JPH03156818A - Touch panel - Google Patents

Touch panel

Info

Publication number
JPH03156818A
JPH03156818A JP1296982A JP29698289A JPH03156818A JP H03156818 A JPH03156818 A JP H03156818A JP 1296982 A JP1296982 A JP 1296982A JP 29698289 A JP29698289 A JP 29698289A JP H03156818 A JPH03156818 A JP H03156818A
Authority
JP
Japan
Prior art keywords
electrode
layer
substrate
film substrate
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1296982A
Other languages
Japanese (ja)
Other versions
JP2797552B2 (en
Inventor
Shoji Hiuga
章二 日向
Satoshi Wakabayashi
若林 智
Yoichi Ono
陽一 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP29698289A priority Critical patent/JP2797552B2/en
Priority to EP19900305803 priority patent/EP0400953A3/en
Priority to KR1019900007749A priority patent/KR900018804A/en
Priority to US07/530,867 priority patent/US5179460A/en
Publication of JPH03156818A publication Critical patent/JPH03156818A/en
Application granted granted Critical
Publication of JP2797552B2 publication Critical patent/JP2797552B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To prevent production of cracks at an electrode and peeling of the electrode from a substrate by interposing a layer of conductive synthetic resin thin film which is softer than a layer of binding agent between the electrode on the film substrate and the layer of conductive binding agent. CONSTITUTION:A layer 11 of conductive synthetic resin thin film is interposed almost over the whole surface of a boundary surface between an electrode 3 on a film substrate 1 and a layer 9 of conductive binding agent. As for the layer 11, material can be as desired as far as it is softer than the layer 9 and has resiliency. For example, paste of urethane binding agent including fillers can be used to be applied on the surface of the electrode 3 on the substrate 1 to form a thin film. The electrode 3 on the substrate is connected with a relay electrode 8 on a glass substrate 2 to be continuous through the layer 11.

Description

【発明の詳細な説明】 (産業上の利用分野〕 本発明は例えばCRTやLCD等のデイスプレィの表面
に配設し、デイスプレィで表示された文字や図形等に対
応する位置を指で押すことにより入力や指示を行うタッ
チパネルに関する。
[Detailed Description of the Invention] (Industrial Application Field) The present invention is arranged on the surface of a display such as a CRT or LCD, and by pressing with a finger a position corresponding to a character, figure, etc. displayed on the display. Related to touch panels for inputting and giving instructions.

〔従来の技術〕[Conventional technology]

この種のタッチパネルは、例えば第8図に示すように合
成樹脂製のフィルム基板1とガラス基板2との各対向面
に、ITOやSnO,等の透明電極3・4をストライプ
状その他所型のパターンに形成し、上記両基板1・2を
スペーサ5やシール部材6で所定の間隔を置いて配置し
た構成である。
For example, as shown in FIG. 8, this type of touch panel has transparent electrodes 3 and 4 made of ITO, SnO, etc., arranged in stripes or other shapes on the opposing surfaces of a synthetic resin film substrate 1 and a glass substrate 2. The substrates 1 and 2 are arranged in a pattern with a predetermined distance between them using a spacer 5 and a seal member 6.

そして各基板1・2上の電極3・4は、例えば表面に接
続用配線等を設けたヒートシールやフレキシブルプリン
トサーキット等の可撓性接続部材を介して図に省略した
制御回路基板等に接続する。
The electrodes 3 and 4 on each substrate 1 and 2 are connected to a control circuit board, etc. (not shown in the figure), for example, via a flexible connection member such as a heat seal or a flexible printed circuit with connection wiring provided on the surface. do.

この場合、ガラス基板2とその基板上の電極4とは互い
に無機質であるので密着性がよいが、フィルム基板1と
その基板上の電極3とは、有機質と無機質であるため密
着力がやや不足するきらいがある。
In this case, the glass substrate 2 and the electrodes 4 on the substrate are inorganic and have good adhesion, but the film substrate 1 and the electrodes 3 on the substrate are organic and inorganic, so the adhesion is somewhat insufficient. I don't like to do that.

そのため、フィルム基板1上の電極3に可撓性接続部材
7を導電性接着剤等で直接接続した場合には、例えば可
撓性接続部材を不用意に引っ張ると上記の電極3とフィ
ルム基板1とが剥離するおそれがある。
Therefore, when the flexible connecting member 7 is directly connected to the electrode 3 on the film substrate 1 with a conductive adhesive or the like, for example, if the flexible connecting member is pulled carelessly, the electrode 3 and the film substrate 1 There is a risk of peeling off.

