JPH0337308B2 - - Google Patents

Info

Publication number
JPH0337308B2
JPH0337308B2 JP60181692A JP18169285A JPH0337308B2 JP H0337308 B2 JPH0337308 B2 JP H0337308B2 JP 60181692 A JP60181692 A JP 60181692A JP 18169285 A JP18169285 A JP 18169285A JP H0337308 B2 JPH0337308 B2 JP H0337308B2
Authority
JP
Japan
Prior art keywords
thermal expansion
coefficient
glass
substrate
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60181692A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6243155A (ja
Inventor
Satoru Ogiwara
Tomoji Ooishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60181692A priority Critical patent/JPS6243155A/ja
Priority to US06/890,533 priority patent/US4729010A/en
Priority to EP86305894A priority patent/EP0211618B1/en
Priority to DE8686305894T priority patent/DE3672709D1/de
Publication of JPS6243155A publication Critical patent/JPS6243155A/ja
Publication of JPH0337308B2 publication Critical patent/JPH0337308B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/456—
    • H10W70/692—
    • H10W76/157—
    • H10W76/60—
    • H10W90/00—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/884—
    • H10W90/722—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP60181692A 1985-08-05 1985-08-21 集積回路パッケ−ジ Granted JPS6243155A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60181692A JPS6243155A (ja) 1985-08-21 1985-08-21 集積回路パッケ−ジ
US06/890,533 US4729010A (en) 1985-08-05 1986-07-30 Integrated circuit package with low-thermal expansion lead pieces
EP86305894A EP0211618B1 (en) 1985-08-05 1986-07-31 Integrated circuit package
DE8686305894T DE3672709D1 (de) 1985-08-05 1986-07-31 Integrierte schaltungspackung.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60181692A JPS6243155A (ja) 1985-08-21 1985-08-21 集積回路パッケ−ジ

Publications (2)

Publication Number Publication Date
JPS6243155A JPS6243155A (ja) 1987-02-25
JPH0337308B2 true JPH0337308B2 (index.php) 1991-06-05

Family

ID=16105199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60181692A Granted JPS6243155A (ja) 1985-08-05 1985-08-21 集積回路パッケ−ジ

Country Status (1)

Country Link
JP (1) JPS6243155A (index.php)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02251166A (ja) * 1989-03-24 1990-10-08 Matsushita Electric Works Ltd 表面実装用半導体パッケージ
JP2736455B2 (ja) * 1989-11-27 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ
JP2736464B2 (ja) * 1989-11-30 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ
JP2736451B2 (ja) * 1989-11-27 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ
JP2736452B2 (ja) * 1989-11-27 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ
JP2736459B2 (ja) * 1989-11-30 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ
JP2736456B2 (ja) * 1989-11-27 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ

Also Published As

Publication number Publication date
JPS6243155A (ja) 1987-02-25

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