JPH0330829A - Cleaning of gas flow passage - Google Patents
Cleaning of gas flow passageInfo
- Publication number
- JPH0330829A JPH0330829A JP16261189A JP16261189A JPH0330829A JP H0330829 A JPH0330829 A JP H0330829A JP 16261189 A JP16261189 A JP 16261189A JP 16261189 A JP16261189 A JP 16261189A JP H0330829 A JPH0330829 A JP H0330829A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- raw material
- cleaning
- gas flow
- automatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000010926 purge Methods 0.000 abstract description 15
- 239000000356 contaminant Substances 0.000 abstract 2
- 239000007789 gas Substances 0.000 description 87
- 239000002994 raw material Substances 0.000 description 42
- 239000000126 substance Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B37/00—Manufacture or treatment of flakes, fibres, or filaments from softened glass, minerals, or slags
- C03B37/01—Manufacture of glass fibres or filaments
- C03B37/012—Manufacture of preforms for drawing fibres or filaments
- C03B37/014—Manufacture of preforms for drawing fibres or filaments made entirely or partially by chemical means, e.g. vapour phase deposition of bulk porous glass either by outside vapour deposition [OVD], or by outside vapour phase oxidation [OVPO] or by vapour axial deposition [VAD]
- C03B37/01413—Reactant delivery systems
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2207/00—Glass deposition burners
- C03B2207/80—Feeding the burner or the burner-heated deposition site
- C03B2207/81—Constructional details of the feed line, e.g. heating, insulation, material, manifolds, filters
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacture, Treatment Of Glass Fibers (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は、例えば光ファイバー母材酸いは半導体素子等
の製造に用いる原料ガス供給装置のガス供給路の如き、
途中に機器が接続されているガス流通路の清掃方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Fields of Application] The present invention is applicable to gas supply paths of raw material gas supply devices used in the manufacture of optical fiber base materials, semiconductor devices, etc.
The present invention relates to a method for cleaning a gas flow path to which equipment is connected.
［従来の技術］
従来のこの種の原料ガス供給装置では、第３図に示すよ
うに、気密な原料タンク１には大気中の酸素又は水分と
反応するＳ ｉ Ｃｆｌ ４ 、Ｇ ｅ Ｃｊ２４等の
原料液２が収容されている。原料タンク１の外周には、
原料液２を気化するためのヒータ等の加熱手段３が取り
付けられている。これら原料タンク１及び加熱手段３に
て原料ガス供給源４が構成されている。原料タンク１内
の上部空間５には、原料液２の気化により得られた原料
ガスが原料タンク１の温度における蒸気圧で満たされる
ようになっている。原料タンク１内の上部空間５と供給
相手である図示しない反応装置との間には、原料ガスを
その蒸気圧を利用して供給するガス流通路６が設けられ
ている。ガス流通路６には、開閉弁７、自動開閉弁８．
マスフローコントローラの如き流量制御器９等の機器が
接続されている。自動開閉弁８と流量制御器９との間に
は、配管１０が接続され、該配管１０には自動開閉弁１
１が接続されていて＼該配管１０を通してパージ用の窒
素ガスが供給されるようになっている。自動開閉弁１１
は自動開閉弁８と連動し、原料供給中は、自動開閉弁８
が開で、自動開閉弁１１が閉となって、原料ガスを反応
装置に供給するようになっている。[Prior Art] In a conventional raw material gas supply device of this type, as shown in FIG. A raw material liquid 2 is stored. On the outer periphery of the raw material tank 1,
A heating means 3 such as a heater for vaporizing the raw material liquid 2 is attached. These raw material tank 1 and heating means 3 constitute a raw material gas supply source 4. The upper space 5 in the raw material tank 1 is filled with raw material gas obtained by vaporizing the raw material liquid 2 at a vapor pressure at the temperature of the raw material tank 1 . A gas flow passage 6 is provided between the upper space 5 in the raw material tank 1 and a reactor (not shown) to which the raw material gas is supplied. The gas flow passage 6 includes an on-off valve 7, an automatic on-off valve 8.