そこで従来は前記第8図のようにガラス基板2上に外部
引出し用の中継電極8を形成し、その中継電極8の一端
を導電性接着剤層9を介してフィルム基板l上の電極3
に導通させ、上記中継用電極8の他端に可撓性接続部材
7を導電性接着剤層10で導通接続している。
Conventionally, a relay electrode 8 for external extraction is formed on the glass substrate 2 as shown in FIG.
The flexible connecting member 7 is electrically connected to the other end of the relay electrode 8 through a conductive adhesive layer 10.

〔発明が解決しようとする課題) ところが、フィルム基板とガラス基板は熱膨張率や、湿
気による膨潤等の違いにより、製作組立時の加熱圧着工
程等の際の熱でフィルム基板が縮み、前記の中継用電極
とフィルム基板上の電極との間に無理な応力が作用して
フィルム基板1上の電極3にクランクが生したり、或い
はその電極3がフィルム基板lから剥がれてしまう等の
問題があった。
[Problem to be solved by the invention] However, due to differences in coefficient of thermal expansion and swelling due to moisture between film substrates and glass substrates, the film substrate shrinks due to heat during the heat-pressing process during production and assembly, resulting in the above-mentioned problem. Problems such as unreasonable stress acting between the relay electrode and the electrode on the film substrate 1 may cause the electrode 3 on the film substrate 1 to crack, or the electrode 3 may peel off from the film substrate 1. there were.

本発明は上記の問題を簡単な構成により解消することを
目的とする。
The present invention aims to solve the above problems with a simple configuration.

〔課題を解決するための手段] 上記の目的を達成するために、本発明は以下の構成とし
たものである。
[Means for Solving the Problems] In order to achieve the above object, the present invention has the following configuration.

即ち、合成樹脂製のフィルム基板1とガラス基板2との
対向面に電極3・4を設け、フィルム基板1上の電極3
を、ガラス基板2上に設けた外部引出し用中継電掻8に
、導電性接着剤層9を介し導電接続するようにしたタッ
チパネルにおいて、上記フィルム基板1上の電極3と上
記導電性接着剤層9との間に、その導電性接着剤N9よ
りも軟質の導電性合成樹脂薄膜層11を介在させたこと
を特徴とする。
That is, electrodes 3 and 4 are provided on opposing surfaces of a synthetic resin film substrate 1 and a glass substrate 2, and the electrodes 3 and 4 on the film substrate 1 are
In the touch panel, the electrodes 3 on the film substrate 1 and the conductive adhesive layer are electrically connected to the relay electric scraper 8 for external drawer provided on the glass substrate 2 via the conductive adhesive layer 9. A conductive synthetic resin thin film layer 11 that is softer than the conductive adhesive N9 is interposed between the conductive adhesive N9 and the conductive adhesive N9.

〔作 用〕[For production]

上記のようにフィルム基板1側の電極3と導電性接着剤
層9との間に、その導電性接着剤層9よりも軟質の導電
性合成樹脂薄膜層11を介在させたことにより、フィル
ム基板1とガラス基板2との熱膨張差等でフィルム基板
側の電極3と中継電極8との間にずれが生じたとき、上
記の軟質の導電性合成樹脂薄膜層11の弾性により上記
のずれが吸収されてフィルム基板上の電極3にクラック
が生じたり、その電極3がフィルム基板1から剥がれる
のを未然に防止することが可能となる。
As described above, by interposing the conductive synthetic resin thin film layer 11, which is softer than the conductive adhesive layer 9, between the electrode 3 on the film substrate 1 side and the conductive adhesive layer 9, the film substrate When a misalignment occurs between the electrode 3 on the film substrate side and the relay electrode 8 due to a difference in thermal expansion between the film substrate 1 and the glass substrate 2, the elasticity of the soft conductive synthetic resin thin film layer 11 prevents the misalignment. It is possible to prevent cracks from occurring in the electrode 3 on the film substrate due to absorption, or from peeling off the electrode 3 from the film substrate 1.

〔実施例〕〔Example〕

以下、図に示す実施例に基づいて本発明を具体的に説明
する。
Hereinafter, the present invention will be specifically explained based on embodiments shown in the drawings.

第1図は本発明の一実施例を示すタッチパネルの縦断面
図、第2図はその要部の拡大縦断面図、第3図は第2図
■−■線平面図であり、前記第8図と同一の部材には同
一の符号を付して再度の説明を省略する。
FIG. 1 is a vertical cross-sectional view of a touch panel showing an embodiment of the present invention, FIG. 2 is an enlarged vertical cross-sectional view of the main parts thereof, and FIG. The same members as those in the figures are given the same reference numerals and repeated explanations will be omitted.

