より求めてみ
ると、条痕がないときにはR,中510□、条痕がある
ときにはR2中230 ozmとなるので、実験では上
記(11式全満足する球面として曲率半径がR=10θ
O藺のものを用・ハた。その結果は工作物の切断は期待
し友ように行なわ几t0すなわち切断は条痕に沿ったす
べての縦断面で行なわn。(Experimental Example I) The workpiece is a square plate of soda glass with a thickness h ” 1.1 u and one side of toomm.A groove as shown in Fig. 3 was provided on this machine, and 24 small plates were When attempting to simultaneously cut a rectangular plate, the radius of curvature at which this glass plate breaks due to bending is calculated from equations (2) and (3) above.When there is no striation, it is R, medium 510□ , when there are striations, it becomes 230 ozm in R2, so in the experiment, the radius of curvature is R = 10θ as a spherical surface that fully satisfies Equation 11.
I used one from O. The result is that the workpiece is cut as expected, t0, that is, the cut is made in all longitudinal sections along the striations.
24枚の長方形板を採取した。Twenty-four rectangular plates were collected.
(実験列■)
工作物は厚さh= 2.7 、3.7 、4.7 mm
で一辺がそ几ぞ几7omaの3種類のソーダガラス板で
ある。実験ではこ几らガラス板をそ几ぞ几16等分する
条痕を設け、16枚の小正方形板をそ几ぞ几同時切断す
ることを試みtoこ几らのガラス板についての前述のR
1+ R2を求めてみると、そnぞng1表のようにな
るので、実験では上記(1)式を満足する球面としてR
”3000wuxのものを用いた。この場合の工作物の
切断もすべて期待しtように行なわ几た。(Experimental row ■) The thickness of the workpiece is h = 2.7, 3.7, 4.7 mm.
There are three types of soda glass plates with each side having a width of 7 oma. In the experiment, we created stripes that divided the glass plate into 16 equal parts, and attempted to cut 16 small square plates simultaneously.
When calculating 1+R2, it looks like the ng1 table, so in the experiment, R is a spherical surface that satisfies the above equation (1).
``3000 wux was used. All cutting of the workpiece in this case was performed as expected.
第 1 表
工作物ンゴ厚さh ” 1. Ouで1辺が10 oz
mであるアルミナセラミックスの正方形板である。実験
ではこの正方形板を25等分して、25枚の小正方形を
同時に切断することを試みた。アルミナセラミックス板
についての前述のR1TR2’!:式(2)、(3)か
ら求めてみると、R1” 450 ails R2”
200 oOとなるので、実験では式(1)を満足す
る球面としてR=1000.のものを用いた。この場合
も期待した通りO切断が行なわn fc。1st table Workpiece coral thickness h” 1. 1 side is 10 oz
It is a square plate of alumina ceramics with a diameter of m. In the experiment, this square plate was divided into 25 equal parts, and an attempt was made to cut 25 small squares at the same time. The above-mentioned R1TR2' about the alumina ceramic plate! : When calculated from formulas (2) and (3), R1" 450 ails R2"
200 oO, so in the experiment, R = 1000. I used the one from In this case as well, O-cutting was performed as expected.
なお加工においては、ガラス破片が発生し、こ几が工作
物と雌形又は雌形の球面上に付着して工作物表面に悪影
響を与えることがあるので、雌形上及び/又は雌形上に
可撓性シート部材を載置又は付着等の適当な方法で工作
物との間に介して、シート部材にガラス破片を吸収させ
るようにしてもよい。In addition, during machining, glass fragments may be generated and the glass may adhere to the workpiece and the female mold or the spherical surface of the female mold and have an adverse effect on the surface of the workpiece. A flexible sheet member may be interposed between the workpiece and the workpiece by an appropriate method such as placing or adhering the sheet member to absorb glass fragments.
〔発明の効果〕
以上説明し之ように、本発明による板状脆性材料の切断
方法では、板状脆性材料即ち工作物を球面に沿って変形
させるだけの比較的簡単な手段により、工作物の曲げ加
工による切断が、予め切断すべき形状に設けた条痕に沿
ったすべての縦断面で、はとんど同時に、しかも確実に
行なわnる。[Effects of the Invention] As explained above, in the method for cutting a plate-like brittle material according to the present invention, the plate-like brittle material, that is, the workpiece, can be deformed along a spherical surface by a relatively simple means. Cutting by bending is performed almost simultaneously and reliably on all longitudinal sections along the grooves previously provided in the shape to be cut.
し之がって本切断方法は、例えば集積回路や太陽電池の
基板の生産におけるように、多量のガラス板や各種セラ
ミックス板の切断加工を必要とする産業分野で、極めて
有用で顕著な効果を奏することができる。Therefore, this cutting method is extremely useful and has a remarkable effect in industrial fields that require the cutting of large quantities of glass plates and various ceramic plates, such as in the production of integrated circuit and solar cell substrates. can play.
第1図は本発明の板状脆性材料の切断方法の一実施例を
実施する装置を示す概略断面立面図、第2図及び第3図
は第1図に示す板状脆性材料のそnぞn異る平面図であ
る。
A、・・・雌形の球面をもつ加圧板
A2・・・雌形の球面をもつ加圧板
N・・・条 痕
Ql・・・雌形の球面
Q2・・・雌形の球面
T・・・工作物(板状脆性材料)
代理人弁理士 河 内 潤 二FIG. 1 is a schematic cross-sectional elevational view showing an apparatus for carrying out an embodiment of the method for cutting plate-like brittle materials of the present invention, and FIGS. These are different plan views. A, Pressure plate A2 with a female spherical surface... Pressure plate N with a female spherical surface...Stripe Ql...Female spherical surface Q2...Female spherical surface T...・Workpiece (plate-like brittle material) Attorney Junji Kawachi
Claims (2)
ダイヤモンドカッターを含む工具で切断すべき形状の条
痕を設け、次にほぼ同じ曲率をもち、雌形の球面をもつ
加圧板と雄形の球面をもつ加圧板の2つの球面により形
成された球面座により、上記板状脆性材料を、その条痕
が雌形の球面に当接可能にして挾持した状態で、上記球
面間に押圧荷重を加え、上記板状脆性材料を各球面に沿
って変形させることにより、板状脆性材料内に自動的に
曲げモーメントを誘起させ、もって上記板状脆性材料を
曲げ加工により、上記条痕に沿った縦断面で切断するこ
とを特徴とする、セラミックスを含む板状脆性材料の切
断方法。(1) On one surface of a plate-shaped brittle material containing ceramics, a groove in the shape to be cut is created in advance using a tool including a diamond cutter, and then a pressure plate with a female spherical surface and a male shape with approximately the same curvature are formed. With the plate-like brittle material being held between the two spherical seats of the pressure plate having spherical surfaces such that its striations can come into contact with the female spherical surface, a pressing load is applied between the spherical surfaces. By applying this and deforming the plate-shaped brittle material along each spherical surface, a bending moment is automatically induced in the plate-shaped brittle material, and the plate-shaped brittle material is bent along the scratches. A method for cutting plate-like brittle materials including ceramics, characterized by cutting in a vertical cross section.
加圧板の少くとも一方と、の間に可撓性シート部材を介
した特許請求の範囲第1項記載の板状脆性材料の切断方
法。(2) The plate-like brittle material according to claim 1, in which a flexible sheet member is interposed between the plate-like brittle material and at least one of the pressure plates having a female or male spherical surface. How to cut the material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29382787A JPH01133952A (en) | 1987-11-20 | 1987-11-20 | Method for cutting planar brittle material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29382787A JPH01133952A (en) | 1987-11-20 | 1987-11-20 | Method for cutting planar brittle material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01133952A true JPH01133952A (en) | 1989-05-26 |
Family
ID=17799670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29382787A Pending JPH01133952A (en) | 1987-11-20 | 1987-11-20 | Method for cutting planar brittle material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01133952A (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0624423A3 (en) * | 1993-05-11 | 1996-02-14 | Gen Electric | Method of separation of pieces from super hard material. |
CN105837014A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Temperature difference type glass cracking device |
CN105837013A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Temperature difference type glass separating device |
CN105837017A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Temperature stress acoustic wave control type glass cracking device |
CN105837015A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Multi-factor glass breakage control device |
CN105837011A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Matrix temperature control cracking glass device |
CN105837012A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Initial processing device for optical glass |
CN105837022A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Static optical glass cracking device |
CN105837018A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Ultrasonic processing device for optical glass |
CN105837016A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Device for processing optical glass by virtue of ultrasonic waves |
