JPH03294462A - Solid solution treatment of precipitation hardening copper alloy - Google Patents

Solid solution treatment of precipitation hardening copper alloy

Info

Publication number
JPH03294462A
JPH03294462A JP9629790A JP9629790A JPH03294462A JP H03294462 A JPH03294462 A JP H03294462A JP 9629790 A JP9629790 A JP 9629790A JP 9629790 A JP9629790 A JP 9629790A JP H03294462 A JPH03294462 A JP H03294462A
Authority
JP
Japan
Prior art keywords
copper alloy
solution treatment
precipitation hardening
solid solution
precipitation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9629790A
Other languages
Japanese (ja)
Inventor
Hidemichi Fujiwara
英道 藤原
Kosaku Nakano
中野 耕作
Yukihiro Saida
幸弘 斉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP9629790A priority Critical patent/JPH03294462A/en
Publication of JPH03294462A publication Critical patent/JPH03294462A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To easily perform aging hardening treatment and to sufficiently perform precipitation hardening for copper alloy by performing the specified solid solution treatment for precipitation hardening copper alloy contg. the specified amount of Be and once cooling the copper alloy and furthermore performing specified solid solution treatment and thereafter cooling it. CONSTITUTION:Be and Co are incorporated into Cu as a solid solution by heating precipitation hardening copper alloy described hereunder at 750-950 deg.C for at least 10 minutes. This copper alloy is constituted of Cu as a main component and contains 0.2-2.0wt.% Be as a precipitation hardening component and furthermore 0.05-4.0wt.% Co in accordance with necessity. After performing a first solid solution treatment, this copper alloy is cooled at the prescribed temp. Thereafter formation of a solid solution is performed by heat-treating this copper alloy at (600-750 deg.C) lower than the temp. in the first solid solution treatment for at least 5 minutes. The copper alloy after a second solid solution is cooled at >=5 deg.C/min cooling velocity. Thereby it is prevented by a simple equipment that a precipitation phase uncontributed to precipitation hardening is precipitated in a final cooling stage. The above-mentioned copper alloy is sufficiently strengthened.

Description

【発明の詳細な説明】 [産業上の利用分野コ 本発明は、Cu−Be系およびCu−Be−Co系の析
出硬化型銅合金の溶体化処理方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for solution treatment of Cu-Be-based and Cu-Be-Co-based precipitation hardening copper alloys.

[従来の技術] 析出硬化型銅合金の時効硬化を充分に行うには、溶体化
処理によって析出に寄与する成分の固溶・均質化を行っ
た後に時効硬化処理を行う必要がある。このような時効
硬化処理の結果、析出相を銅器相中に微細に分布させる
ことができる。
[Prior Art] In order to sufficiently age harden a precipitation hardening type copper alloy, it is necessary to perform the age hardening treatment after solid solution and homogenization of components contributing to precipitation by solution treatment. As a result of such age hardening treatment, the precipitated phase can be finely distributed in the copperware phase.

しかし、溶体化処理で析出硬化型銅合金の冷却が遅いと
、銅合金母相中に析出硬化にあまり寄与しない析出相が
析出する。これは、溶体化処理時に析出硬化型銅合金母
相中に導入された空孔が、その析出を促進するからであ
る。析出硬化にあまり寄与しない析出相が析出した析出
硬化型銅合金は、時効硬化処理を行っても充分に強化で
きない。
However, if cooling of the precipitation-hardening copper alloy during solution treatment is slow, a precipitate phase that does not significantly contribute to precipitation hardening will precipitate in the copper alloy matrix. This is because the pores introduced into the precipitation hardening copper alloy matrix during solution treatment promote the precipitation. Precipitation hardening copper alloys in which precipitated phases that do not significantly contribute to precipitation hardening cannot be sufficiently strengthened even if subjected to age hardening treatment.

そこで、従来の析出硬化型銅合金の溶体化処理方法は、
溶体化処理の際に析出硬化型銅合金を1000℃/分程
度の冷却速度で急冷していた。
Therefore, the conventional solution treatment method for precipitation hardening copper alloys is as follows:
During the solution treatment, the precipitation hardening copper alloy was rapidly cooled at a cooling rate of about 1000° C./min.

なお、母相の単相化する温度まで加熱した押出加工前の
ビレット溶体化処理、熱間圧延前のケーク溶体化処理等
も溶体化処理の範喘に包含される。
Note that billet solution treatment before extrusion in which the mother phase is heated to a temperature at which it becomes a single phase, cake solution treatment before hot rolling, etc. are also included in the scope of solution treatment.