本例はフィルム基板lの電極3と導電性接着剤層9との
間の境界面の略全面に導電性合成樹脂薄膜層11を介在
させたものである。
In this example, a conductive synthetic resin thin film layer 11 is interposed on substantially the entire boundary surface between the electrode 3 and the conductive adhesive layer 9 of the film substrate l.

上記の導電性接着剤層9としては例えば所定の径の銅等
の金属状を混入した銀フィラー人工ポキソ接着剤が用い
られる。
As the conductive adhesive layer 9, for example, a silver filler artificial poxo adhesive mixed with a metal such as copper having a predetermined diameter is used.

また導電性合成樹脂薄膜層11としては、上記導電性接
着剤層9よりも軟質で弾力性があり、かつ導電性を有す
るものであれば、その材質等は適宜であり、例えばペー
スト状の銀フィラー人ウレタン系接着剤等を用い、フィ
ルム基板1の電極3の表面に塗布して例えば厚さ20〜
30μm程度の薄膜状に形成する。そして、その導電性
合成樹脂薄膜層11を形成した後に、その薄膜N11を
介してフィルム基+ff l上の電極3とガラス基板2
上の中継電極8とを導電性接着剤層9で導通接続するも
のである。
The conductive synthetic resin thin film layer 11 may be made of any suitable material as long as it is softer, more elastic, and more conductive than the conductive adhesive layer 9, such as paste-like silver. A filler is applied to the surface of the electrode 3 of the film substrate 1 using a urethane adhesive or the like to a thickness of, for example, 20 mm to 20 mm.
It is formed into a thin film of about 30 μm. After forming the conductive synthetic resin thin film layer 11, the electrode 3 on the film base +ffl and the glass substrate 2 are connected via the thin film N11.
The upper relay electrode 8 is electrically connected to the upper relay electrode 8 through a conductive adhesive layer 9.

第4図・第5図は本発明の他の実施例を示すもので、フ
ィルム基板側の電極3の上記導電性合成樹脂薄膜層11
との当接面の一部を切除して電極開口部3aを形成し、
その開口部3aを介して導電性合成樹脂薄膜層11の一
部11aが直接フィルム基板1に密着するようにしたも
のである。
4 and 5 show other embodiments of the present invention, in which the conductive synthetic resin thin film layer 11 of the electrode 3 on the film substrate side is shown.
forming an electrode opening 3a by cutting off a part of the contact surface with the electrode;
A portion 11a of the conductive synthetic resin thin film layer 11 is brought into direct contact with the film substrate 1 through the opening 3a.

特に図の場合は、上記の電極開口部3aを電極3の長手
方向にスリット状に形成した例を示す。
In particular, the figure shows an example in which the electrode opening 3a is formed in the shape of a slit in the longitudinal direction of the electrode 3.

上記のようにフィルム基板側電極3の一部に開口部3a
を形成して導電性合成樹脂薄膜層11の一部がフィルム
基板1に直接密着するようにすると、上記導電性合成樹
脂薄膜層11は、一般にITO等の電極3よりもフィル
ム基板1との密着性がよいので、電極3の剥離等をより
効果的に防止することができる。
As mentioned above, there is an opening 3a in a part of the film substrate side electrode 3.
, so that a part of the conductive synthetic resin thin film layer 11 is in direct contact with the film substrate 1, the conductive synthetic resin thin film layer 11 is generally in closer contact with the film substrate 1 than the electrode 3 made of ITO or the like. Because of its good properties, peeling of the electrode 3 can be more effectively prevented.

上記の電極開口部3aは、例えばフィルム基板全面に電
極を設けてから、エツチング等でパターンニングする際
に同時に形成することができる。
The electrode openings 3a can be formed at the same time, for example, when electrodes are provided on the entire surface of the film substrate and then patterned by etching or the like.

また上記のようにエツチング処理により形成した場合に
は、その開口部3aのフィルム基板表面は無処理のフィ
ルム基板表面に比べ活性化されてフィルム基板1に対す
る導電性合成樹脂薄膜層11の密着強度をさらに増大す
ることができる。
Furthermore, when the film substrate is formed by etching as described above, the surface of the film substrate at the opening 3a is activated compared to the untreated surface of the film substrate, thereby increasing the adhesion strength of the conductive synthetic resin thin film layer 11 to the film substrate 1. It can be further increased.