Devices such as a flow rate controller 9 such as a mass flow controller are connected. A pipe 10 is connected between the automatic on-off valve 8 and the flow rate controller 9, and the automatic on-off valve 1 is connected to the pipe 10.
1 is connected, and nitrogen gas for purging is supplied through the pipe 10. Automatic open/close valve 11
is linked with automatic on-off valve 8, and during raw material supply, automatic on-off valve 8
is open, and the automatic on-off valve 11 is closed to supply raw material gas to the reaction apparatus.
原料供給をしていない原料ガス供給停止中には、自動開
閉弁８を閉、自動開閉弁１１を開として、ガス流通路６
中に加圧窒素ガスを流し、該ガス流通路６の加圧ガスパ
ージを行っている。When the raw material gas supply is stopped and the raw material is not being supplied, the automatic on-off valve 8 is closed, the automatic on-off valve 11 is opened, and the gas flow path 6 is closed.
Pressurized nitrogen gas is flowed inside to purge the gas flow path 6 with pressurized gas.
［発明が解決しようとする課題］
上記の如き原料ガス供給装置では、非常に高濃度の原料
ガスが流量制御器９を有するガス流通路６内を流れる。[Problems to be Solved by the Invention] In the raw material gas supply device as described above, a very high concentration raw material gas flows in the gas flow passage 6 having the flow rate controller 9.
一方便用される原料ガスは、酸素や水分と容易に反応し
、強い腐食性ガスや粉状の生成物質を発生しく例えば、
ＳｉＣλ４＋２Ｈ２０−＋５ｉ０２：生成物質＋４ＨＣ
，ｇ：腐食性ガス）、ガス流通路６内の詰りゃ腐食の原
因となる問題点がある。特に、流量制御器９として使用
されるマスフローコントローラは、流量制御のため微小
なオリフィス状の流路と、微動往復弁により出入口間の
圧力損失をコントロールしているため、上記の腐食や粉
末生成物質により正常な制御ができなくなると共に、腐
食保護のためには高価で複雑なものが必要となる問題点
がある。On the other hand, raw material gas used for convenience easily reacts with oxygen and moisture and generates strong corrosive gases and powdery substances.
SiCλ4+2H20-+5i02: generated substance +4HC
, g: corrosive gas), there is a problem that if the gas flow passage 6 is clogged, it may cause corrosion. In particular, the mass flow controller used as the flow rate controller 9 controls the pressure loss between the inlet and outlet using a minute orifice-like flow path and a fine reciprocating valve to control the flow rate. There are problems in that proper control cannot be achieved due to this, and expensive and complicated equipment is required for corrosion protection.
このような事故防止のため、前述したように原料ガスの
供給停止中に、流量制御器９を有するガス流通路６内の
加圧ガスパージを行なっているが、このような加圧ガス
パージでは清掃効果が不十分であり、このため流量制御
器９を中心とした定期的な部品交換が必要となり、装置
の稼動停止を余儀なくされている。In order to prevent such accidents, pressurized gas purge is performed in the gas flow passage 6 having the flow rate controller 9 while the raw material gas supply is stopped, as described above, but such pressurized gas purge has a poor cleaning effect. is insufficient, and as a result, regular parts replacement, mainly the flow rate controller 9, are required, forcing the device to stop operating.
本発明の目的は、機器が途中に接続されているガス流通
路内の清掃を従来より効果的に行なうことができるガス
流通路の製造方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a gas flow path that can more effectively clean the inside of a gas flow path to which equipment is connected in the middle than before.
［課題を解決するための手段］
上記の目的を達成するための本発明の詳細な説明すると
、本発明に係るガス流通路の清掃方法は、途中に機器が
接続されているガス流通路内を真空引きすることにより
清掃を行なうことを特徴とする。[Means for Solving the Problems] To explain in detail the present invention for achieving the above object, the method for cleaning a gas flow passage according to the present invention cleans the inside of a gas flow passage to which equipment is connected in the middle. It is characterized by cleaning by vacuuming.
