JPH0332421U - - Google Patents

Info

Publication number
JPH0332421U
JPH0332421U JP9207489U JP9207489U JPH0332421U JP H0332421 U JPH0332421 U JP H0332421U JP 9207489 U JP9207489 U JP 9207489U JP 9207489 U JP9207489 U JP 9207489U JP H0332421 U JPH0332421 U JP H0332421U
Authority
JP
Japan
Prior art keywords
stem
die
semiconductor
bonding
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9207489U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0810187Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9207489U priority Critical patent/JPH0810187Y2/ja
Publication of JPH0332421U publication Critical patent/JPH0332421U/ja
Application granted granted Critical
Publication of JPH0810187Y2 publication Critical patent/JPH0810187Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP9207489U 1989-08-04 1989-08-04 ダイボンディング装置 Expired - Lifetime JPH0810187Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9207489U JPH0810187Y2 (ja) 1989-08-04 1989-08-04 ダイボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9207489U JPH0810187Y2 (ja) 1989-08-04 1989-08-04 ダイボンディング装置

Publications (2)

Publication Number Publication Date
JPH0332421U true JPH0332421U (enrdf_load_stackoverflow) 1991-03-29
JPH0810187Y2 JPH0810187Y2 (ja) 1996-03-27

Family

ID=31641520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9207489U Expired - Lifetime JPH0810187Y2 (ja) 1989-08-04 1989-08-04 ダイボンディング装置

Country Status (1)

Country Link
JP (1) JPH0810187Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0810187Y2 (ja) 1996-03-27

Similar Documents

Publication Publication Date Title
JPH0332421U (enrdf_load_stackoverflow)
JPS62122340U (enrdf_load_stackoverflow)
JPS6324833U (enrdf_load_stackoverflow)
JPH0485760U (enrdf_load_stackoverflow)
JPS6318839U (enrdf_load_stackoverflow)
JPH03109333U (enrdf_load_stackoverflow)
JPS62157142U (enrdf_load_stackoverflow)
JPS6385384U (enrdf_load_stackoverflow)
JPS6448030U (enrdf_load_stackoverflow)
JPH0325237U (enrdf_load_stackoverflow)
JPS6274944U (enrdf_load_stackoverflow)
JPS649104U (enrdf_load_stackoverflow)
JPH0316329U (enrdf_load_stackoverflow)
JPH0229526U (enrdf_load_stackoverflow)
JPH0224556U (enrdf_load_stackoverflow)
JPH0228256B2 (enrdf_load_stackoverflow)
JPH0163144U (enrdf_load_stackoverflow)
JPH01116437U (enrdf_load_stackoverflow)
JPH01123340U (enrdf_load_stackoverflow)
JPH0313740U (enrdf_load_stackoverflow)
JPS6260037U (enrdf_load_stackoverflow)
JPS6251741U (enrdf_load_stackoverflow)
JPH0295238U (enrdf_load_stackoverflow)
JPH0184449U (enrdf_load_stackoverflow)
JPH01162239U (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term