JP2000298264A - Production of glass substrate for liquid crystal display device and the liquid crystal display device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase strength of a glass substrate by bonding a solder glass on the both ends of one or both surfaces of one or both of a plurality of glass substrates which constitute a base glass. SOLUTION: This liquid crystal display device is produced by sealing a liquid crystal 4 in the gap between a pair of glass substrates, consisting of upper and lower glass substrates 1, 2, and forming an electrode on each surface of the glass substrate pair facing each other. In the production of the upper and lower glass substrates 1, 2 to be used, solder glasses 12, 13 are bonded to both ends of one or both surfaces of one or both of upper and lower glass substrates 1, 2 in a plurality in number which constitute the base glass 14. For example, when only one face is to be bonded, a connecting film 10 is applied along the one side face of the solder glass 12. Then the space between the connecting film 10 and the side face of the solder glass 12 is filled with an anisotropic electrically conductive resin 11, and the connecting film 10 is electrically connected to an external connecting electrode 8 through thermo- compression bonding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device in which liquid crystal is sealed in a gap between a pair of glass substrates, and electrodes are formed on opposing surfaces of the pair of glass substrates, and a method of manufacturing the same. Yes, in particular, the strength of the glass substrate is increased by bonding a solder glass to one or both ends of one or both of the glass substrates constituting the base glass. The present invention also relates to a method for manufacturing a glass substrate for a liquid crystal display characterized by the following, and a liquid crystal display device in which solder glass is bonded to one or both ends of one or both of the pair of glass substrates.

[0002]

2. Description of the Related Art Conventionally, after an ITO (transparent electrode film) is formed on one side of a glass substrate used for a liquid crystal display device, a substrate cleaning process, an alignment film forming process, a spacer coating process, and heat of the upper and lower substrates by a sealing material are used. Through various processes such as a pressure bonding process, it is incorporated as a liquid crystal display device. In these manufacturing steps, the glass substrate is subjected to various forces during its transfer or adsorption or thermocompression, and in some cases, a biased or non-uniform force is applied to the glass substrate,
The glass substrate cannot be tolerated and is damaged. Such cases will inevitably increase as the glass substrate becomes thinner, and the product yield will not be improved.

[0003]

SUMMARY OF THE INVENTION The present invention provides a liquid crystal display device in which solder glass is bonded to one or both ends of one or both of a pair of glass substrates so that the glass substrate is conveyed or sucked or thermocompressed. A method of manufacturing a glass substrate for a liquid crystal display device and a glass substrate capable of withstanding a biased or non-uniform force sometimes applied to the glass substrate and capable of minimizing breakage of the glass substrate. The purpose of the present invention is to provide a liquid crystal display device.

[0004]

According to a method of manufacturing a glass substrate of a liquid crystal display device, a liquid crystal is sealed in a gap between a pair of glass substrates, and electrodes are formed on opposing surfaces of the pair of glass substrates. The strength of the glass substrate is enhanced by bonding solder glass to one or both ends of one or both of the plurality of glass substrates constituting the base glass. A flexible connection film is laid along one side of the solder glass, a gap between the connection film and one side of the solder glass is filled with an anisotropic conductive resin, and the connection film and the electrode are thermocompression-bonded. And made conductive. The solder glass contains conductive particles, and a flexible connection film and the electrode are thermocompressed to conduct.

[0005]

According to the present invention, a solder glass is bonded to one or both ends of one or both of a pair of glass substrates of a liquid crystal display device, so that a biased force or an unbalanced force is generated when the glass substrate is transported or sucked or thermocompressed. Even when a uniform force is applied to the glass substrate, the glass substrate can endure it to some extent, and it is possible to reduce breakage of the glass substrate during the manufacturing process as much as possible. The formation can enhance the strength of the liquid crystal cell structure.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a method for manufacturing a glass substrate of a liquid crystal display device, a liquid crystal is sealed in a gap between a pair of glass substrates, and electrodes are formed on opposing surfaces of the pair of glass substrates, respectively. A method of manufacturing a glass substrate for a liquid crystal display device, wherein the strength of the glass substrate is increased by bonding solder glass to one or both ends of one or both surfaces of the plurality of glass substrates constituting the glass. And bonding a solder glass to one or both ends of one side of the pair of glass substrates, laying a flexible connection film along one side of the solder glass, and forming the connection film and the solder glass. The gap on one side is filled with an anisotropic conductive resin, the connection film and the electrode are thermocompressed to make them conductive, and the solder glass contains conductive particles. A flexible connecting film and the electrode are those described with concrete and embodied on the basis of the following examples the structure of the liquid crystal display device was allowed conduction by thermal compression bonding.

[0007]

1 and 2 schematically show a liquid crystal cell of a liquid crystal display device according to an embodiment of the present invention.
1 is a cross-sectional view as viewed from the side, and FIG. 2 is a plan view as viewed from above. First, the liquid crystal cell structure will be described with reference to these drawings. A spacer 3 and a liquid crystal 4 are sealed in a gap between the upper glass substrate 1 and the lower glass substrate 2 by a sealing material 5. The extraction electrode portion 7 and the external connection electrode 8 of the common electrode group 6 are electrically connected by an LSI chip 9. Similarly, the extraction electrode section, the external connection electrode, and the LSI chip are also electrically connected to the segment electrode group.