［作用コ
本発明者等の種々の実験の結果、機器が途中に接続され
ているガス流通路内の清掃は、加圧ガスパージよりも真
空引きのほうが清掃効果が遥かに良いことを見出した。[Operations] As a result of various experiments conducted by the present inventors, it has been found that vacuuming has a far better cleaning effect than pressurized gas purge in cleaning the gas flow passageway to which equipment is connected midway.
このため、ガスの供給停止時に、機器が途中に接続され
ているガス流通路内を真空引きし、正常なガスの流通を
妨げる付着物質及び残留ガスを吸引して除去する。For this reason, when the gas supply is stopped, the inside of the gas flow path to which the device is connected is evacuated, and the adhered substances and residual gas that impede normal gas flow are suctioned and removed.
［実施例コ
以下、本発明の実施例を図面を参照して詳細に説明する
。なお、前述した第３図と対応する部分には同一符号を
つけて示している。[Embodiments] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that parts corresponding to those in FIG. 3 described above are designated by the same reference numerals.
第１図は、本発明の方法を実施できる原料ガス供給装置
の第１実施例を示したものである。本実施例の原料ガス
供給装置は、マスフローコントローラの如き流量制御器
９から図示しない反応装置に至るガス流通路６に自動開
閉弁１２が接続されている。また、この自動開閉弁１２
と流量制御器９との間のガス流通路６には、自動開閉弁
１３を介して真空ポンプの如き清掃用真空引き機構１４
が接続され、該清掃用真空引き機構１４で真空引きされ
た排ガスは図示しない排ガス処理装置に供給されるよう
になっている。更に、自動開閉弁１２を経て反応装置に
至るガス流通路６の部分には、配管１５が接続され、該
配管１５には自動開閉弁１６が接続されている。FIG. 1 shows a first embodiment of a raw material gas supply apparatus that can carry out the method of the present invention. In the raw material gas supply device of this embodiment, an automatic on-off valve 12 is connected to a gas flow path 6 leading from a flow rate controller 9 such as a mass flow controller to a reaction device (not shown). In addition, this automatic opening/closing valve 12
A cleaning vacuum mechanism 14 such as a vacuum pump is connected to the gas flow passage 6 between the flow rate controller 9 and the flow rate controller 9 via an automatic on-off valve 13.
is connected, and the exhaust gas evacuated by the cleaning vacuum mechanism 14 is supplied to an exhaust gas treatment device (not shown). Further, a pipe 15 is connected to a portion of the gas flow path 6 that reaches the reaction device via the automatic on-off valve 12, and an automatic on-off valve 16 is connected to the pipe 15.
表−１
このような原料ガス供給装置は、原料ガスの供給中は、
表−１に示すように自動開閉弁８，１２を開、自動開閉
弁１３．１６を閉として原料ガス供給源４からガス流通
路６を経て反応装置に原料ガスを供給し、その供給量を
流量制御器９で制御する。Table-1 Such a raw material gas supply device, while supplying raw material gas,
As shown in Table 1, the automatic on-off valves 8 and 12 are opened, the automatic on-off valves 13 and 16 are closed, and raw material gas is supplied from the raw material gas supply source 4 to the reactor through the gas flow path 6, and the amount of supply is controlled. It is controlled by a flow rate controller 9.
原料ガス・の供給停止中は、表−１に示すように自動開
閉弁８，１２を閉、自動開閉弁１３．１６を開とし、清
掃用真空引き機構１４を作動させ、自動開閉弁８，１２
間の流量制御器９を含むガス流通路６内の真空引きをし
、残留している原料ガス及び正常な流量制御を妨げる付
着物質を吸引して除去する。While the supply of raw material gas is stopped, as shown in Table 1, the automatic on-off valves 8 and 12 are closed, the automatic on-off valves 13 and 16 are opened, the cleaning vacuum mechanism 14 is operated, and the automatic on-off valves 8 and 12 are opened. 12
The interior of the gas flow path 6 including the flow rate controller 9 between the two is evacuated to suction and remove the remaining raw material gas and any adhered substances that may interfere with normal flow rate control.