[発明が解決しようとする課題] しかしながら、溶体化処理で析出硬化型銅合金を効率よ
く急冷するには、急冷処理の可能な溶体化処理設備が必
要である。このような溶体化処理設備は、大型であり、
設備価格も高い。しかも、従来の場合には、材料の熱容
量を小さくしなければならず、工業的な処理方法として
適さない問題があった。
[Problems to be Solved by the Invention] However, in order to efficiently quench precipitation hardening copper alloys by solution treatment, solution treatment equipment capable of quenching is required. Such solution treatment equipment is large and
Equipment prices are also high. Moreover, in the conventional case, the heat capacity of the material had to be reduced, which caused the problem that it was not suitable as an industrial treatment method.

本発明は、かかる事情を鑑みてなされたものであり、簡
易な設備で実施可能であり、しかも、最終の冷却工程中
に析出硬化に寄与しない析出相が析出するのを防止でき
る析出硬化型銅合金の溶体化処理方法を提供するもので
ある。
The present invention has been made in view of the above circumstances, and is a precipitation hardening type copper that can be implemented with simple equipment and that can prevent precipitated phases that do not contribute to precipitation hardening from precipitating during the final cooling process. The present invention provides a method for solution treatment of alloys.

[課題を解決するための手段] 本発明は、Cuを主成分とし、析出硬化成分として0.
2〜2.0重量%のBeを含有する析出硬化型銅合金を
750〜950℃の温度で10分以上加熱してCuにB
eを固溶させる第1溶体化処理工程と、該第1溶体化処
理後の銅合金を所定の温度まで冷却する第1冷却工程と
、該第1冷却工程後の銅合金に前記第1溶体化処理の際
の温度よりも低い温度で、かつ、600〜750℃の温
度で5分以上の加熱を施してCuにBeを固溶させる第
2溶体化処理工程と、該第2溶体化処理後の銅合金を5
℃/分以上の冷却速度で冷却する第2冷却工程とを具備
することを特徴とする析出硬化型銅合金の溶体化処理方
法である。
[Means for Solving the Problems] The present invention contains Cu as a main component and 0.00% as a precipitation hardening component.
A precipitation hardening copper alloy containing 2 to 2.0% by weight of Be is heated at a temperature of 750 to 950°C for 10 minutes or more to convert B into Cu.
a first solution treatment step in which e is dissolved in solid solution; a first cooling step in which the copper alloy after the first solution treatment is cooled to a predetermined temperature; a second solution treatment step in which Be is dissolved in Cu by heating for 5 minutes or more at a temperature lower than the temperature during chemical treatment and at a temperature of 600 to 750 ° C., and the second solution treatment Copper alloy after 5
This method is characterized by comprising a second cooling step of cooling at a cooling rate of .degree. C./min or more.

また、本発明は、Cuを主成分とし、析出硬化成分とし
て0,2〜2.0重量%のBeおよび0.05〜4.0
重量%のCoを含有する析出硬化型銅合金を750〜9
50℃の温度で10分以上加熱してCuにBeおよびC
oを固溶化させる第1溶体化処理工程と、該第1溶体化
処理後の銅合金を所定の温度まで冷却する第1冷却工程
と、該第1冷却工程後の銅合金に前記第1溶体化処理の
際の温度よりも低い温度で、かつ、600〜850℃の
温度で5分以上の加熱を施してCuにBeおよびCoを
固溶させる第2溶体化処理工程と、該第2溶体化処理後
の銅合金を5℃/分以上の冷却速度で冷却する第2冷却
工程とを具備することを特徴とする析出硬化型銅合金の
溶体化処理方法である。
In addition, the present invention has Cu as a main component, and 0.2 to 2.0% by weight of Be and 0.05 to 4.0% by weight as precipitation hardening components.
Precipitation hardening copper alloy containing 750-9% by weight Co
Be and C are added to Cu by heating at 50℃ for 10 minutes or more.
a first solution treatment step of converting o into a solid solution, a first cooling step of cooling the copper alloy after the first solution treatment to a predetermined temperature, and adding the first solution to the copper alloy after the first cooling step. A second solution treatment step in which Be and Co are dissolved in Cu by heating for 5 minutes or more at a temperature lower than the temperature during the chemical treatment and at a temperature of 600 to 850 ° C., and the second solution treatment step This method is characterized by comprising a second cooling step of cooling the copper alloy after the chemical treatment at a cooling rate of 5° C./min or more.

