JPH0334434B2 - - Google Patents
Info
- Publication number
- JPH0334434B2 JPH0334434B2 JP11266585A JP11266585A JPH0334434B2 JP H0334434 B2 JPH0334434 B2 JP H0334434B2 JP 11266585 A JP11266585 A JP 11266585A JP 11266585 A JP11266585 A JP 11266585A JP H0334434 B2 JPH0334434 B2 JP H0334434B2
- Authority
- JP
- Japan
- Prior art keywords
- welding
- copper
- electron beam
- copper alloy
- welded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003466 welding Methods 0.000 claims description 71
- 239000000463 material Substances 0.000 claims description 46
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 27
- 238000010894 electron beam technology Methods 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- 239000010953 base metal Substances 0.000 claims description 19
- 238000009749 continuous casting Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000000956 alloy Substances 0.000 description 11
- 230000007547 defect Effects 0.000 description 8
- 230000032683 aging Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000001816 cooling Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 2
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000003483 aging Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Welding Or Cutting Using Electron Beams (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11266585A JPS61269989A (ja) | 1985-05-25 | 1985-05-25 | 銅或は銅合金製の筒形連続鋳造モ−ルド又は溶解用るつぼ炉の溶接製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11266585A JPS61269989A (ja) | 1985-05-25 | 1985-05-25 | 銅或は銅合金製の筒形連続鋳造モ−ルド又は溶解用るつぼ炉の溶接製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61269989A JPS61269989A (ja) | 1986-11-29 |
JPH0334434B2 true JPH0334434B2 (enrdf_load_stackoverflow) | 1991-05-22 |
Family
ID=14592416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11266585A Granted JPS61269989A (ja) | 1985-05-25 | 1985-05-25 | 銅或は銅合金製の筒形連続鋳造モ−ルド又は溶解用るつぼ炉の溶接製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61269989A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6975296B1 (en) | 1991-06-14 | 2005-12-13 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method of driving the same |
US7179726B2 (en) | 1992-11-06 | 2007-02-20 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing apparatus and laser processing process |
US7329906B2 (en) | 1992-08-27 | 2008-02-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for forming the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2872441B1 (fr) * | 2004-07-01 | 2006-09-22 | Commissariat Energie Atomique | Procede de soudage de deux pieces d'un alliage d'aluminium |
-
1985
- 1985-05-25 JP JP11266585A patent/JPS61269989A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6975296B1 (en) | 1991-06-14 | 2005-12-13 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method of driving the same |
US7329906B2 (en) | 1992-08-27 | 2008-02-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for forming the same |
US7416907B2 (en) | 1992-08-27 | 2008-08-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for forming the same |
US7179726B2 (en) | 1992-11-06 | 2007-02-20 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing apparatus and laser processing process |
Also Published As
Publication number | Publication date |
---|---|
JPS61269989A (ja) | 1986-11-29 |
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