CN105859117A (en) * | 2016-05-27 | 2016-08-17 | 苏州微米光学科技有限公司 | Temperature difference type glass net-split device |
CN106045295A (en) * | 2016-05-27 | 2016-10-26 | 苏州微米光学科技有限公司 | Apparatus for processing optical glass |
CN106045294A (en) * | 2016-05-27 | 2016-10-26 | 苏州微米光学科技有限公司 | Optical glass splitting device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58139121A (en) * | 1982-02-12 | 1983-08-18 | Canon Inc | Production of optical cell |
JPS58139119A (en) * | 1982-02-12 | 1983-08-18 | Canon Inc | Production of optical cell |
JPS58149021A (en) * | 1982-03-02 | 1983-09-05 | Canon Inc | Production of optical cell |
-
1987
- 1987-11-20 JP JP29382787A patent/JPH01133952A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58139121A (en) * | 1982-02-12 | 1983-08-18 | Canon Inc | Production of optical cell |
JPS58139119A (en) * | 1982-02-12 | 1983-08-18 | Canon Inc | Production of optical cell |
JPS58149021A (en) * | 1982-03-02 | 1983-09-05 | Canon Inc | Production of optical cell |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0624423A3 (en) * | 1993-05-11 | 1996-02-14 | Gen Electric | Method of separation of pieces from super hard material. |
CN105837014A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Temperature difference type glass cracking device |
CN105837013A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Temperature difference type glass separating device |
CN105837017A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Temperature stress acoustic wave control type glass cracking device |
CN105837015A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Multi-factor glass breakage control device |
CN105837011A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Matrix temperature control cracking glass device |
CN105837012A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Initial processing device for optical glass |
CN105837022A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Static optical glass cracking device |
CN105837018A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Ultrasonic processing device for optical glass |
CN105837016A (en) * | 2016-05-27 | 2016-08-10 | 苏州微米光学科技有限公司 | Device for processing optical glass by virtue of ultrasonic waves |
CN105859117A (en) * | 2016-05-27 | 2016-08-17 | 苏州微米光学科技有限公司 | Temperature difference type glass net-split device |
CN106045295A (en) * | 2016-05-27 | 2016-10-26 | 苏州微米光学科技有限公司 | Apparatus for processing optical glass |
CN106045294A (en) * | 2016-05-27 | 2016-10-26 | 苏州微米光学科技有限公司 | Optical glass splitting device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH01133952A (en) | Method for cutting planar brittle material | |
KR20000023191A (en) | Cutting method for plate glass mother material and plate glass mother material cutting device | |
BR9509116A (en) | Abrasive article coated processes for producing the same and process for roughing a hard part | |
JPH0616441A (en) | Method for cutting brittle plate and device therefor | |
KR100967283B1 (en) | Method of chamfering plate-like substance and apparatus thereof | |
US5016800A (en) | Method of cutting workpiece | |
JP2993899B2 (en) | Cutting blade and its forming method | |
JP2926526B2 (en) | Cutting method for plate-shaped brittle material | |
JPH01108006A (en) | Splitting of brittle material | |
JP2672646B2 (en) | Liquid crystal display element manufacturing method and liquid crystal display element manufacturing apparatus | |
JPS61172629A (en) | Tool for punching | |
JPH1190923A (en) | Cutting method by multiple wire saw | |
JPH08206999A (en) | Dividing method of plate-like hard fragile material | |
KR850003861A (en) | How to Work Fragile Workpieces | |
JP2731001B2 (en) | Multi-division method for workpieces such as thick glass | |
KR100482989B1 (en) | Cutting blade | |
JPS59160123A (en) | Production of electrooptic element | |
DE4006070C2 (en) | ||
JPH01190412A (en) | Cutting of plate-shaped brittle material and its device | |
CN211915862U (en) | Oblique chamfer jig for processing flexible thick foam | |
JPH0474160B2 (en) | ||
JP2020172680A (en) | Steel sheet | |
JPS6326298A (en) | End tab connection body for welding | |
JPH01153267A (en) | Method of surface finish for ceramics plate | |
JP2004130321A (en) | Cold-worked steel product excellent in brittle fracture resistant characteristic |