Reference numerals 12 and 13 denote solder glass. The connection film 10 is laid along one side surface of the solder glass 12, and the anisotropic conductive film is provided in a gap between the connection film 10 and one side surface of the solder glass 12. A resin 11 is filled, and the connection film 10 and the external connection electrode 8 are electrically connected by thermocompression bonding. Conventionally, solder glass has been used for sealing an IC package or for covering a Si chip and a molybdenum electrode for the purpose of protecting a P-n junction of a silicon semiconductor. The temperature conditions when using the solder glass,
Sealing and coating can be performed at a temperature lower than the temperature that silicon chips and metals can withstand, that is, at a temperature of 460 ° C. or less. The types of solder _{glass, Z-B} 2 O 3 -SiO
₂ system, PbO-Al ₂ O ₃ -SiO ₂ system, PbO-Al
₂ O ₃ -SiO _{2 system,} there is a glass of _PbO-B 2 O 3 -SiO ₂ system.

[0009] It is also possible to use the solder glass instead of anisotropic conductive resin by containing conductive particles in the solder glass and thermally connecting the flexible connection film and the electrode to each other to make them conductive. Although the embodiment of the present invention has a structure in which the solder glass is bonded to only one surface of the glass substrate, a structure in which the strength of the glass substrate is further enhanced by bonding to both surfaces of the glass substrate may be employed.

A method for manufacturing a glass substrate for a liquid crystal display device according to an embodiment of the present invention will be described with reference to FIGS. FIG. 3 shows a state in which the solder glass 15 is formed on one side of the base glass 14 by bonding. A heater plate 16 heats the base glass 14 in order to enhance the bonding effect of the solder glass 15. The heating temperature is preferably about 400 ° C. The reason is that the surface of the base material glass 14 is
(Transparent electrode film) is formed, it is necessary to heat in a temperature range that does not affect the ITO, and the sealing material is thermocompressed at about 200 ° C. to 300 ° C. at the time of assembling the liquid crystal cell. This is because the solder glass must not melt below the temperature.

Reference numeral 17 denotes a bonding apparatus for flowing out the solder glass from the nozzle 18 and bonding the solder glass 15 onto the base glass 14.

[0012]

According to the present invention, the solder glass is bonded to one or both ends of one or both of the plurality of glass substrates constituting the base glass, so that the glass substrate can be conveyed or sucked or thermocompressed. Even if a biased or non-uniform force is applied to the glass substrate, the glass substrate can have a structure capable of withstanding the force, and breakage of the glass substrate during the manufacturing process can be reduced as much as possible. Further, by forming the solder glass on the surface of the glass substrate, the strength of the liquid crystal cell structure can be increased.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a liquid crystal cell of a liquid crystal display device according to an embodiment of the present invention as viewed from a side.

FIG. 2 is a plan view of a liquid crystal cell of the liquid crystal display device according to the embodiment of the present invention as viewed from above.

FIG. 3 is a plan view of a base glass showing the production of a glass substrate for a liquid crystal display device according to an embodiment of the present invention.

FIG. 4 is a schematic view showing the production of a glass substrate for a liquid crystal display device according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Upper glass substrate 2 ... Upper glass substrate 3 ... Spacer 4 ... Liquid crystal 5 ... Sealing material 6 ... Common electrode group 7 ... Leader electrode part 8 ... External connection electrode 9 ... LSI chip 10 ... Connection film 11 ... Anisotropic conductive resin 12, 13: Solder glass 14: Base glass 15: Solder glass 16: Heater plate 17: Bonding device 18: Nozzle

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H088 EA02 FA17 HA01 HA02 HA06 MA20 2H090 JA02 JA11 JB02 JC03 JD13 LA01 LA04 2H092 GA41 GA50 GA60 HA19 MA34 NA17 PA01 5C094 AA36 AA42 AA43 AA46 AA48 BA43 CA19 DA09 DB12 DB10 FA01 FB02 FB12 GB01 GB10 5G435 AA07 AA14 AA17 BB12 CC09 EE12 EE41 HH12 KK05

Claims (4)

[Claims] 1. A method of manufacturing a glass substrate of a liquid crystal display device comprising: a liquid crystal sealed in a gap between a pair of glass substrates; and electrodes formed on opposing surfaces of the pair of glass substrates. For a liquid crystal display device, the strength of the glass substrate is increased by bonding solder glass to one or both ends of one or both surfaces of the glass substrate to constitute the plurality of glass substrates. A method for manufacturing a glass substrate. 2. A liquid crystal display device comprising a pair of glass substrates filled with liquid crystal and electrodes formed on opposing surfaces of the pair of glass substrates, respectively, in order to enhance the strength of the glass substrates. A liquid crystal display device wherein solder glass is bonded to one or both ends of one or both sides of the glass substrate. 3. A flexible connection film is laid along one side surface of the solder glass, and a gap between the connection film and one side surface of the solder glass is filled with an anisotropic conductive resin. 3. The liquid crystal display device according to claim 2, wherein said electrodes are electrically connected by thermocompression bonding. 4. The liquid crystal display device according to claim 2, wherein said solder glass contains conductive particles, and said flexible connection film and said electrode are electrically connected by thermocompression bonding.