JPH0337591B2 - - Google Patents

Info

Publication number
JPH0337591B2
JPH0337591B2 JP10951884A JP10951884A JPH0337591B2 JP H0337591 B2 JPH0337591 B2 JP H0337591B2 JP 10951884 A JP10951884 A JP 10951884A JP 10951884 A JP10951884 A JP 10951884A JP H0337591 B2 JPH0337591 B2 JP H0337591B2
Authority
JP
Japan
Prior art keywords
epoxy resin
epoxy
curing agent
curing
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10951884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60255858A (ja
Inventor
Ryuzo Nakatsuka
Shigenori Yamaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP10951884A priority Critical patent/JPS60255858A/ja
Publication of JPS60255858A publication Critical patent/JPS60255858A/ja
Publication of JPH0337591B2 publication Critical patent/JPH0337591B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Paints Or Removers (AREA)
  • Die Bonding (AREA)
  • Organic Insulating Materials (AREA)
JP10951884A 1984-05-31 1984-05-31 絶縁樹脂ペ−スト Granted JPS60255858A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10951884A JPS60255858A (ja) 1984-05-31 1984-05-31 絶縁樹脂ペ−スト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10951884A JPS60255858A (ja) 1984-05-31 1984-05-31 絶縁樹脂ペ−スト

Publications (2)

Publication Number Publication Date
JPS60255858A JPS60255858A (ja) 1985-12-17
JPH0337591B2 true JPH0337591B2 (enrdf_load_stackoverflow) 1991-06-06

Family

ID=14512291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10951884A Granted JPS60255858A (ja) 1984-05-31 1984-05-31 絶縁樹脂ペ−スト

Country Status (1)

Country Link
JP (1) JPS60255858A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS60255858A (ja) 1985-12-17

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