[作用] 本発明の析出硬化型銅合金の溶体化処理方法によれば、
まず、第1溶体化処理により、析出硬化に寄与する成分
が固溶化する。次に、これを所定温度まで冷却する。次
いて、冷却後の銅合金に第2溶体化処理を所定時間施す
。この第2溶体化処理の際に第1溶体化処理で析出硬化
型銅合金母相中に導入された空孔の濃度が減少する。こ
れにより、析出硬化型銅合金を急冷することなく、しか
も、最終の冷却工程で析出硬化に寄与しない析出相が析
出するのを抑えることができる。この結果、均質な過飽
和固溶体を得ることができ、時効処理の際に析出硬化に
寄与する成分を充分に析出させて、析出硬化型銅合金を
充分に強化できる。
[Function] According to the solution treatment method for precipitation hardening copper alloy of the present invention,
First, by the first solution treatment, components contributing to precipitation hardening are converted into a solid solution. Next, this is cooled to a predetermined temperature. Next, the copper alloy after cooling is subjected to a second solution treatment for a predetermined period of time. During this second solution treatment, the concentration of pores introduced into the precipitation hardening copper alloy matrix in the first solution treatment decreases. Thereby, it is possible to suppress precipitation of a precipitated phase that does not contribute to precipitation hardening in the final cooling step without rapidly cooling the precipitation hardening type copper alloy. As a result, a homogeneous supersaturated solid solution can be obtained, and components contributing to precipitation hardening can be sufficiently precipitated during aging treatment, thereby sufficiently strengthening the precipitation hardening type copper alloy.

[実施例コ 以下、本発明の析出硬化型銅合金の溶体化処理方法をそ
の工程順に説明する。
[Example 7] Hereinafter, the method for solution treatment of precipitation hardening copper alloys of the present invention will be explained in the order of its steps.

強化する析出硬化型銅合金は、Cu−Be系およびCu
−Be−Co系のものである。
Precipitation hardening copper alloys to be strengthened include Cu-Be system and Cu
-Be-Co based.

Cu−Be系の析出硬化型銅合金は、Cuを主成分とし
、0.2〜2.0重量%のBe、不可避不純物、および
必要に応じて固溶強化成分を含有するものである。Be
の含有量が0.2重量%未満であると、充分に強化され
た析出硬化型銅合金が得られない。また、Beの含有量
が2.0重量%を超えると、析出硬化型銅合金が溶体化
処理の際に過剰のBeを固溶化し、析出硬化型銅合金結
晶に歪みを発生させる。この歪みによって、析出硬化型
銅合金結晶に格子欠陥ができる。その結果、優れた特性
を有する析出硬化型銅合金を得ることができない。
A Cu-Be-based precipitation hardening copper alloy has Cu as a main component, and contains 0.2 to 2.0% by weight of Be, unavoidable impurities, and, if necessary, a solid solution strengthening component. Be
If the content is less than 0.2% by weight, a sufficiently strengthened precipitation hardening copper alloy cannot be obtained. Furthermore, when the Be content exceeds 2.0% by weight, the precipitation hardening copper alloy converts excess Be into a solid solution during solution treatment, causing distortion in the precipitation hardening copper alloy crystals. This distortion creates lattice defects in the precipitation-hardened copper alloy crystal. As a result, a precipitation hardening copper alloy with excellent properties cannot be obtained.

また、Cu−Be−Co系の析出硬化型銅合金は、Cu
を主成分とし、0.2〜260重量%のBe、0.05
〜4.0重量%のCo、不可避不純物、および必要に応
じて固溶強化成分を含有するものである。Coの含有量
の限定理由は、Beの場合と同様である。
In addition, Cu-Be-Co precipitation hardening copper alloy is Cu-Be-Co based.
as the main component, 0.2 to 260% by weight of Be, 0.05
It contains ~4.0% by weight of Co, unavoidable impurities, and, if necessary, a solid solution strengthening component. The reason for limiting the Co content is the same as in the case of Be.

固溶強化成分は、時効硬化処理後も合金中に固溶して強
度向上に寄与する。このようなものとして、PSAII
% 5nSZn、Mn5S iが挙げられる。また、固
溶強化成分の含有量は、SnおよびMnについては3重
量%以下、その他のものについては0,5重量%以下で
あることが好ましい。
The solid solution strengthening component remains solid solution in the alloy even after the age hardening treatment and contributes to improving the strength. As such, PSA II
% 5nSZn, Mn5Si. Further, the content of the solid solution strengthening components is preferably 3% by weight or less for Sn and Mn, and 0.5% by weight or less for other components.

このような析出硬化型合金を次のように溶体化処理する
Such a precipitation hardening alloy is subjected to solution treatment as follows.

まず、析出硬化型銅合金に次のような加熱温度で10分
以上の第1溶体化処理を施す。第1溶体化処理の際の加
熱温度は、750〜950℃に設定する。第1溶体化処
理は、析出硬化型銅合金中の析出硬化に寄与する成分を
固溶させるためのものである。したがって、第1溶体化
処理の際の加熱温度は、析出硬化型銅合金の銅器相が単
相化する温度よりも高く、銅器相単相域で素材の酸化や
溶融等の劣化が起こらない範囲で、可能なかぎり高く設
定するのが好ましい。しかし、銅器相が、単相化する温
度付近では、銅器相が均質化するまでに非常に長い時間
を要し、非能率的である。そこで、第1溶体化処理の際
の加熱温度は、銅器相が単相化する温度よりも少なくと
も50℃以上高く設定する方がよい。
First, a precipitation hardening copper alloy is subjected to a first solution treatment for 10 minutes or more at the following heating temperature. The heating temperature during the first solution treatment is set at 750 to 950°C. The first solution treatment is for dissolving components that contribute to precipitation hardening in the precipitation hardening copper alloy. Therefore, the heating temperature during the first solution treatment is higher than the temperature at which the copperware phase of the precipitation-hardened copper alloy becomes a single phase, and within a range where deterioration such as oxidation or melting of the material does not occur in the copperware single phase region. Therefore, it is preferable to set it as high as possible. However, near the temperature at which the copperware phase becomes a single phase, it takes a very long time for the copperware phase to become homogenized, which is inefficient. Therefore, the heating temperature during the first solution treatment is preferably set at least 50°C higher than the temperature at which the copperware phase becomes a single phase.