第２図は、本発明の方法を実施できる原料ガス供給装置
の第２実施例を示したものである。本実施例の原料ガス
供給装置においては、自動開閉弁１３と清掃用真空引き
機構１４とに並列にバイパス配管１７が設けられ、該バ
イパス配管１７には自動開閉弁１８が接続されている。FIG. 2 shows a second embodiment of a raw material gas supply device that can carry out the method of the present invention. In the raw material gas supply device of this embodiment, a bypass pipe 17 is provided in parallel with the automatic on-off valve 13 and the cleaning vacuum mechanism 14, and an automatic on-off valve 18 is connected to the bypass pipe 17.
また、自動開閉弁８と流量制御器９との間のガス流通路
６には、配管１０が接続され、該配管１０には自動開閉
弁１１が接続されている。Further, a pipe 10 is connected to the gas flow path 6 between the automatic on-off valve 8 and the flow rate controller 9, and an automatic on-off valve 11 is connected to the pipe 10.
このような原料ガス供給装置は、原料ガスの供給中は、
表−２に示すように自動開閉弁８，１２を開、自動開閉
弁１１．１３．１８．１６を閉として原料ガス供給源４
からガス流通路６を経て反応装置に原料ガスを供給し、
その供給量を流量制御器９で制御する。Such a raw material gas supply device, while supplying raw material gas,
As shown in Table 2, the automatic on-off valves 8 and 12 are opened, and the automatic on-off valves 11, 13, 18, and 16 are closed, and the raw material gas supply source 4
supplying raw material gas to the reactor through the gas flow path 6,
The supply amount is controlled by a flow rate controller 9.
原料ガスの供給停止中は、真空引きと加圧ガスパージと
を交互に行なって、清掃を行なう。真空引きは、自動開
閉弁１３．１６を開、自動開閉弁８．１２．１１．１８
を閉とし、清掃用真空引き機構１４を作動させ、自動開
閉弁８，１２間の流量制御器９を含むガス流通路６内を
真空引きをし、残留している原料ガス及び正常な流量制
御を妨げる付着物質を吸引して除去する。While the supply of raw material gas is stopped, cleaning is performed by alternately performing evacuation and pressurized gas purge. For vacuuming, open the automatic on-off valve 13.16, and open the automatic on-off valve 8.12.11.18.
is closed, the cleaning vacuum mechanism 14 is activated, and the inside of the gas flow path 6 including the flow rate controller 9 between the automatic open/close valves 8 and 12 is evacuated to eliminate the remaining raw material gas and normal flow rate control. Suction and remove any adhering substances that may interfere with the operation.
加圧ガスパージは、自動開閉弁１１．１８．１６を開と
し、自動開閉弁８．１２．１３を閉として、配管１０．
１５から不活性ガスの如き加圧ガスを送って、流量制御
器９を含むガス流通路６内の加圧ガスパージを行なう。Pressurized gas purge is performed by opening automatic on-off valves 11, 18, and 16, and closing automatic on-off valves 8, 12, and 13, and piping 10.
A pressurized gas such as an inert gas is sent from 15 to purge the inside of the gas flow passage 6 including the flow rate controller 9 with pressurized gas.
この場合・、真空引きと加圧ガスパージは、例えば５分
間真空引き、１分間加圧ガスパージの割合で交互に数回
繰り返す。In this case, evacuation and pressurized gas purge are alternately repeated several times, for example, at a rate of evacuation for 5 minutes and pressurized gas purge for 1 minute.
特に、本実施例のように真空引きと加圧ガスパージとを
交互に繰り返すと、真空引きから加圧ガスパージ、或い
は加圧ガスパージから真空引きに切替わるときの圧力差
により、ガス流通路内の付着物質をより効果的に清掃で
きる。In particular, when vacuum evacuation and pressurized gas purge are repeated alternately as in this example, the pressure difference when switching from evacuation to pressurized gas purge or from pressurized gas purge to vacuum evacuation causes adhesion within the gas flow path. Materials can be cleaned more effectively.
