JPH0334064U - - Google Patents
Info
- Publication number
- JPH0334064U JPH0334064U JP9178389U JP9178389U JPH0334064U JP H0334064 U JPH0334064 U JP H0334064U JP 9178389 U JP9178389 U JP 9178389U JP 9178389 U JP9178389 U JP 9178389U JP H0334064 U JPH0334064 U JP H0334064U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- cup
- jet
- plating device
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Coating Apparatus (AREA)
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9178389U JPH0334064U (it) | 1989-08-03 | 1989-08-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9178389U JPH0334064U (it) | 1989-08-03 | 1989-08-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0334064U true JPH0334064U (it) | 1991-04-03 |
Family
ID=31641248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9178389U Pending JPH0334064U (it) | 1989-08-03 | 1989-08-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334064U (it) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002220690A (ja) * | 2001-01-29 | 2002-08-09 | Dowa Mining Co Ltd | 電気メッキ方法および装置 |
| JP2014051697A (ja) * | 2012-09-05 | 2014-03-20 | Mitomo Semicon Engineering Kk | カップ式めっき装置及びこれを用いるめっき方法 |
| JP2014189811A (ja) * | 2013-03-26 | 2014-10-06 | Kyocera Corp | 無電解メッキ装置 |
-
1989
- 1989-08-03 JP JP9178389U patent/JPH0334064U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002220690A (ja) * | 2001-01-29 | 2002-08-09 | Dowa Mining Co Ltd | 電気メッキ方法および装置 |
| JP4677675B2 (ja) * | 2001-01-29 | 2011-04-27 | Ｄｏｗａメタルテック株式会社 | 電気メッキ方法および装置 |
| JP2014051697A (ja) * | 2012-09-05 | 2014-03-20 | Mitomo Semicon Engineering Kk | カップ式めっき装置及びこれを用いるめっき方法 |
| JP2014189811A (ja) * | 2013-03-26 | 2014-10-06 | Kyocera Corp | 無電解メッキ装置 |