また、第1溶体化処理の時間は、析出硬化型銅合金中に
析出硬化に寄与する成分が均質に固溶するに充分な時間
に設定する。この第1溶体化処理時間は、具体的には1
0分以上に設定するのが望ましい。
Moreover, the time of the first solution treatment is set to a time sufficient to uniformly dissolve the components contributing to precipitation hardening into the precipitation hardening copper alloy. Specifically, this first solution treatment time is 1
It is desirable to set it to 0 minutes or more.

次に、第1溶体化処理後の析出硬化型銅合金を第2溶体
化処理を行う際の温度まで冷却する。次いで、析出硬化
型銅合金に第2溶体化処理を所定時間施す。なお、第1
溶体化処理後の析出硬化型銅合金を第2溶体化処理の温
度まで冷却するときの冷却速度は、工業的に問題がなけ
れば、どのような冷却速度に保持してもさしつかえない
Next, the precipitation hardening copper alloy after the first solution treatment is cooled to a temperature at which the second solution treatment is performed. Next, the precipitation hardening copper alloy is subjected to a second solution treatment for a predetermined period of time. In addition, the first
The cooling rate when cooling the precipitation-hardened copper alloy after solution treatment to the temperature of the second solution treatment may be maintained at any cooling rate as long as there is no industrial problem.

また、第2溶体化処理の際の加熱温度は、Cu−Be系
の場合は、600〜750℃に設定し、Cu−Be−C
o系の場合は、600〜850℃に設定する。
In addition, the heating temperature during the second solution treatment is set at 600 to 750°C in the case of Cu-Be-based, and Cu-Be-C
In the case of o type, the temperature is set at 600 to 850°C.

第2溶体化処理は、第1溶体化処理によって析出硬化型
銅合金母相中に導入された空孔を減少させるためのもの
である。銅合金母相中の空孔濃度が高いと、冷却工程の
際に析出する成分元素の拡散が活発にな°る。また、空
孔自体が核生成サイトを形成して析出硬化に寄与しない
析出相を増加させる。そこで、第2溶体化処理によって
空孔密度を減少させて、平衡空孔濃度にするものである
The second solution treatment is for reducing the pores introduced into the precipitation hardening copper alloy matrix by the first solution treatment. When the vacancy concentration in the copper alloy matrix is high, the component elements that precipitate during the cooling process actively diffuse. In addition, the pores themselves form nucleation sites and increase the amount of precipitated phases that do not contribute to precipitation hardening. Therefore, the pore density is reduced by the second solution treatment to reach an equilibrium pore concentration.

平衡空孔濃度とは、時効硬化処理に支障を与えない程度
の空孔濃度をいう。第2溶体化処理の際の温度を銅合金
母相が単相化する温度付近の温度に保持することによっ
て、銅合金母相内で平衡空孔濃度を達成することかでき
る。
The equilibrium pore concentration refers to a pore concentration that does not interfere with age hardening treatment. By maintaining the temperature during the second solution treatment at a temperature near the temperature at which the copper alloy matrix becomes a single phase, it is possible to achieve an equilibrium vacancy concentration within the copper alloy matrix.

また、第2溶体化処理の際の時間は、銅合金母相内に平
衡空孔濃度が得られるように設定する。
Further, the time for the second solution treatment is set so as to obtain an equilibrium vacancy concentration within the copper alloy matrix.

この第2溶体化処理の時間は、具体的には5分以上に設
定するのか好ましい。
Specifically, the time for this second solution treatment is preferably set to 5 minutes or more.

第2溶体化処理後の析出硬化型銅合金の冷却速度は、5
℃/分以上に設定する。これは、冷却速度が5℃/分未
満であると、第2冷却工程で析出硬化に寄与しない析出
相の析出を充分に抑えられないからである。
The cooling rate of the precipitation hardening copper alloy after the second solution treatment is 5
Set to ℃/min or higher. This is because if the cooling rate is less than 5° C./min, precipitation of precipitated phases that do not contribute to precipitation hardening cannot be sufficiently suppressed in the second cooling step.

このようにCu−Be系およびCu−Be−Co系の析
出硬化型銅合金に第1溶体化処理を施し、析出硬化に寄
与する成分を銅器相中に固溶させる。次いで、析出硬化
型銅合金を第1冷却工程を経て第2溶体化処理の際の温
度まで冷却する。
In this way, the Cu-Be-based and Cu-Be-Co-based precipitation hardening copper alloys are subjected to the first solution treatment, and the components contributing to precipitation hardening are dissolved in the copperware phase. Next, the precipitation hardening copper alloy is cooled to a temperature for second solution treatment through a first cooling step.

次いで、これに第2溶体化処理を施して、第1溶体化処
理で析出硬化型銅合金母相中に導入された空孔の濃度を
減少させる。その後、第2冷却工程によって、析出硬化
型銅合金内に、均質な過飽和固溶体を形成させる。これ
により、その後の時効硬化処理において析出硬化に寄与
する成分が微細に分布する。この結果、析出硬化型銅合
金を充分に強化することができる。
Next, this is subjected to a second solution treatment to reduce the concentration of pores introduced into the precipitation hardening copper alloy matrix in the first solution treatment. Thereafter, a second cooling step forms a homogeneous supersaturated solid solution within the precipitation hardening copper alloy. As a result, components contributing to precipitation hardening in the subsequent age hardening treatment are finely distributed. As a result, the precipitation hardening copper alloy can be sufficiently strengthened.

以下、本発明の効果を確認にするために行った実験例に
ついて説明する。
Examples of experiments conducted to confirm the effects of the present invention will be described below.

実験例1〜3 まず、析出硬化成分として0.5重量%のBeを含有す
る析出硬化型銅合金を、電気炉内で1150℃に加熱し
、溶解した。この溶解した析出硬化型銅合金を鋳造して
長さ200M、幅80+m、厚さ20關の寸法の板状体
とした。この板状体を750℃で厚さ5 mmに熱間圧
延した。さらに、これを厚さ1 mumに冷間圧延して
薄板状体を作製した。
Experimental Examples 1 to 3 First, a precipitation hardening copper alloy containing 0.5% by weight of Be as a precipitation hardening component was heated to 1150° C. in an electric furnace and melted. This molten precipitation-hardening copper alloy was cast into a plate-like body with dimensions of 200 m long, 80+ m wide, and 20 m thick. This plate-shaped body was hot rolled at 750°C to a thickness of 5 mm. Furthermore, this was cold-rolled to a thickness of 1 mm to produce a thin plate-like body.

次に、得られた薄板状体に850℃で30分間加熱して
第1溶体化処理を施した。第1溶体化処理後、薄板状体
を600℃まで10℃/分の冷却速度で冷却した。次に
、これを600℃の温度で30分間保持して、薄板状体
に第2溶体化処理を施した。その後、第2溶体化処理後
の薄板状体を室温まで250℃/分の冷却速度で冷却し
た。
Next, the obtained thin plate-shaped body was heated at 850° C. for 30 minutes to undergo a first solution treatment. After the first solution treatment, the thin plate was cooled to 600°C at a cooling rate of 10°C/min. Next, this was held at a temperature of 600°C for 30 minutes to perform a second solution treatment on the thin plate-like body. Thereafter, the thin plate-like body after the second solution treatment was cooled to room temperature at a cooling rate of 250° C./min.

このようにして、本発明を適用して溶体化処理を行った
析出硬化型銅合金薄板状体(実験例1)を得た。また、
室温まで冷却する冷却速度を100℃/分、40℃/分
にした点以外は、上記と同様にして析出硬化型銅合金薄
板状体(実験例2.3)を得た。
In this way, a precipitation-hardened copper alloy thin plate (Experimental Example 1) which was subjected to solution treatment according to the present invention was obtained. Also,
A precipitation-hardened copper alloy thin plate (Experimental Example 2.3) was obtained in the same manner as described above, except that the cooling rate for cooling to room temperature was 100° C./min and 40° C./min.

このようにして得た3つの析出硬化型銅合金薄板状体に
350℃で30分間の時効硬化処理を施した後、氷水中
に投入して焼入れした。その後、それぞれの析出硬化型
銅合金薄板状体の引張り強度を調べた。その結果を溶体
化処理条件と共に下記第1表に示す。
The three precipitation-hardened copper alloy thin plates thus obtained were subjected to an age hardening treatment at 350° C. for 30 minutes, and then placed in ice water for quenching. Thereafter, the tensile strength of each precipitation-hardened copper alloy thin plate was examined. The results are shown in Table 1 below along with the solution treatment conditions.

なお、引張強度は、前記薄板状体を所定の寸法に切断し
て引張り試験片を作製し、この試験片をアムスラー型引
張り試験機に取り付けて測定した。
Note that the tensile strength was measured by cutting the thin plate-like body into a predetermined size to prepare a tensile test piece, and attaching this test piece to an Amsler type tensile tester.

