JPH033028A - Input device - Google Patents
Input deviceInfo
- Publication number
- JPH033028A JPH033028A JP1138734A JP13873489A JPH033028A JP H033028 A JPH033028 A JP H033028A JP 1138734 A JP1138734 A JP 1138734A JP 13873489 A JP13873489 A JP 13873489A JP H033028 A JPH033028 A JP H033028A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- seal
- input device
- electrode
- connecting electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 21
- 238000007789 sealing Methods 0.000 abstract description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 abstract description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 2
- 239000005388 borosilicate glass Substances 0.000 abstract description 2
- 238000005336 cracking Methods 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 229920000515 polycarbonate Polymers 0.000 abstract description 2
- 239000004417 polycarbonate Substances 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は入力装置に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to an input device.
【従来の技術1
従来の入力装置は、第5図に示す様に、上基板2と下基
板lの間に設けられた上下導通電極5の周囲に、連続し
たシール6が形成されていた。[Prior Art 1] In a conventional input device, as shown in FIG. 5, a continuous seal 6 is formed around a vertical conductive electrode 5 provided between an upper substrate 2 and a lower substrate l.
〔発明が解決しようとする課題1
前述の様に上下導通電極5周囲に連続したシール6が形
成されていると、上下基板の透明電極の中でシールを横
切る様に引回される透明電極が生ずることになる。第6
.7図はその一例でシール6を横切っている透明電極4
は、基板2が入力時又は他の理由で変形した場合、シー
ル部で強い曲げ応力を発生し、クラック8を生じ引回し
抵抗の上昇や切断を生じることにより、装着の入力不良
の原因となっていた。[Problem to be Solved by the Invention 1] When the continuous seal 6 is formed around the upper and lower conductive electrodes 5 as described above, the transparent electrode that is routed across the seal in the transparent electrodes of the upper and lower substrates is will occur. 6th
.. Figure 7 shows an example of the transparent electrode 4 crossing the seal 6.
If the board 2 is deformed during input or for other reasons, strong bending stress will occur at the sealing part, causing cracks 8 and increasing routing resistance or cutting, which may cause input failure during installation. was.
又前記したクラック8の発生を防ぐ為、透明電極を横切
るシールをなくす方法がある。第4図はその一例である
が、この場合には上下導通電極5の周囲のシール6の長
さが不十分な為ジ−ソング能力不足を生じ、上基板2の
入力時等による変形により上下導通電極5を透明電極4
が剥離することで、入力不良を生じさせていた。Furthermore, in order to prevent the occurrence of the above-mentioned crack 8, there is a method of eliminating the seal across the transparent electrode. FIG. 4 is an example of this. In this case, the length of the seal 6 around the upper and lower conductive electrodes 5 is insufficient, resulting in insufficient G-song ability, and the upper and lower conductive electrodes 5 are deformed due to input, etc. The conductive electrode 5 is replaced by the transparent electrode 4.
The peeling caused input errors.
本発明はこの様な問題点を解決するもので、その目的は
上下導通電極周囲の透明電極のシールによるクラック破
断を減じ、且つシーリング能力を確保した入力装置を提
供することにある。The present invention has been made to solve these problems, and its purpose is to provide an input device that reduces the occurrence of cracks caused by the sealing of the transparent electrodes around the upper and lower conductive electrodes, and that also ensures sealing performance.
[課題を解決する為の手段1
本発明の入力装置は、上下2枚の透明基板を有し該基板
の対向する内面に透明電極を形成してなる入力装置にお
いて、上下電極間に少なくとも一箇所以上、上下導通電
極を用い、該上下導通電極の周囲に連続したシールと、
不連続のシールを組合わせて形成した事を特徴とする。[Means for Solving the Problems 1] The input device of the present invention has two transparent substrates, upper and lower, and transparent electrodes are formed on the opposing inner surfaces of the substrates. As described above, using upper and lower conductive electrodes, a continuous seal around the upper and lower conductive electrodes,
It is characterized by being formed by combining discontinuous seals.
[実施例1]
第1図は本発明の入力装置の本実施例に於ける平面図で
あり、第2図は第1図A−A部の断面図である。第1図
の1は下基板でソーダガラス又はホウ硅酸ガラスである
。又は、下基板で、ポリエステル、ポリカーボネート、
アクリル等のフィルムを用いた。3は下基板の透明電極
でスパッタ法又は蒸着法で形成されるITO膜、又はC
VD法で形成される酸化スズ膜である。4は、上基板の
透明電極でスパッタ法又は蒸着法で形成されるITo膜
である。5は、上下電極間の電気的導通を得る為の上下
導通電極で、エポキシ又はフェノキシ等の樹脂に金又は
銀フィラーを混入した導通ペーストや、カーボン系の導
通ペーストを用いた。[Embodiment 1] FIG. 1 is a plan view of this embodiment of the input device of the present invention, and FIG. 2 is a sectional view taken along the line AA in FIG. 1. 1 in FIG. 1 is a lower substrate made of soda glass or borosilicate glass. Or, the lower substrate is made of polyester, polycarbonate,
A film such as acrylic was used. 3 is a transparent electrode of the lower substrate, which is an ITO film formed by sputtering or vapor deposition, or C
This is a tin oxide film formed by the VD method. 4 is an ITo film formed by sputtering or vapor deposition on the transparent electrode of the upper substrate. Reference numeral 5 denotes upper and lower conductive electrodes for obtaining electrical continuity between the upper and lower electrodes, and a conductive paste made of a resin such as epoxy or phenoxy mixed with gold or silver filler, or a carbon-based conductive paste was used.
