JPH0227736U - - Google Patents
Info
- Publication number
- JPH0227736U JPH0227736U JP10568888U JP10568888U JPH0227736U JP H0227736 U JPH0227736 U JP H0227736U JP 10568888 U JP10568888 U JP 10568888U JP 10568888 U JP10568888 U JP 10568888U JP H0227736 U JPH0227736 U JP H0227736U
- Authority
- JP
- Japan
- Prior art keywords
- plastic
- polymer substrate
- semiconductor element
- sealed
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 229920000307 polymer substrate Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000001721 transfer moulding Methods 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10568888U JPH0227736U (enrdf_load_stackoverflow) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10568888U JPH0227736U (enrdf_load_stackoverflow) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227736U true JPH0227736U (enrdf_load_stackoverflow) | 1990-02-22 |
Family
ID=31338527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10568888U Pending JPH0227736U (enrdf_load_stackoverflow) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227736U (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5493456A (en) * | 1977-12-29 | 1979-07-24 | Tanazawa Hakkosha Kk | Smooth printed circuit board and method of making same |
| JPS55157236A (en) * | 1979-05-28 | 1980-12-06 | Nec Corp | Semiconductor device |
-
1988
- 1988-08-10 JP JP10568888U patent/JPH0227736U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5493456A (en) * | 1977-12-29 | 1979-07-24 | Tanazawa Hakkosha Kk | Smooth printed circuit board and method of making same |
| JPS55157236A (en) * | 1979-05-28 | 1980-12-06 | Nec Corp | Semiconductor device |