比較例1〜3 実験例1と同様の薄板状体を用いて、これに850℃で
60分間溶体化処理を施した。その後、加熱処理後の薄
板状体を室温まで250℃/分の速度で冷却した。
Comparative Examples 1 to 3 Using the same thin plate body as in Experimental Example 1, it was subjected to solution treatment at 850°C for 60 minutes. Thereafter, the thin plate-shaped body after the heat treatment was cooled to room temperature at a rate of 250° C./min.

このようにして、従来の溶体化処理を施した析出硬化型
銅合金薄板状体(比較例1)を得た。
In this way, a precipitation-hardened copper alloy thin plate (Comparative Example 1) which had been subjected to conventional solution treatment was obtained.

また、室温まで冷却する速度を100℃/分、40℃/
分にした点以外は比較例1と同様にして比較例、2.3
の析出硬化型銅合金薄板状体を得た。
In addition, the cooling rate to room temperature was 100℃/min, 40℃/min.
Comparative example 2.3 was prepared in the same manner as comparative example 1 except that the
A precipitation-hardened copper alloy thin plate was obtained.

これらの析出硬化型銅合金薄板状体の引張り強度を゛、
実験例1と同様にして調べた。その結果を下記第1表に
併記する。
The tensile strength of these precipitation-hardened copper alloy thin plates is
The investigation was conducted in the same manner as in Experimental Example 1. The results are also listed in Table 1 below.

実験例4〜6 まず、析出硬化成分として1.0重量%のBeおよび0
.5重量%のCOを含有する析出硬化型銅合金を電気炉
内で1200℃に加熱し溶解した。
Experimental Examples 4 to 6 First, 1.0% by weight of Be and 0% by weight were used as precipitation hardening components.
.. A precipitation hardening copper alloy containing 5% by weight of CO was heated to 1200° C. in an electric furnace and melted.

これに実験例1と同様に圧延処理して薄板状体を得た。This was rolled in the same manner as in Experimental Example 1 to obtain a thin plate-like body.

次に、得られた薄板状体に950℃で30分間加熱して
第1溶体化処理を施した。第1溶体化処理工程後、薄板
状体を850℃まで10℃/分の冷却速度で冷却した。
Next, the obtained thin plate-shaped body was heated at 950° C. for 30 minutes to undergo a first solution treatment. After the first solution treatment step, the thin plate-shaped body was cooled to 850°C at a cooling rate of 10°C/min.

次に、850℃の温度で30分間保持して、薄板状体に
第2溶体化処理を施した。その後、第2溶体化処理後の
薄板状体を室温まで250℃/分の冷却速度で冷却した
Next, the thin plate-shaped body was subjected to a second solution treatment by holding at a temperature of 850° C. for 30 minutes. Thereafter, the thin plate-like body after the second solution treatment was cooled to room temperature at a cooling rate of 250° C./min.

このようにして、実験例4の析出硬化型銅合金薄板状体
を得た。また、室温まで冷却する速度を100℃/分、
40℃/分にした点以外は実験例4と同様にして実験例
5.6の析出硬化型銅合金薄板状体を得た。
In this way, a precipitation hardening type copper alloy thin plate-like body of Experimental Example 4 was obtained. In addition, the cooling rate to room temperature was set to 100°C/min.
Precipitation hardening type copper alloy thin plate bodies of Experimental Example 5.6 were obtained in the same manner as Experimental Example 4 except that the heating rate was 40° C./min.

これらの析出硬化型銅合金薄板状体の引張り強度を時効
硬化処理の温度を450℃にした点以外は実験例1と同
様にして調べた。実験例1と同様にして調べた。その結
果を、下記第1表に併記する。
The tensile strength of these precipitation-hardened copper alloy thin plates was examined in the same manner as in Experimental Example 1, except that the temperature of the age hardening treatment was 450°C. The investigation was conducted in the same manner as in Experimental Example 1. The results are also listed in Table 1 below.

比較例4〜6 実験例4と同様の薄板状体を用いて、これに950℃で
60分間溶体化処理を施した。その後、加熱処理後の薄
板状体を室温まで250℃/分の冷却速度で冷却した。
Comparative Examples 4 to 6 Using the same thin plate body as in Experimental Example 4, it was subjected to solution treatment at 950°C for 60 minutes. Thereafter, the thin plate-shaped body after the heat treatment was cooled to room temperature at a cooling rate of 250° C./min.

このようにして、従来の溶体化処理を施した比較例4の
析出硬化型銅合金薄板状体を得た。また、室温まで冷却
する速度を100℃/分、40℃/分にした点以外は比
較例4と同様にして比較例5.6の析出硬化型銅合金薄
板状体を得た。
In this way, a precipitation-hardened copper alloy thin plate of Comparative Example 4, which had been subjected to conventional solution treatment, was obtained. Further, a precipitation-hardened copper alloy thin plate body of Comparative Example 5.6 was obtained in the same manner as Comparative Example 4 except that the cooling rate to room temperature was 100° C./min and 40° C./min.

