JPH0338768B2 - - Google Patents
Info
- Publication number
- JPH0338768B2 JPH0338768B2 JP20475390A JP20475390A JPH0338768B2 JP H0338768 B2 JPH0338768 B2 JP H0338768B2 JP 20475390 A JP20475390 A JP 20475390A JP 20475390 A JP20475390 A JP 20475390A JP H0338768 B2 JPH0338768 B2 JP H0338768B2
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- stem
- adhesive
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010897 surface acoustic wave method Methods 0.000 claims description 25
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 238000000034 method Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000002788 crimping Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
【発明の詳細な説明】
本発明は表面弾性波素子用ステムへの素子の貼
着方法に関するものであり、さらに詳細には表面
弾性波素子用ステムの接着面に対し位置決め用の
穴を穿設し、光センサー等により素子の位置決め
するに際し、作業の簡略化を行おうとするもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching an element to a stem for a surface acoustic wave element, and more specifically, a method for drilling a positioning hole in the adhesive surface of the stem for a surface acoustic wave element. However, it is an attempt to simplify the work when positioning an element using an optical sensor or the like.
従来、表面弾性波素子用ステムは、第１図に示
すように、円盤状、方形状等任意の形状のステム
本体１にネイルピン２を挿通するためのネイルピ
ン挿通孔を設け、このネイルピン挿通孔３にネイ
ルピン２を挿通し、ガラスなどの絶縁材４で封着
すると共に、ステム本体１の所定位置に表面弾性
波素子５を接着剤により接着するものであつた。 Conventionally, as shown in FIG. 1, a stem for a surface acoustic wave element is provided with a nail pin insertion hole for inserting a nail pin 2 in a stem body 1 having an arbitrary shape such as a disc shape or a rectangular shape. A nail pin 2 is inserted into the stem body 1, and the stem body 1 is sealed with an insulating material 4 such as glass, and a surface acoustic wave element 5 is bonded to a predetermined position of the stem body 1 with an adhesive.
しかしながら、このような従来の表面弾性波素
子用ステムにおいては素子接着面は平滑であつ
て、なんら位置決め用の印は形成されておらず、
表面弾性波素子５を接着する際は困難をともなつ
ていた。さらに、表面弾性波素子５はステム本体
１に接着剤により貼着されるものであるが、前述
のように素子接着面は平滑であるため、貼着時に
接着剤の溶媒が素子５の周囲に溢れ出ることがあ
つた。このような溶媒６の溢れは表面弾性波素子
用ステム、ひいては、表面弾性波素子の耐久性を
損ない、加えて表面弾性波素子５の特性に悪影響
を与えるという虞もある。 However, in such conventional stems for surface acoustic wave devices, the device adhesion surface is smooth and no positioning marks are formed.
Difficulties were involved when bonding the surface acoustic wave element 5. Furthermore, the surface acoustic wave element 5 is attached to the stem body 1 with an adhesive, but as mentioned above, since the element adhesion surface is smooth, the solvent of the adhesive may spread around the element 5 during attachment. There were times when it overflowed. Such overflow of the solvent 6 may impair the durability of the surface acoustic wave device stem and, by extension, the surface acoustic wave device, and may also adversely affect the characteristics of the surface acoustic wave device 5.
一方、溶剤６が素子５より溢れないように接着
剤の塗布量を制御することは極めて困難である。 On the other hand, it is extremely difficult to control the amount of adhesive applied so that the solvent 6 does not overflow from the element 5.
