JPH0337311B2 - - Google Patents
Info
- Publication number
- JPH0337311B2 JPH0337311B2 JP11322085A JP11322085A JPH0337311B2 JP H0337311 B2 JPH0337311 B2 JP H0337311B2 JP 11322085 A JP11322085 A JP 11322085A JP 11322085 A JP11322085 A JP 11322085A JP H0337311 B2 JPH0337311 B2 JP H0337311B2
- Authority
- JP
- Japan
- Prior art keywords
- block
- heat pipe
- laminated
- type semiconductor
- laminated block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 24
- 238000003780 insertion Methods 0.000 claims description 18
- 230000037431 insertion Effects 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11322085A JPS61271862A (ja) | 1985-05-28 | 1985-05-28 | ヒ−トパイプ式半導体冷却器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11322085A JPS61271862A (ja) | 1985-05-28 | 1985-05-28 | ヒ−トパイプ式半導体冷却器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61271862A JPS61271862A (ja) | 1986-12-02 |
| JPH0337311B2 true JPH0337311B2 (enrdf_load_stackoverflow) | 1991-06-05 |
Family
ID=14606615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11322085A Granted JPS61271862A (ja) | 1985-05-28 | 1985-05-28 | ヒ−トパイプ式半導体冷却器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61271862A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2619744B2 (ja) * | 1991-05-20 | 1997-06-11 | 三菱電線工業株式会社 | ヒートパイプ式冷却器 |
| CN112091532A (zh) * | 2020-07-31 | 2020-12-18 | 中国电子科技集团公司第十四研究所 | 一种内置热管的导热板和制备方法 |
-
1985
- 1985-05-28 JP JP11322085A patent/JPS61271862A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61271862A (ja) | 1986-12-02 |