JPH0334227B2 - - Google Patents

Info

Publication number
JPH0334227B2
JPH0334227B2 JP7135585A JP7135585A JPH0334227B2 JP H0334227 B2 JPH0334227 B2 JP H0334227B2 JP 7135585 A JP7135585 A JP 7135585A JP 7135585 A JP7135585 A JP 7135585A JP H0334227 B2 JPH0334227 B2 JP H0334227B2
Authority
JP
Japan
Prior art keywords
heat
cooling
adapter
heat radiator
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7135585A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61239653A (ja
Inventor
Michiharu Abe
Sueo Shinbashi
Misao Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7135585A priority Critical patent/JPS61239653A/ja
Publication of JPS61239653A publication Critical patent/JPS61239653A/ja
Publication of JPH0334227B2 publication Critical patent/JPH0334227B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP7135585A 1985-04-04 1985-04-04 半導体部品の冷却構造 Granted JPS61239653A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7135585A JPS61239653A (ja) 1985-04-04 1985-04-04 半導体部品の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7135585A JPS61239653A (ja) 1985-04-04 1985-04-04 半導体部品の冷却構造

Publications (2)

Publication Number Publication Date
JPS61239653A JPS61239653A (ja) 1986-10-24
JPH0334227B2 true JPH0334227B2 (enrdf_load_stackoverflow) 1991-05-21

Family

ID=13458099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7135585A Granted JPS61239653A (ja) 1985-04-04 1985-04-04 半導体部品の冷却構造

Country Status (1)

Country Link
JP (1) JPS61239653A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101344866B1 (ko) * 2012-03-09 2013-12-24 삼성전기주식회사 Ｄｍｄ 모듈 냉각장치

Also Published As

Publication number Publication date
JPS61239653A (ja) 1986-10-24

Similar Documents

Publication Publication Date Title
US5168919A (en) Air cooled heat exchanger for multi-chip assemblies
CA1097788A (en) Gas encapsulated cooling module
US5699227A (en) Heat pipe to baseplate attachment method
KR20040030513A (ko) 방열장치
US20020056908A1 (en) Heatpipesink having integrated heat pipe and heat sink
WO2002081996A3 (en) Orientation-independent thermosyphon heat spreader
US20040100771A1 (en) Heat-dissipating device
MY134209A (en) High performance air cooled heat sinks used in high density packaging applications
US20080142192A1 (en) Heat dissipation device with a heat pipe
WO2019043835A1 (ja) 電子装置
GB2342152A (en) Plate type heat pipe and its installation structure
JPH06163758A (ja) 形状記憶合金製バネを用いたｉｃソケットによる放熱構造
JPH10229288A (ja) 電力半導体装置
JPH0334227B2 (enrdf_load_stackoverflow)
JPH1187586A (ja) マルチチップモジュールの冷却構造
KR200263467Y1 (ko) 써멀 베이스를 이용한 통신장비용 방열장치
JPS61255042A (ja) 半導体装置用ヒ−トシンク
JPS6144450Y2 (enrdf_load_stackoverflow)
JPS59208761A (ja) 電子部品冷却機構
JPH0888303A (ja) Ｉｃの放熱装置
JPS6129163A (ja) Ｉｃモジユ−ルユニツト
JPS5854506B2 (ja) ホウネツソウチ
JP2000156584A (ja) 放熱構造を有する装置
JPS5911515Y2 (ja) 液体含有冷却器
JPH05198714A (ja) 電子機器の冷却構造