本発明は前述の点に鑑みなされたものであり、
表面弾性波素子用ステム本体に表面弾性波素子を
接着する際容易に位置決めでき、これに加え接着
剤が表面弾性波素子周囲より溢れることがないよ
うにすることを目的とし、その特徴とするところ
は、ステム本体の素子接着面に、素子の位置決め
をするための、少なくとも二以上の位置決め穴を
同心円的に穿たれた段付き形状に穿設した表面弾
性波素子用ステムの前記位置決め穴に段付き形状
の下方部に若干盛り上がるように接着剤を充填す
る工程、前記位置決め穴をセンサにより走査し素
子の接着位置を決める工程、前記素子を貼着する
工程を含む点にある。 The present invention has been made in view of the above points,
The purpose of this product is to easily position the surface acoustic wave device when bonding it to the surface acoustic wave device stem body, and also to prevent the adhesive from overflowing from around the surface acoustic wave device. The stem for a surface acoustic wave device has at least two or more positioning holes concentrically drilled in a stepped shape for positioning the device on the device adhesive surface of the stem body. The present invention includes the steps of: filling the lower part of the attached shape with adhesive so as to slightly bulge; scanning the positioning hole with a sensor to determine the bonding position of the element; and bonding the element.
本発明の一実施例を図面に基づき説明する。 An embodiment of the present invention will be described based on the drawings.
第２図は表面弾性波素子用ステムの一例の斜視
図であり、第３図は第２図におけるＡ−A′断面
図を示し、図中、第１図と同一の符号は同一のも
のを示す。 FIG. 2 is a perspective view of an example of a stem for a surface acoustic wave device, and FIG. 3 is a cross-sectional view taken along line A-A' in FIG. 2. In the figure, the same symbols as in FIG. show.
この図面より明らかなように、本発明に使用さ
れる表面弾性波素子用ステムは、方形状のステム
本体１の周縁部に圧着用フランジ１０が設けら
れ、この圧着用フランジ１０には圧着用突起１１
がコイニング加工により形成されている。 As is clear from this drawing, the stem for a surface acoustic wave device used in the present invention is provided with a crimping flange 10 at the peripheral edge of a rectangular stem body 1, and this crimping flange 10 has a crimping protrusion. 11
is formed by coining process.
ネイルピン２を挿通するためのネイルピン挿通
孔３はステム本体１の上方部に穿設されており、
ネイルピン２はこの挿通孔３に絶縁剤４により封
着されている。 A nail pin insertion hole 3 for inserting the nail pin 2 is bored in the upper part of the stem body 1.
The nail pin 2 is sealed in this insertion hole 3 with an insulating material 4.
このネイルピン挿通孔３の下方に素子５を貼着
するための素子接着部７が設けられており、この
素子接着部７には素子５の位置決めのための位置
決め穴８が、少なくとも二以上穿設されている。
この位置決め穴８は、第３図より明らかなよう
に、同心円的に二段に形成されている。この位置
決め穴８は、また、素子５の貼着位置を光センサ
ー等により決定するための、マークとなるもので
あるため、少なくとも二以上必要であり、好まし
くは規則的に並べられるのが良い。 An element adhesive part 7 for pasting the element 5 is provided below the nail pin insertion hole 3, and at least two positioning holes 8 for positioning the element 5 are bored in the element adhesive part 7. has been done.
As is clear from FIG. 3, the positioning holes 8 are formed concentrically in two stages. This positioning hole 8 also serves as a mark for determining the attachment position of the element 5 using an optical sensor or the like, so at least two or more are required, and preferably they are arranged regularly.
本発明による表面弾性波素子用ステムへの素子
の貼着方法によれば、表面弾性波素子５を前記表
面弾性波素子用ステム本体１に貼着するにあたつ
ては、まず、素子接着部７に形成された位置決め
穴８を用いて、素子接着位置を決定した後、この
位置決め８に接着剤９を充填する。接着剤９は、
段付き穴の下方部８０に盛り上がるように充填し
（第４図ａ）、次いで所定位置に素子５を載置し前
記素子５をステムに接着する。この際、接着剤９
はステム本体１表面に溢れ出ることはなく、位置
決め穴８の上方部８１にとどまる（第４図ｂ）。 According to the method of attaching a device to a stem for a surface acoustic wave device according to the present invention, when attaching the surface acoustic wave device 5 to the stem body 1 for a surface acoustic wave device, first, the device adhesion portion is After determining the element bonding position using the positioning hole 8 formed in 7, the positioning hole 8 is filled with adhesive 9. The adhesive 9 is
The lower part 80 of the stepped hole is filled so as to rise (FIG. 4a), and then the element 5 is placed in a predetermined position and the element 5 is bonded to the stem. At this time, adhesive 9
does not overflow onto the surface of the stem body 1 and remains in the upper part 81 of the positioning hole 8 (FIG. 4b).