なお、必要に応じてガラス基板2側の中継電極8の導電
性接着剤層との当接面にも上記と同様のスリット状その
他任意の形状の開口部を形成して、導電性接着剤層の一
部がガラス基板2に直接密着するようにすることもでき
る。このようにすることにより、導電性接着剤層とガラ
ス基板が上記フィルム基板の場合と同様に、密着性が向
上するとともに信転性向上を図ることができる。
Note that, if necessary, an opening in the same slit shape or any other shape as described above may be formed on the contact surface of the relay electrode 8 on the glass substrate 2 side with the conductive adhesive layer, so that the conductive adhesive layer It is also possible to make a part of the glass substrate 2 come into close contact with the glass substrate 2 directly. By doing so, as in the case where the conductive adhesive layer and the glass substrate are the film substrates described above, it is possible to improve adhesion and improve reliability.

また、必要に応じてガラス基板2例の中継電極8と導電
性接着剤層との間の境界面にも上記と同様の導電性合成
樹脂薄膜層を介在させてもよい。
Furthermore, if necessary, a conductive synthetic resin thin film layer similar to the above may be interposed on the interface between the relay electrode 8 and the conductive adhesive layer of the two glass substrates.

第6図・第7図は本発明の更に他の実施例を示す。本例
はフィルム基板側の電極3の端部を短めに形成してその
延長上のフィルム基板表面に導電性合成樹脂薄膜層11
を直接設けると共に、その導電性合成樹脂薄膜層11の
一部11bが電極3の端部3bを覆うようにしたもので
ある。他の構成は前記例の場合と同様である。
FIGS. 6 and 7 show still other embodiments of the present invention. In this example, the end of the electrode 3 on the film substrate side is formed short, and a conductive synthetic resin thin film layer 11 is formed on the surface of the film substrate as an extension.
is directly provided, and a portion 11b of the conductive synthetic resin thin film layer 11 covers the end portion 3b of the electrode 3. The other configurations are the same as in the previous example.

上記のように電極3を短めに形成してその端部3bを覆
いその延長上のフィルム基板表面に直接導電性合成樹脂
薄膜層11を形成すると、その薄膜層11とフィルム基
板1とが良好に密着し、かつ電極3の剥離等をさらに効
果的に防止することができる。
When the electrode 3 is formed short as described above and the conductive synthetic resin thin film layer 11 is directly formed on the surface of the film substrate on the extension thereof to cover the end portion 3b of the electrode 3, the thin film layer 11 and the film substrate 1 are bonded well. It is possible to maintain close contact and further effectively prevent peeling of the electrode 3.

特に上記薄膜層11が密着するフィルム基板1上の電極
をエツチング処理により除去した場合には樹脂層とフィ
ルム基板との密着が強固であり、またフィルム基板1上
の電極3と接着剤9とが第7図に示すように平面におい
て重ならないようにすると、基板の膨張収縮等で電極3
に無理な応力が作用するのを極力低減することができ、
電極3にクラックが生じたり剥離するのをさらに少なく
できる。
In particular, when the electrodes on the film substrate 1 to which the thin film layer 11 is in close contact are removed by etching, the adhesion between the resin layer and the film substrate is strong, and the electrodes 3 on the film substrate 1 and the adhesive 9 are As shown in Figure 7, if the electrodes do not overlap on the plane, the expansion and contraction of the substrate will cause the electrodes to overlap.
It is possible to reduce as much as possible the unreasonable stress that is applied to the
Cracking and peeling of the electrode 3 can be further reduced.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明はフィルム基板1例の電極3
と導電性接着剤層との間にペースト状の導電性合成樹脂
薄膜層11を設けたことにより、例えばフィルム基板と
ガラス基板との熱膨脹差等でフィルム基板側の電極3と
中継用電極8との間にずれが生した場合に、上記ペース
ト状の導電性合成樹脂薄膜層11の弾性により上記のず
れが吸収されてフィルム基板上の電極3にクラックが生
じたり、その電極3がフィルム基板1から剥がれるのを
未然に防止することができるもので、耐久性のよいタッ
チパネルを提供できる等の効果がある。
As explained above, the present invention provides an electrode 3 of one example of a film substrate.
By providing the paste-like conductive synthetic resin thin film layer 11 between the conductive adhesive layer and the conductive adhesive layer, the electrode 3 on the film substrate side and the relay electrode 8 can be connected to each other due to, for example, the difference in thermal expansion between the film substrate and the glass substrate. If a misalignment occurs between them, the elasticity of the paste-like conductive synthetic resin thin film layer 11 will absorb the misalignment, causing cracks in the electrode 3 on the film substrate, or the electrode 3 may become stuck to the film substrate 1. It is possible to prevent the touch panel from peeling off from the surface, and has the effect of providing a highly durable touch panel.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示すタッチパネルの縦断面
図、第2図はその要部の拡大縦断面図、第3図は第2図
■−■線平面図、第4図は本発明の他の実施例を示すタ
ッチパネルの要部の縦断面図、第5図は第4図v−v線
平面図、第6図は本発明の更に他の実施例を示すタッチ
パネルの要部の縦断面図、第7図は第6図■−■線平面
図、第8図は従来のタッチパネルの縦断面図である。 lはフィルム基板、2はガラス基板、3・4は電極、5
はスペーサ、6はシール部材、7は可撓性接続部材、8
は中継電極、9・10は導電性接着剤層、11は導電性
合成樹脂薄膜層。
Fig. 1 is a longitudinal cross-sectional view of a touch panel showing an embodiment of the present invention, Fig. 2 is an enlarged longitudinal cross-sectional view of its main parts, Fig. 3 is a plan view taken along the line ■-■ in Fig. 2, and Fig. 4 is a main FIG. 5 is a vertical sectional view of the main part of a touch panel showing another embodiment of the invention, FIG. 5 is a plan view taken along the line v-v in FIG. FIG. 7 is a plan view taken along the line ■--■ in FIG. 6, and FIG. 8 is a vertical cross-sectional view of a conventional touch panel. l is a film substrate, 2 is a glass substrate, 3 and 4 are electrodes, 5
is a spacer, 6 is a sealing member, 7 is a flexible connecting member, 8
1 is a relay electrode, 9 and 10 are conductive adhesive layers, and 11 is a conductive synthetic resin thin film layer.