これらの析出硬化型銅合金薄板状体の引張り強度を、実
験例4と同様にして調べた。その結果を、下記第1表に
併記する。
The tensile strength of these precipitation-hardened copper alloy thin plates was examined in the same manner as in Experimental Example 4. The results are also listed in Table 1 below.

第   1   表 第1表から明らかなように、本発明の溶体化処理方法を
行って得た析出硬化型銅合金(実験例1〜6)は、時効
硬化処理後の引張強度が高いものであった。これに対し
て、従来の溶体化処理方法を行って得られた析出硬化型
銅合金(比較例1〜6)は、いずれも時効硬化後の引張
強度が低いものであった。
Table 1 As is clear from Table 1, the precipitation hardening copper alloys (Experimental Examples 1 to 6) obtained by the solution treatment method of the present invention have high tensile strength after age hardening treatment. Ta. On the other hand, precipitation hardening copper alloys obtained by conventional solution treatment methods (Comparative Examples 1 to 6) all had low tensile strength after age hardening.

以上の結果、明らかなように本発明の析出硬化型銅合金
の溶体化処理方法は、次のような効果を奏する。
From the above results, it is clear that the solution treatment method for precipitation hardening copper alloys of the present invention has the following effects.

■急冷することなしに優れた特性を有する析出硬化型銅
合金に効率よく溶体化処理することができる。
■Precipitation-hardening copper alloys with excellent properties can be efficiently solution-treated without rapid cooling.

■熱間圧鉱時の加熱による溶体化処理、連続焼鈍炉やベ
ル炉による溶体化処理が可能となる。
■ Solution treatment by heating during hot pressing or solution treatment using a continuous annealing furnace or a bell furnace becomes possible.

[発明の効果] 以上説明した如く、本発明にかかる析出硬化型銅合金の
溶体化処理方法によれば、簡易な設備で実施可能であり
、しかも、最終の冷却工程中に析出硬化に寄与しない析
出相が析出するのを防止できるものである。
[Effects of the Invention] As explained above, the solution treatment method for precipitation hardening copper alloys according to the present invention can be carried out with simple equipment, and does not contribute to precipitation hardening during the final cooling step. It is possible to prevent precipitation of the precipitated phase.

Claims (2)

【特許請求の範囲】[Claims] (1)Cuを主成分とし、析出硬化成分として0.2〜
2.0重量%のBeを含有する析出硬化型銅合金を75
0〜950℃の温度で10分以上加熱してCuにBeを
固溶させる第1溶体化処理工程と、該第1溶体化処理後
の銅合金を所定の温度まで冷却する第1冷却工程と、該
第1冷却工程後の銅合金に前記第1溶体化処理の際の温
度よりも低い温度で、かつ、600〜750℃の温度で
5分以上の加熱を施してCuにBeを固溶させる第2溶
体化処理工程と、該第2溶体化処理後の銅合金を5℃/
分以上の冷却速度で冷却する第2冷却工程とを具備する
ことを特徴とする析出硬化型銅合金の溶体化処理方法。
(1) Cu is the main component, and precipitation hardening component is 0.2~
75% precipitation hardening copper alloy containing 2.0% by weight of Be.
A first solution treatment step in which Be is dissolved in Cu by heating at a temperature of 0 to 950 ° C. for 10 minutes or more, and a first cooling step in which the copper alloy after the first solution treatment is cooled to a predetermined temperature. , heating the copper alloy after the first cooling step at a temperature lower than the temperature during the first solution treatment and at a temperature of 600 to 750° C. for 5 minutes or more to dissolve Be in Cu. a second solution treatment step in which the copper alloy after the second solution treatment is heated at 5°C/
1. A method for solution treatment of a precipitation hardening copper alloy, comprising: a second cooling step of cooling at a cooling rate of 1 minute or more.
(2)Cuを主成分とし、析出硬化成分として0.2〜
2.0重量%のBeおよび0.05〜4.0重量%のC
oを含有する析出硬化型銅合金を750〜950℃の温
度で10分以上加熱してCuにBeおよびCoを固溶化
させる第1溶体化処理工程と、該第1溶体化処理後の銅
合金を所定の温度まで冷却する第1冷却工程と、該第1
冷却工程後の銅合金に前記第1溶体化処理の際の温度よ
りも低い温度で、かつ、600〜850℃の温度で5分
以上の加熱を施してCuにBeおよびCoを固溶させる
第2溶体化処理工程と、該第2溶体化処理後の銅合金を
5℃/分以上の冷却速度で冷却する第2冷却工程とを具
備することを特徴とする析出硬化型銅合金の溶体化処理
方法。
(2) Cu is the main component, and the precipitation hardening component is 0.2~
2.0 wt% Be and 0.05-4.0 wt% C
A first solution treatment step of heating a precipitation hardening copper alloy containing O at a temperature of 750 to 950° C. for 10 minutes or more to make Be and Co a solid solution in Cu, and a copper alloy after the first solution treatment. a first cooling step of cooling the first to a predetermined temperature;
After the cooling step, the copper alloy is heated at a temperature lower than the temperature during the first solution treatment and at a temperature of 600 to 850°C for 5 minutes or more to dissolve Be and Co into Cu. Solution treatment of a precipitation hardening copper alloy, comprising two solution treatment steps and a second cooling step of cooling the copper alloy after the second solution treatment at a cooling rate of 5° C./min or more. Processing method.
JP9629790A 1990-04-13 1990-04-13 Solid solution treatment of precipitation hardening copper alloy Pending JPH03294462A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9629790A JPH03294462A (en) 1990-04-13 1990-04-13 Solid solution treatment of precipitation hardening copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9629790A JPH03294462A (en) 1990-04-13 1990-04-13 Solid solution treatment of precipitation hardening copper alloy