6は、上下基板と導通剤5の周囲を固定しているシール
で、シリコン系の接着剤を用いた。7は、本発明に於け
る不連続シールで6と同様のシリコン系接着剤を用いた
。6 is a seal that fixes the upper and lower substrates and the periphery of the conductive agent 5, and a silicon adhesive is used for the seal. 7 is a discontinuous seal according to the present invention, and the same silicone adhesive as in 6 was used.
この時7は、上基板電極4の中央部に位置し、長さは、
上基板電極4の巾の届とした。At this time, 7 is located at the center of the upper substrate electrode 4 and has a length of
The width of the upper substrate electrode 4 was determined.
以上の様に上下導通電極5の周りの上基板電極4上に不
連続シール7を形成することにより、上基板電極4にス
トレスによるクラックを生ずることなくシール強度を保
てる様になった。この結果、製品の信頼性が格段に向上
した。By forming the discontinuous seal 7 on the upper substrate electrode 4 around the upper and lower conductive electrodes 5 as described above, the seal strength can be maintained without causing cracks in the upper substrate electrode 4 due to stress. As a result, the reliability of the product has been significantly improved.
[実施例2]
第3図は本実施例の要部平面図である。本実施例では、
不連続シール7の形状をL字型としシーリング性能を向
上させたものである。[Embodiment 2] FIG. 3 is a plan view of the main parts of this embodiment. In this example,
The shape of the discontinuous seal 7 is L-shaped to improve sealing performance.
[発明の効果1
上述の如く、本発明によれば、電極のクラックを防止す
るとともに、シール強度を確保した入力装置が得られた
。[Effect of the Invention 1] As described above, according to the present invention, an input device was obtained in which cracking of the electrodes was prevented and sealing strength was ensured.
第1図は1本発明の実施例1の平面図。
第2図は、第1図に於けるA−A面の断面図。
第3図は、本発明の実施例2の要部平面図。
第4図は、従来の入力装置でストレスクラックを避ける
為、導電接着剤の内側の連続シールを全く省いた例を示
す図。
第5図は、従来の入力装置を示す平面図6第6図は、従
来の入力装置で連続したシール上にストレスクラック8
が発生している様子を示す図。
第7図は、第6図のB−B面の断面図。
6 ・ ・
連続シール
7 ・ ・
不連続シール
8・・・上基板電極上に発生したクラック以上
出願人 セイコーエプソン株式会社
代理人 弁理士 鈴 木 喜三部(他1名)下基板
上基板
下基板電極
上基板電極
上下導通電極
第
図
第2
図
第
5図
第
6図
第
4図FIG. 1 is a plan view of Embodiment 1 of the present invention. FIG. 2 is a sectional view taken along the line A-A in FIG. 1. FIG. 3 is a plan view of main parts of Example 2 of the present invention. FIG. 4 is a diagram showing an example in which a continuous seal inside the conductive adhesive is completely omitted in order to avoid stress cracks in a conventional input device. FIG. 5 is a plan view showing a conventional input device. FIG. 6 shows a stress crack 8 on a continuous seal in a conventional input device.
A diagram showing how this occurs. FIG. 7 is a sectional view taken along the line B-B in FIG. 6. 6 ・ ・ Continuous seal 7 ・ ・ Discontinuous seal 8 ... Cracks that occur on the upper substrate electrode Applicant Seiko Epson Corporation Representative Patent attorney Kizobe Suzuki (and 1 other person) Lower substrate Upper substrate Lower substrate Electrode Top Substrate Electrode Vertical Conductive Electrode Figure 2 Figure 5 Figure 6 Figure 4
Claims (1)
明導電膜を形成してなる入力装置において、上下電極間
に、少なくとも一箇所以上、上下導通電極を形成し、該
上下導通電極の周囲に、連続したシールと、不連続のシ
ールを組合わせて形成した事を特徴とする入力装置。In an input device having two transparent substrates, upper and lower, and a transparent conductive film formed on the opposing inner surfaces of the substrates, a vertical conductive electrode is formed at at least one place between the upper and lower electrodes, and the upper and lower conductive electrodes are connected to the upper and lower conductive electrodes. An input device characterized by forming a combination of a continuous seal and a discontinuous seal around the .
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1138734A JPH033028A (en) | 1989-05-31 | 1989-05-31 | Input device |
KR1019900007749A KR900018804A (en) | 1989-05-31 | 1990-05-29 | Input device |
EP19900305803 EP0400953A3 (en) | 1989-05-31 | 1990-05-29 | Input device |
US07/530,867 US5179460A (en) | 1989-05-31 | 1990-05-31 | Input device having double-layer adhesive conductive connecting portions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1138734A JPH033028A (en) | 1989-05-31 | 1989-05-31 | Input device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH033028A true JPH033028A (en) | 1991-01-09 |
Family
ID=15228923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1138734A Pending JPH033028A (en) | 1989-05-31 | 1989-05-31 | Input device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH033028A (en) |
-
1989
- 1989-05-31 JP JP1138734A patent/JPH033028A/en active Pending
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