以上説明したように、本発明の表面弾性波素子
用ステムへの素子の貼着方法によれば、ステム本
体表面に二以上の位置決め穴を設けると共に、こ
の穴を同心円的な段付き形状としているため、表
面弾性波素子の接着位置が容易に定められるばか
りでなく、この位置決め穴を利用して、この穴に
接着剤を充填し素子を接着することができ、極め
て便利であるという利点がある。 As explained above, according to the method of attaching an element to a stem for a surface acoustic wave element of the present invention, two or more positioning holes are provided on the surface of the stem body, and the holes are formed into a concentric stepped shape. Therefore, not only can the adhesion position of the surface acoustic wave element be easily determined, but also the positioning hole can be used to fill the hole with adhesive and adhere the element, which has the advantage of being extremely convenient. .
しかも、この位置決め穴は、段付き形状である
ため、接着に際し接着剤がステム本体に溢れると
いう心配がないため、厳密な接着剤塗布量制御を
行うことなく、素子の接着ができるという利点も
ある。 Furthermore, since this positioning hole has a stepped shape, there is no need to worry about the adhesive overflowing into the stem body during bonding, so there is the advantage that devices can be bonded without having to strictly control the amount of adhesive applied. .
第１図は、従来の表面弾性波素子用ステムの斜
視図、第２図は本発明による表面弾性波素子用ス
テムの一実施例の斜視図、第３図は第２図のＡ−
A′断面図、第４図は本発明の表面弾性波素子用
ステムに素子を接着する方法を説明するための説
明図である。
１……ステム本体、２……ネイルピン、３……
ネイルピン挿通孔、４……絶縁剤、５……素子、
８……位置決め穴、９……接着剤。
FIG. 1 is a perspective view of a conventional stem for a surface acoustic wave device, FIG. 2 is a perspective view of an embodiment of a stem for a surface acoustic wave device according to the present invention, and FIG. 3 is a perspective view of a stem shown in FIG.
The A' sectional view and FIG. 4 are explanatory diagrams for explaining the method of bonding an element to the stem for a surface acoustic wave element of the present invention. 1... Stem body, 2... Nail pin, 3...
Nail pin insertion hole, 4...Insulating material, 5...Element,
8...Positioning hole, 9...Adhesive.
Claims (1)
をするための、少なくとも二以上の位置決め穴を
同心円的に穿たれた段付き形状に穿設した表面弾
性波素子用ステムの前記位置決め穴に段付き形状
の下方部に若干盛り上がるように接着剤を充填す
る工程、前記位置決め穴をセンサにより走査し素
子の接着位置を決める工程、前記素子を貼着する
工程を含むことを特徴とする表面弾性波素子用ス
テムへの素子の貼着方法。1. At least two or more positioning holes are concentrically drilled in a stepped shape for positioning the element on the element adhesive surface of the stem body. A surface acoustic wave device characterized by comprising the steps of: filling the lower part of the shape with adhesive so as to slightly bulge; scanning the positioning hole with a sensor to determine the bonding position of the device; and bonding the device. How to attach the element to the stem.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20475390A JPH0362608A (en) | 1990-08-01 | 1990-08-01 | Adhering method for element to stem for surface acoustic wave element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20475390A JPH0362608A (en) | 1990-08-01 | 1990-08-01 | Adhering method for element to stem for surface acoustic wave element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0362608A JPH0362608A (en) | 1991-03-18 |
| JPH0338768B2 true JPH0338768B2 (en) | 1991-06-11 |
Family
ID=16495772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20475390A Granted JPH0362608A (en) | 1990-08-01 | 1990-08-01 | Adhering method for element to stem for surface acoustic wave element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0362608A (en) |
-
1990
- 1990-08-01 JP JP20475390A patent/JPH0362608A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0362608A (en) | 1991-03-18 |
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