Publications (1)

Publication Number Publication Date
JPH03294462A true JPH03294462A (en) 1991-12-25

Family

ID=14161107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9629790A Pending JPH03294462A (en) 1990-04-13 1990-04-13 Solid solution treatment of precipitation hardening copper alloy

Country Status (1)

Country Link
JP (1) JPH03294462A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995018873A1 (en) * 1994-01-06 1995-07-13 Ngk Insulators, Ltd. Beryllium copper alloy having high strength, machinability and heat resistance and production method thereof
JPH08302451A (en) * 1995-02-01 1996-11-19 Brush Wellman Inc Method of metamorphosing alloy and alloy article made thereby
EP0894508A2 (en) 1997-07-31 1999-02-03 Kabushiki Kaisha Bangahdo Skin-contact type medical treatment apparatus
WO2014069303A1 (en) * 2012-11-02 2014-05-08 日本碍子株式会社 Cu-Be ALLOY AND METHOD FOR PRODUCING SAME

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995018873A1 (en) * 1994-01-06 1995-07-13 Ngk Insulators, Ltd. Beryllium copper alloy having high strength, machinability and heat resistance and production method thereof
US5824167A (en) * 1994-01-06 1998-10-20 Ngk Insulators, Ltd. Beryllium-copper alloy excellent in strength, workability and heat resistance and method for producing the same
JPH08302451A (en) * 1995-02-01 1996-11-19 Brush Wellman Inc Method of metamorphosing alloy and alloy article made thereby
EP0894508A2 (en) 1997-07-31 1999-02-03 Kabushiki Kaisha Bangahdo Skin-contact type medical treatment apparatus
WO2014069303A1 (en) * 2012-11-02 2014-05-08 日本碍子株式会社 Cu-Be ALLOY AND METHOD FOR PRODUCING SAME
US10094002B2 (en) 2012-11-02 2018-10-09 Ngk Insulators, Ltd. Cu—Be alloy and method for producing same

Similar Documents

Publication Publication Date Title
US4073667A (en) Processing for improved stress relaxation resistance in copper alloys exhibiting spinodal decomposition
JPS623225B2 (en)
JPH06264202A (en) Production of high strength copper alloy
JP4281355B2 (en) Method for producing aluminum alloy foil having high strength and good rollability
US3698965A (en) High conductivity,high strength copper alloys
JPH03294462A (en) Solid solution treatment of precipitation hardening copper alloy
JP2889314B2 (en) Solution treatment method of precipitation hardening type copper alloy
JP2871801B2 (en) Solution treatment method of precipitation hardening type copper alloy
JP3942505B2 (en) Titanium copper alloy material and manufacturing method thereof
JP2889313B2 (en) Solution treatment method of precipitation hardening type copper alloy
JPH03294460A (en) Solution treatment for precipitation hardening copper alloy
JPS58213850A (en) Manufacture of al-zn-mg-cu alloy material of superior formability
JP2000038647A (en) Method for working copper alloy
JPH05132745A (en) Production of aluminum alloy excellent in formability
JPH0418016B2 (en)
JPH0424420B2 (en)
JPH0588302B2 (en)
CN113061777B (en) Brass alloy and preparation method thereof
JPH0827551A (en) Production of cu-ni-si alloy for electrical and electronic apparatus parts
JPS6296643A (en) Superplastic aluminum alloy
JP2635648B2 (en) Manufacturing method of tin-copper alloy sheet
JPS62170462A (en) Manufacture of superplastic aluminum alloy material
JPS63293148A (en) Manufacture of near beta-titanium alloy having high strength and satisfactory ductility
JPS63145734A (en) Copper alloy for electronic apparatus and its production
JPH0586468B2 (en)