Claims (1)

【特許請求の範囲】[Claims] (1)合成樹脂製のフィルム基板とガラス基板との対向
面に電極を設け、フィルム基板上の電極を、ガラス基板
上に設けた外部引出し用中継電極に、導電性接着剤層を
介し導電接続するようにしたタッチパネルにおいて、 上記フィルム基板上の電極と上記導電性接着剤層との間
に、その導電性接着剤層よりも軟質の導電性合成樹脂薄
膜層を介在させたことを特徴とするタッチパネル。
(1) Electrodes are provided on opposing surfaces of a synthetic resin film substrate and a glass substrate, and the electrodes on the film substrate are electrically connected to the external lead-out relay electrode provided on the glass substrate via a conductive adhesive layer. The touch panel is characterized in that a conductive synthetic resin thin film layer that is softer than the conductive adhesive layer is interposed between the electrode on the film substrate and the conductive adhesive layer. touch panel.
JP29698289A 1989-05-31 1989-11-15 Touch panel Expired - Lifetime JP2797552B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP29698289A JP2797552B2 (en) 1989-11-15 1989-11-15 Touch panel
EP19900305803 EP0400953A3 (en) 1989-05-31 1990-05-29 Input device
KR1019900007749A KR900018804A (en) 1989-05-31 1990-05-29 Input device
US07/530,867 US5179460A (en) 1989-05-31 1990-05-31 Input device having double-layer adhesive conductive connecting portions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29698289A JP2797552B2 (en) 1989-11-15 1989-11-15 Touch panel

Publications (2)

Publication Number Publication Date
JPH03156818A true JPH03156818A (en) 1991-07-04
JP2797552B2 JP2797552B2 (en) 1998-09-17

Family

ID=17840722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29698289A Expired - Lifetime JP2797552B2 (en) 1989-05-31 1989-11-15 Touch panel

Country Status (1)

Country Link
JP (1) JP2797552B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267965A (en) * 1992-03-18 1993-10-15 Nec Ic Microcomput Syst Ltd Time constant circuit
KR100424427B1 (en) * 2000-05-17 2004-03-24 가부시키가이샤 히타치세이사쿠쇼 Screen input type display device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101525432B1 (en) * 2013-04-26 2015-06-09 오영호 Hybrid touch panel and mobile device using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267965A (en) * 1992-03-18 1993-10-15 Nec Ic Microcomput Syst Ltd Time constant circuit
KR100424427B1 (en) * 2000-05-17 2004-03-24 가부시키가이샤 히타치세이사쿠쇼 Screen input type display device
US6721019B2 (en) 2000-05-17 2004-04-13 Hitachi, Ltd. Screen input type display device

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