JPH0332223B2 - - Google Patents
Info
- Publication number
- JPH0332223B2 JPH0332223B2 JP11736885A JP11736885A JPH0332223B2 JP H0332223 B2 JPH0332223 B2 JP H0332223B2 JP 11736885 A JP11736885 A JP 11736885A JP 11736885 A JP11736885 A JP 11736885A JP H0332223 B2 JPH0332223 B2 JP H0332223B2
- Authority
- JP
- Japan
- Prior art keywords
- water
- cooling
- semiconductor
- semiconductor module
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 66
- 239000004065 semiconductor Substances 0.000 claims description 52
- 238000001816 cooling Methods 0.000 claims description 50
- 229910044991 metal oxide Inorganic materials 0.000 claims description 10
- 150000004706 metal oxides Chemical class 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 8
- 230000002123 temporal effect Effects 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims 1
- 239000000498 cooling water Substances 0.000 description 11
- 230000007797 corrosion Effects 0.000 description 10
- 238000005260 corrosion Methods 0.000 description 10
- 238000012423 maintenance Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 230000006378 damage Effects 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000009835 boiling Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000011104 metalized film Substances 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4336—Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11736885A JPS61276242A (ja) | 1985-05-30 | 1985-05-30 | 半導体モジユ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11736885A JPS61276242A (ja) | 1985-05-30 | 1985-05-30 | 半導体モジユ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61276242A JPS61276242A (ja) | 1986-12-06 |
| JPH0332223B2 true JPH0332223B2 (enrdf_load_stackoverflow) | 1991-05-10 |
Family
ID=14709929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11736885A Granted JPS61276242A (ja) | 1985-05-30 | 1985-05-30 | 半導体モジユ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61276242A (enrdf_load_stackoverflow) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0320198B1 (en) * | 1987-12-07 | 1995-03-01 | Nec Corporation | Cooling system for IC package |
| US5023695A (en) * | 1988-05-09 | 1991-06-11 | Nec Corporation | Flat cooling structure of integrated circuit |
| US4975766A (en) * | 1988-08-26 | 1990-12-04 | Nec Corporation | Structure for temperature detection in a package |
| JPH06100408B2 (ja) * | 1988-09-09 | 1994-12-12 | 日本電気株式会社 | 冷却装置 |
| US5014777A (en) * | 1988-09-20 | 1991-05-14 | Nec Corporation | Cooling structure |
| JP2927975B2 (ja) * | 1991-01-24 | 1999-07-28 | 日本電気株式会社 | 集積回路パッケージの温度検出構造および温度センサキャリア |
| JP2728105B2 (ja) * | 1991-10-21 | 1998-03-18 | 日本電気株式会社 | 集積回路用冷却装置 |
| JP2852148B2 (ja) * | 1991-10-21 | 1999-01-27 | 日本電気株式会社 | 集積回路パッケージの冷却構造 |
-
1985
- 1985-05-30 JP JP11736885A patent/JPS61276242A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61276242A (ja) | 1986-12-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1249063A (en) | Evaporation cooling module for semiconductor devices | |
| US4553020A (en) | Electronic component package comprising a moisture-retention element | |
| US6144013A (en) | Local humidity control system for low temperature electronic module | |
| JPS59200495A (ja) | マルチチツプ・モジユ−ル | |
| JPH0332223B2 (enrdf_load_stackoverflow) | ||
| US20230057498A1 (en) | Two phase containment system having controlled air flow | |
| US11778791B2 (en) | Two phase containment system for servers | |
| CN119173016B (zh) | 一种井下电子元器件舱室降温系统 | |
| CN119447050A (zh) | 半导体封装结构及集成电路封装件 | |
| EP0411119A1 (en) | Semiconductor module, its cooling system and computer using the cooling system | |
| US20060029114A1 (en) | Semiconductor laser device | |
| KR20240026462A (ko) | 공랭식 서버를 위한 하이브리드 마더보드 냉각 시스템 | |
| JPS61279157A (ja) | 半導体装置の冷却装置 | |
| JPH03268455A (ja) | 半導体モジュール | |
| JPH0325420Y2 (enrdf_load_stackoverflow) | ||
| JPH02184057A (ja) | 密閉型電子機器の冷却モジュール構造 | |
| CN219802365U (zh) | 一种防护型工业交换机 | |
| CN217406880U (zh) | 一种消防无人机传输转接设备 | |
| JP2613285B2 (ja) | 半導体モジュールとその冷却システム及びそれを用いたコンピュータ | |
| JP3395409B2 (ja) | 半導体モジュール | |
| JPS57145347A (en) | Semiconductor package | |
| JPH01157596A (ja) | データ処理装置 | |
| JPS6046055A (ja) | 電子部品の冷却装置 | |
| JPH0342702B2 (enrdf_load_stackoverflow) | ||
| JPS5816237Y2 (ja) | 液浸形電気機器の液枯れ検出装置 |