JPH0334865B2 - - Google Patents

Info

Publication number
JPH0334865B2
JPH0334865B2 JP27307285A JP27307285A JPH0334865B2 JP H0334865 B2 JPH0334865 B2 JP H0334865B2 JP 27307285 A JP27307285 A JP 27307285A JP 27307285 A JP27307285 A JP 27307285A JP H0334865 B2 JPH0334865 B2 JP H0334865B2
Authority
JP
Japan
Prior art keywords
heat sink
solder
semiconductor element
heat
detaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP27307285A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62131551A (ja
Inventor
Haruhiko Yamamoto
Yoshiaki Udagawa
Mitsuhiko Nakada
Masahiro Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP27307285A priority Critical patent/JPS62131551A/ja
Priority to US06/914,942 priority patent/US4879632A/en
Priority to EP86307669A priority patent/EP0217676B1/en
Priority to DE86307669T priority patent/DE3688962T2/de
Publication of JPS62131551A publication Critical patent/JPS62131551A/ja
Priority to US07/079,876 priority patent/US4920574A/en
Priority to US07/079,877 priority patent/US4783721A/en
Priority to US07/261,904 priority patent/US5126919A/en
Publication of JPH0334865B2 publication Critical patent/JPH0334865B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP27307285A 1985-10-04 1985-12-03 ヒ−トシンク着脱方法 Granted JPS62131551A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP27307285A JPS62131551A (ja) 1985-12-03 1985-12-03 ヒ−トシンク着脱方法
US06/914,942 US4879632A (en) 1985-10-04 1986-10-03 Cooling system for an electronic circuit device
EP86307669A EP0217676B1 (en) 1985-10-04 1986-10-03 Cooling system for electronic circuit device
DE86307669T DE3688962T2 (de) 1985-10-04 1986-10-03 Kühlsystem für eine elektronische Schaltungsanordnung.
US07/079,876 US4920574A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/079,877 US4783721A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/261,904 US5126919A (en) 1985-10-04 1988-10-25 Cooling system for an electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27307285A JPS62131551A (ja) 1985-12-03 1985-12-03 ヒ−トシンク着脱方法

Publications (2)

Publication Number Publication Date
JPS62131551A JPS62131551A (ja) 1987-06-13
JPH0334865B2 true JPH0334865B2 (enrdf_load_html_response) 1991-05-24

Family

ID=17522751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27307285A Granted JPS62131551A (ja) 1985-10-04 1985-12-03 ヒ−トシンク着脱方法

Country Status (1)

Country Link
JP (1) JPS62131551A (enrdf_load_html_response)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4640170B2 (ja) * 2005-12-28 2011-03-02 株式会社豊田自動織機 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置
CN115992968B (zh) * 2023-03-10 2025-08-22 上海瞳亮科技有限责任公司 一种相变储热式取暖器及使用方法

Also Published As

Publication number Publication date
JPS62131551A (ja) 1987-06-13

Similar Documents

Publication Publication Date Title
US6374616B2 (en) Heat exchanger
JPH0334865B2 (enrdf_load_html_response)
US6168070B1 (en) Method for soldering DPAK-type electronic components to circuit boards
US5651495A (en) Thermoelectric cooler assisted soldering
JPH0423456A (ja) 部品冷却装置
JPH0335832B2 (enrdf_load_html_response)
JP2008147647A (ja) 特にマイクロプロセッサ型計算ユニットのための熱伝導バス
JPH02159047A (ja) フラックスレス接合方法
JP2780437B2 (ja) はんだバンプの形成方法
JPH04270092A (ja) 半田材料及び接合方法
JPS6197953A (ja) 集積回路部品パツケ−ジの伝導冷却構造
JP2619744B2 (ja) ヒートパイプ式冷却器
JPS62216349A (ja) 伝導冷却機構の脱着方法
JPH021959A (ja) 集積回路用冷却装置
KR102603213B1 (ko) 전력 반도체용 냉각 장치 및 그 제조 방법
JPH083015Y2 (ja) 半導体素子の冷却装置
JPS6245155A (ja) 冷却された半導体装置
JPS62131547A (ja) 半導体冷却装置
CN1981967A (zh) 一种超导电流引线焊接方法
JPH02144949A (ja) パッケージの組立方法
JPS6096760A (ja) スパツタリングタ−ゲツト装置
JPH0323061A (ja) ヒートシンクの接合方法
JPH0334221B2 (enrdf_load_html_response)
JPS62290886A (ja) イオンミリング装置
KR100759497B1 (ko) 반도체 소자와 방열판의 어셈블리 및 그 제조방법

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees