JPH03296230A - Work heating device - Google Patents
Work heating deviceInfo
- Publication number
- JPH03296230A JPH03296230A JP9829190A JP9829190A JPH03296230A JP H03296230 A JPH03296230 A JP H03296230A JP 9829190 A JP9829190 A JP 9829190A JP 9829190 A JP9829190 A JP 9829190A JP H03296230 A JPH03296230 A JP H03296230A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- ceramic material
- block
- work
- heat block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 9
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 14
- 230000005855 radiation Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 10
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、半導体組立装置の製造に用いるグイボンダー
、キュア装置、ワイヤボンダー等におけるワーク加熱装
置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a workpiece heating device in a wire bonder, a curing device, a wire bonder, etc. used in the manufacture of semiconductor assembly equipment.
［従来の技術１
半導体組立装置の製造は、板状部材よりなるリドフレー
ムへの熱硬化接合剤の滴下工程、リードフレームに前記
熱硬化接合剤を介してデバイスを付けるグイポンディン
グ工程、熱硬化接合剤を乾燥させてデバイスをリードフ
レームに固着させるキュア工程、リードフレームのリー
ドポストとデバイスのパッドとをワイヤで接続するワイ
ヤポンディング工程を経て行われる。[Prior art 1] Manufacturing of semiconductor assembly equipment includes a process of dropping a thermosetting adhesive onto a lead frame made of a plate-shaped member, a bonding process of attaching a device to the lead frame via the thermosetting adhesive, and a thermosetting process. This is accomplished through a curing process in which the bonding agent is dried and the device is fixed to the lead frame, and a wire bonding process in which the lead posts of the lead frame and the pads of the device are connected with wires.
そして、これらの工程の内、グイポンディング工程、キ
ュア工程、ワイヤポンディング工程、即ちこれ、らの工
程で用いるグイボンダー、キュア装置、ワイヤボンダー
においては、リードフレーム等のワークを加熱するため
にワーク加熱装置が用いられる。ワーク加熱装置はヒー
トブロックを有し、このヒートブロックの上面は平担加
工されてワークとの接触度を良くしている。Among these processes, the gui bonding process, curing process, and wire bonding process, that is, the gui bonder, curing device, and wire bonder used in these processes, are used to heat workpieces such as lead frames. A heating device is used. The workpiece heating device has a heat block, and the upper surface of the heat block is flattened to improve the degree of contact with the workpiece.
なお、この種の装置として、例えば特開昭６２２３３６
７１号公報、特開昭６３−３１６４４４号公報、特開平
２−１６７４３号公報、実韓開平２−８０３３号公報が
あげられる。Note that as this type of device, for example, Japanese Patent Application Laid-Open No. 622336
71, Japanese Patent Application Laid-Open No. 63-316444, Japanese Patent Application Publication No. 16743/1993, and Japanese Patent Application Publication No. 2-8033.
［発明が解決しようとする課題］
ヒートブロックは、前記したように平担加工Ｓれている
が、実際には平担度は必ずしも一定ではなく、またワー
クにはそり等があり、ワークとヒトブロックとの接触面
にはエアギャップが生じる。[Problem to be solved by the invention] As mentioned above, the heat block is flat-processed, but in reality, the degree of flatness is not necessarily constant, and the workpiece has warpage, etc., and the workpiece and human An air gap is created at the contact surface with the block.
従来技術は、前記したエアギヤー、プにより熱供胎動率
が悪いという問題点があった。またワークとヒートブロ
ックとの接触点が熱流入口となって温度勾配が生じる。The prior art had a problem in that the heat delivery rate was poor due to the air gear described above. In addition, the contact point between the workpiece and the heat block serves as a heat inlet, creating a temperature gradient.
この温度勾配によってリードフレームが加熱されると、
製品により加熱条件の違いとなって品質のばらつきの原
因となるという問題点もあった。When the lead frame is heated by this temperature gradient,
There was also the problem that heating conditions differed depending on the product, causing variations in quality.
本発明の目的は、熱供給効率の向上及び均一な加熱が可
能なワーク加熱装置を提供することにある。An object of the present invention is to provide a workpiece heating device that can improve heat supply efficiency and uniformly heat the workpiece.
［課題を解決するための手段］
上記目的は、ワークを加熱するヒートブロック上に遠赤
外線放射性のセラミックス材を設けることにより達成さ
れる。[Means for Solving the Problems] The above object is achieved by providing a far-infrared emitting ceramic material on a heat block that heats a workpiece.
［作用］
ヒートブロックの熱は、遠赤外線放射性のセラミックス
材によって助けられてワークに効果的に供給される。[Function] Heat from the heat block is effectively supplied to the workpiece with the help of far-infrared radiating ceramic material.
［実施例］
以下、本発明の一実施例を第１図により説明する。周知
構造よりなるヒートブロック１の上面には、遠赤外線放
射性のセラミックス材２が一体設けられている。セラミ
ックス材２は、ヒートブロック１上に塗布して形成して
も、またブロック加工したものを固定してもよい。[Example] Hereinafter, an example of the present invention will be described with reference to FIG. A far-infrared emitting ceramic material 2 is integrally provided on the upper surface of a heat block 1 having a well-known structure. The ceramic material 2 may be formed by coating it on the heat block 1, or may be formed by processing a block and fixing it.
従って、と−ドブロック１の熱は、遠赤外線放射性のセ
ラミックス材２によって助けられてリドフレーム等のワ
ーク３に供給されることになる。このため、セラミック
ス材２とワーク内にエアキャップがあっても、熱伝導、
輻射、対流による熱供給が効果的に行われると共に、ヒ
ートブロックｌとワーク３の両者の間の熱の流れは全体
で一様に平均化する。Therefore, the heat of the door block 1 is assisted by the far-infrared emitting ceramic material 2 and is supplied to the workpiece 3 such as the lid frame. Therefore, even if there is an air cap between the ceramic material 2 and the workpiece, heat conduction
Heat is effectively supplied by radiation and convection, and the flow of heat between both the heat block 1 and the workpiece 3 is uniformly averaged throughout.
［発明の効果］
以上の説明から明らかなように、本発明によれば、ヒー
トブロックの熱は、遠赤外線放射性のセラミックス材に
よって助けられてワークに効果的に供給される。[Effects of the Invention] As is clear from the above description, according to the present invention, heat from the heat block is effectively supplied to the workpiece with the aid of the far-infrared radiating ceramic material.
第１図は本発明の一実施例を示す要部説明図である。 ：ヒートブロック、 ２：セラミックス材、 ：ワーク。 FIG. 1 is an explanatory diagram of main parts showing an embodiment of the present invention. : heat block, 2: Ceramic material, :work.
Claims (1)
射性のセラミックス材を設けたことを特徴とするワーク
加熱装置。(1) A workpiece heating device characterized in that a far-infrared emitting ceramic material is provided on a heat block that heats the workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9829190A JP2668738B2 (en) | 1990-04-14 | 1990-04-14 | Work heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9829190A JP2668738B2 (en) | 1990-04-14 | 1990-04-14 | Work heating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03296230A true JPH03296230A (en) | 1991-12-26 |
| JP2668738B2 JP2668738B2 (en) | 1997-10-27 |
Family
ID=14215825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9829190A Expired - Fee Related JP2668738B2 (en) | 1990-04-14 | 1990-04-14 | Work heating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2668738B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112556887A (en) * | 2020-12-22 | 2021-03-26 | 北京强度环境研究所 | Gardon type heat flow meter capable of laterally feeding and discharging water |
-
1990
- 1990-04-14 JP JP9829190A patent/JP2668738B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112556887A (en) * | 2020-12-22 | 2021-03-26 | 北京强度环境研究所 | Gardon type heat flow meter capable of laterally feeding and discharging water |
| CN112556887B (en) * | 2020-12-22 | 2022-11-22 | 北京强度环境研究所 | Gardon formula heat flow meter of side direction business turn over water |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2668738B2 (en) | 1997-10-27 |
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Legal Events
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| LAPS | Cancellation because of no payment of annual fees |