なお、上記実施例では、流量制御器を有するガス流通路
の清掃について説明したが、ガス流通路に接続されてい
る機器としては制御器に限らず、圧力計等の計測器、或
いは弁等であってもよい。In addition, in the above embodiment, cleaning of a gas flow path having a flow rate controller was explained, but the equipment connected to the gas flow path is not limited to the controller, but may also include measuring instruments such as pressure gauges, valves, etc. There may be.
これらの機器のガス流通部分に付着する付着物質を、本
発明の方法により効率よく清掃することができる。Adhesive substances adhering to the gas flow parts of these devices can be efficiently cleaned by the method of the present invention.
また、上記実施例では、ガスの供給を行なうガス流通路
の清掃について説明したが、ガスの排出を行なうガス流
通路等の清掃にも本発明は同様に適用である。Further, in the above embodiments, cleaning of the gas flow path for supplying gas has been described, but the present invention is similarly applicable to cleaning of the gas flow path for discharging gas.
［発明の効果コ
以上説明したように本発明に係るガス流通路の清掃方法
は、機器が途中に接続されているガス流通路を真空引き
することにより行うので、加圧ガスパージより効率よく
付着物質の清掃及び排ガスを行なうことができる。[Effects of the Invention] As explained above, the method for cleaning gas flow passages according to the present invention is carried out by vacuuming the gas flow passages to which equipment is connected midway, and therefore removes adhering substances more efficiently than pressurized gas purge. Cleaning and exhaust gas can be carried out.
第１図及び第２図は本発明の方法を実施する原料ガス供
給装置の第１．第２実施例の系統図、第３図は従来の原
料ガス供給装置の系統図である。
１・・・原料タンク、２・・・原料液、３・・・加熱手
段、４・・・原料ガス供給源、５・・・上部空間、６・
・・ガス流通路、８，１１，１２，１３，１６．１８・
・・自動開閉弁、９・・・流量制御器、１０．１５・・
・配管、１４・・・真空引き機構、１７・・・バイパス
配管。1 and 2 show a first part of a raw material gas supply apparatus for carrying out the method of the present invention. A system diagram of the second embodiment, and FIG. 3 is a system diagram of a conventional raw material gas supply device. DESCRIPTION OF SYMBOLS 1... Raw material tank, 2... Raw material liquid, 3... Heating means, 4... Raw material gas supply source, 5... Upper space, 6...
・・Gas flow passage, 8, 11, 12, 13, 16. 18・
...Automatic on-off valve, 9...Flow rate controller, 10.15...
- Piping, 14... Vacuum mechanism, 17... Bypass piping.
Claims (1)
ることにより清掃を行なうことを特徴とするガス流通路
の清掃方法。A method for cleaning a gas flow path, which comprises cleaning the gas flow path by evacuating the inside of the gas flow path to which equipment is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16261189A JPH0330829A (en) | 1989-06-27 | 1989-06-27 | Cleaning of gas flow passage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16261189A JPH0330829A (en) | 1989-06-27 | 1989-06-27 | Cleaning of gas flow passage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330829A true JPH0330829A (en) | 1991-02-08 |
Family
ID=15757891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16261189A Pending JPH0330829A (en) | 1989-06-27 | 1989-06-27 | Cleaning of gas flow passage |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330829A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000205499A (en) * | 1999-01-18 | 2000-07-25 | Air Liquide Japan Ltd | Liquid supply device and purging method in liquid supply device |
| JP2006052424A (en) * | 2004-08-10 | 2006-02-23 | Tokyo Electron Ltd | Thin-film-forming apparatus and thin-film-forming method |
-
1989
- 1989-06-27 JP JP16261189A patent/JPH0330829A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000205499A (en) * | 1999-01-18 | 2000-07-25 | Air Liquide Japan Ltd | Liquid supply device and purging method in liquid supply device |
| JP2006052424A (en) * | 2004-08-10 | 2006-02-23 | Tokyo Electron Ltd | Thin-film-forming apparatus and thin-film-forming method |
| US8518181B2 (en) | 2004-08-10 | 2013-08-27 | Tokyo Electron Limited | Film forming apparatus and film forming method |
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