JPH0336143U - - Google Patents
Info
- Publication number
- JPH0336143U JPH0336143U JP1989096903U JP9690389U JPH0336143U JP H0336143 U JPH0336143 U JP H0336143U JP 1989096903 U JP1989096903 U JP 1989096903U JP 9690389 U JP9690389 U JP 9690389U JP H0336143 U JPH0336143 U JP H0336143U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- sealed
- connection wirings
- protruding
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims 2
- 229920005570 flexible polymer Polymers 0.000 claims 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989096903U JPH0336143U (enrdf_load_stackoverflow) | 1989-08-18 | 1989-08-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989096903U JPH0336143U (enrdf_load_stackoverflow) | 1989-08-18 | 1989-08-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0336143U true JPH0336143U (enrdf_load_stackoverflow) | 1991-04-09 |
Family
ID=31646076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989096903U Pending JPH0336143U (enrdf_load_stackoverflow) | 1989-08-18 | 1989-08-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0336143U (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006198008A (ja) * | 2005-01-18 | 2006-08-03 | Tanizawa Seisakusho Ltd | 胴ベルト型安全帯 |
-
1989
- 1989-08-18 JP JP1989096903U patent/JPH0336143U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006198008A (ja) * | 2005-01-18 | 2006-08-03 | Tanizawa Seisakusho Ltd | 胴ベルト型安全帯 |