JPH0337311B2 - - Google Patents
Info
- Publication number
- JPH0337311B2 JPH0337311B2 JP60113220A JP11322085A JPH0337311B2 JP H0337311 B2 JPH0337311 B2 JP H0337311B2 JP 60113220 A JP60113220 A JP 60113220A JP 11322085 A JP11322085 A JP 11322085A JP H0337311 B2 JPH0337311 B2 JP H0337311B2
- Authority
- JP
- Japan
- Prior art keywords
- block
- heat pipe
- laminated
- type semiconductor
- laminated block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60113220A JPS61271862A (ja) | 1985-05-28 | 1985-05-28 | ヒ−トパイプ式半導体冷却器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60113220A JPS61271862A (ja) | 1985-05-28 | 1985-05-28 | ヒ−トパイプ式半導体冷却器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61271862A JPS61271862A (ja) | 1986-12-02 |
| JPH0337311B2 true JPH0337311B2 (cg-RX-API-DMAC7.html) | 1991-06-05 |
Family
ID=14606615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60113220A Granted JPS61271862A (ja) | 1985-05-28 | 1985-05-28 | ヒ−トパイプ式半導体冷却器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61271862A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2619744B2 (ja) * | 1991-05-20 | 1997-06-11 | 三菱電線工業株式会社 | ヒートパイプ式冷却器 |
| CN112091532A (zh) * | 2020-07-31 | 2020-12-18 | 中国电子科技集团公司第十四研究所 | 一种内置热管的导热板和制备方法 |
-
1985
- 1985-05-28 JP JP60113220A patent/JPS61271862A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61271862A (ja) | 1986-12-02 |