JPH0338620U - - Google Patents

Info

Publication number
JPH0338620U
JPH0338620U JP9887789U JP9887789U JPH0338620U JP H0338620 U JPH0338620 U JP H0338620U JP 9887789 U JP9887789 U JP 9887789U JP 9887789 U JP9887789 U JP 9887789U JP H0338620 U JPH0338620 U JP H0338620U
Authority
JP
Japan
Prior art keywords
capacitor
lead
lead frame
leads
bending portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9887789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9887789U priority Critical patent/JPH0338620U/ja
Publication of JPH0338620U publication Critical patent/JPH0338620U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例に係るコンデンサ用
リードフレームの斜視図、第2図イ及びロは何れ
も同実施例のリードフレームを用いたチツプ型コ
ンデンサの断面図であり、同図イは樹脂モールド
後を示し、同図ロはリード成形後を示している。
第3図イ及びロは何れも他の実施例に係るリード
フレームによつて樹脂モールドされたチツプ型コ
ンデンサの断面図であり、同図イは樹脂モールド
後を示し、同図ロはリード成形後を示している。
第4図は従来のコンデンサ用リードフレームの斜
視図、第5図イからハは何れも従来のリードフレ
ームを用いたチツプ型コンデンサの製造過程を示
す断面図である。 1……コンデンサ素子、10,20……リード
フレーム、11……リード、12……第1の折曲
部、13……第2の折曲部。
FIG. 1 is a perspective view of a lead frame for a capacitor according to an embodiment of the present invention, and FIGS. 2A and 2B are sectional views of a chip-type capacitor using the lead frame of the same embodiment. 1 shows the result after resin molding, and 2) shows the state after lead molding.
Figures 3A and 3B are cross-sectional views of a chip-type capacitor resin-molded with a lead frame according to another embodiment; Figure 3A shows the state after resin molding, and Figure 3B shows the state after lead molding. It shows.
FIG. 4 is a perspective view of a conventional lead frame for a capacitor, and FIGS. 5A to 5C are sectional views showing the manufacturing process of a chip type capacitor using the conventional lead frame. DESCRIPTION OF SYMBOLS 1... Capacitor element, 10, 20... Lead frame, 11... Lead, 12... First bent part, 13... Second bent part.

Claims (1)

【実用新案登録請求の範囲】 コンデンサ素子がマウントされる相対向するリ
ードを形成したコンデンサ用リードフレームにお
いて、 上記各リードの途中でそれぞれ同一方向に略直
角に折曲する第1の折曲部と、各リードの導出方
向と一致する方向でリード先端部を略直角に折曲
する第2の折曲部とを有することを特徴とするコ
ンデンサ用リードフレーム。
[Claims for Utility Model Registration] In a capacitor lead frame on which a capacitor element is mounted and formed with opposing leads, a first bending portion that is bent approximately at right angles in the same direction in the middle of each of the leads; A lead frame for a capacitor, comprising: a second bending portion that bends a lead end portion at a substantially right angle in a direction that coincides with a direction in which each lead is led out.
JP9887789U 1989-08-24 1989-08-24 Pending JPH0338620U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9887789U JPH0338620U (en) 1989-08-24 1989-08-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9887789U JPH0338620U (en) 1989-08-24 1989-08-24

Publications (1)

Publication Number Publication Date
JPH0338620U true JPH0338620U (en) 1991-04-15

Family

ID=31647956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9887789U Pending JPH0338620U (en) 1989-08-24 1989-08-24

Country Status (1)

Country Link
JP (1) JPH0338620U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002175939A (en) * 2000-09-26 2002-06-21 Nippon Chemicon Corp Method of manufacturing chip-type solid electrolytic capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002175939A (en) * 2000-09-26 2002-06-21 Nippon Chemicon Corp Method of manufacturing chip-type solid electrolytic capacitor

Similar Documents

Publication Publication Date Title
JPH0338620U (en)
JPH0351850U (en)
JPH0474460U (en)
JPH03102742U (en)
JPH0229513U (en)
JPH0195721U (en)
JPS6333642U (en)
JPH01116431U (en)
JPH01139443U (en)
JPH0361354U (en)
JPH01174946U (en)
JPH0231147U (en)
JPH03128972U (en)
JPS61149347U (en)
JPH032650U (en)
JPH0456335U (en)
JPH033746U (en)
JPS61106044U (en)
JPH02120825U (en)
JPS63188955U (en)
JPS63132443U (en)
JPH029447U (en)
JPH0467346U (en)
JPS6155329U (en)
JPH0298619U (en)