JPH0334223B2 - - Google Patents

Info

Publication number
JPH0334223B2
JPH0334223B2 JP27307085A JP27307085A JPH0334223B2 JP H0334223 B2 JPH0334223 B2 JP H0334223B2 JP 27307085 A JP27307085 A JP 27307085A JP 27307085 A JP27307085 A JP 27307085A JP H0334223 B2 JPH0334223 B2 JP H0334223B2
Authority
JP
Japan
Prior art keywords
integrated circuit
cooling
bubble discharge
solder
discharge path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP27307085A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62131548A (ja
Inventor
Haruhiko Yamamoto
Yoshiaki Udagawa
Mitsuhiko Nakada
Masahiro Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP27307085A priority Critical patent/JPS62131548A/ja
Priority to DE86307669T priority patent/DE3688962T2/de
Priority to EP86307669A priority patent/EP0217676B1/en
Priority to US06/914,942 priority patent/US4879632A/en
Publication of JPS62131548A publication Critical patent/JPS62131548A/ja
Priority to US07/079,876 priority patent/US4920574A/en
Priority to US07/079,877 priority patent/US4783721A/en
Priority to US07/261,904 priority patent/US5126919A/en
Publication of JPH0334223B2 publication Critical patent/JPH0334223B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP27307085A 1985-10-04 1985-12-03 集積回路素子用冷却装置 Granted JPS62131548A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP27307085A JPS62131548A (ja) 1985-12-03 1985-12-03 集積回路素子用冷却装置
DE86307669T DE3688962T2 (de) 1985-10-04 1986-10-03 Kühlsystem für eine elektronische Schaltungsanordnung.
EP86307669A EP0217676B1 (en) 1985-10-04 1986-10-03 Cooling system for electronic circuit device
US06/914,942 US4879632A (en) 1985-10-04 1986-10-03 Cooling system for an electronic circuit device
US07/079,876 US4920574A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/079,877 US4783721A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/261,904 US5126919A (en) 1985-10-04 1988-10-25 Cooling system for an electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27307085A JPS62131548A (ja) 1985-12-03 1985-12-03 集積回路素子用冷却装置

Publications (2)

Publication Number Publication Date
JPS62131548A JPS62131548A (ja) 1987-06-13
JPH0334223B2 true JPH0334223B2 (enrdf_load_stackoverflow) 1991-05-21

Family

ID=17522724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27307085A Granted JPS62131548A (ja) 1985-10-04 1985-12-03 集積回路素子用冷却装置

Country Status (1)

Country Link
JP (1) JPS62131548A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS62131548A (ja) 1987-06-13

Similar Documents

Publication Publication Date Title
US7025129B2 (en) Adhesive to attach a cooling device to a thermal interface
JP3518434B2 (ja) マルチチップモジュールの冷却装置
US10215504B2 (en) Flexible cold plate with enhanced flexibility
JP2015173301A (ja) 両面冷却式電力用被覆層付き電力モジュール
US4620216A (en) Unitary slotted heat sink for semiconductor packages
JPH06252285A (ja) 回路基板
JPH0454381B2 (enrdf_load_stackoverflow)
JP2006245479A (ja) 電子部品冷却装置
CN108766943B (zh) 一种智能响应芯片热点的自适应热质传输散热装置
CA1204523A (en) Unitary slotted heat sink for semiconductor packages
JPH0334223B2 (enrdf_load_stackoverflow)
JPH06224338A (ja) 電子装置
JP2004311911A (ja) 水冷式ヒートシンク並びに水冷式ユニット
JPH06310626A (ja) 半導体チップ及び半導体集積回路装置
JP2002026214A (ja) 電子部品冷却装置
JPH0281463A (ja) 半導体装置の冷却実装構造
JPS5839044A (ja) 半導体装置用集積パツケ−ジ・薄膜熱交換器
JPH10270614A (ja) ヒートシンク及び半導体装置
JPH03225889A (ja) 流体冷却式金属ベース配線基板
JPS63289847A (ja) Ｌｓｉパッケ−ジの放熱構造
TWI666543B (zh) 可變橋接的散熱模組及其應用的電子裝置
US11439043B2 (en) Multi-device cooling structure having assembly alignment features
JPS61272954A (ja) 磁性流体を用いた冷却構造
JPH0617313Y2 (ja) 液冷形半導体パッケージ
JPH05218245A (ja) 半導体装置および半導体装置用ヒートシンク

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees