JPH0329317A - Arrangement apparatus for semiconductor wafer - Google Patents

Abstract

PURPOSE:To simply form a wafer arrangement, on a boat, which corresponds to a diffusion treatment by a method wherein wafer water arrangement on the heat is input to an input device, a wafer arrangement data is formed, this data is stored in a first storage device, this data is made to correspond to each diffusion furnace tube and the data is stored in a second storage device. CONSTITUTION:The following are provided: a data input device 24 to which a wafer arrangement of wafers 1 on a boat 49 is input; a processing means 20 which forms a data of the wafer arrangement which has been input by the data input device 24; a first storage device 28 where the wafer arrangement data formed by means of the processing means 20 is stored; a second storage device 29 where the wafer arrangement data stored in the first storage device 28 is stored so as to correspond to individual diffusion furnace tubes 54a to 54d; a device which transfers wafer waters 1 to a prescribed position between a cassette 2 and the boat 49 on the basis of a wafer arrangement pattern which has been stored in the second storage device 29. Thereby, since the wafer 1 can be set in all groove positions of the boat 49 in arbitrary positions, directions and number of various kind of wafer 1, it is possible to correspond to various types of processes.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor wafer alignment device that aligns semiconductor wafers on a boat for heat treatment in a semiconductor wafer manufacturing process. [Prior art] Figures 6 and 7 are, for example, published in the magazine "Automation Technology J No. 1".
Volume 7. This is a conventional wafer transfer device shown in No. 4 <1985). In FIG. 6, (1) is a wafer, which is housed in a cassette (2). (3) is the cassette loading station. This is for arranging multiple cassettes (2). (4) is a transfer robot, which has a wafer suction hand (8) at the tip, and has X-axis (5), Y-axis (6)
, Z-axis (7) by a predetermined means (not shown).The wafer (
1) is transferred to the boat (9), and conversely, the wafer (1) held in the boat <9> is transferred to the cassette 2).

FIG. 8 is a diagram showing an operation flowchart of a conventional semiconductor wafer alignment apparatus.

FIG. 9 is a diagram showing the arrangement of a conventional semiconductor wafer alignment device before and after wafer loading. A conventional semiconductor wafer alignment device is configured as described above. In FIG. 8, the operator selects wafer loading mode or wafer unloading mode in step (S1). When wafer loading mode is selected. Step (S2
), input the wafer loading data (27〉) using the keyboard (22〉) and store it in the RAM (21).According to the wafer loading data (27), enter the furnace number (2 7 a >) to load or unload the wafer (1). , the number of wafers to be transferred from the cassette (2) to the boat (9) (
2 7 b), the number of cassettes (2) used for transfer (2
7c), load or unload mode specification (27
If you input d), the transfer work from the cassette (2> to the boat 9> will start).
(21>) is carried out as follows. In step (S4), the boat (9> is moved to the fixed position by NC movement. Next, the input number of wafers (2
7b), preset number of boat courses B.

<3 0 ), number of dummy wafers on the outside side D2 (31)
, number of inner dummy wafers D. According to (32), the outer dummy wafer transfer position G is established. (I); I = 1 to DI as an arithmetic expression Go = (B- W-)/2 + w. +D2 I
Calculate with. In step (S6), the transfer robot (4) moves the out measurement dummy wafer (33) placed in advance on the end of the boat (9) to the X axis (5). Y-axis (6), Z-axis (7)
Move. Support the wafer with the suction hand (8) and place it on the bottom (
9) Move to the above calculation process 6W. is the input number of wafers (27b). In step (S8), cassette wafer transfer position c(I); I-1 to W. The calculation formula C(I)=
(Bwa-W.)/2+W. −I, and cassettes A to D (2a> to (2d) on force set mounting station <3)
) to transfer the wafer (1> adjacent to the outside dummy wafer (33>) on the boat (9) using the wafer suction hand (8). Inside dummy wafer transfer position G. (I)
); Calculate I=1 to D2 in step (SIO) 20. (
I) Calculate by 1 (B.-W.)/2I and get the boat (9
) The inside dummy wafer (34) placed in advance on the wafer (1) is moved by the wafer suction hand (8), a work completion indication is given in step (S12), and the dummy wafer (34) is removed from the cassette (2) from the boat. (9) Finish loading.

As shown in FIG. 9(a), the wafer (1
), the wafer (1) is loaded into the center of the boat (9) as shown in FIG. 9(b).The wafer arrangement is stored in the RAM (21).
is moved to a diffusion furnace (not shown) where diffusion processing is performed. To unload cassettes A to D (2a) to (2d) from the boat (9), follow the steps in the reverse order as described above.
Step (s 3 ) with the data stored in (21)
, (s 5 ), (S 7 ), (s 9 ), (S
1 1) is executed. The inside dummy wafer (34) wafer (1) and the outside dummy wafer (33>) are returned to their original positions. [Problem to be solved by the invention] In the conventional semiconductor wafer alignment apparatus as described above, the number of dummy wafers, Depending on the number of wafers to be processed, the wafer arrangement on the boat is limited to the position on the boat and a fixed pitch.Since the program restricts the arrangement to the orientation, if the wafer arrangement on boat 1- changes due to the diffusion processing conditions. It became necessary to rewrite the program already stored in the memory, and it took a lot of effort to modify and debug it.There were problems such as a decrease in the operating rate of the entire device.This invention has the following problems:
This was done to solve this problem without rewriting the program inside the microcomputer. The objective is to obtain a semiconductor wafer alignment device that allows an operator to easily arrange wafers on a boat that is compatible with diffusion processing on site. [Means for Solving the Problems] A semiconductor wafer alignment device according to the present invention includes a data input device for inputting the wafer arrangement of wafers on a boat, and a process for creating data of the wafer arrangement input by the data input device. With the means. a first storage device that stores the wafer array data created by the processing means; and a second storage device that stores the wafer array data stored in the first storage device in a specified manner for each diffusion furnace tube. This device includes a device and a device that transfers wafers to predetermined positions between the cassette and the boat based on the wafer arrangement button stored in this second storage device. [Operation] In this invention, wafer arrangement data is created by inputting the wafer arrangement on the boat into the input device, and this data is stored in the first storage device, and then stored in the first storage device. The wafer array data is stored in a second storage device in correspondence with each diffusion furnace tube, and wafers are transferred from the cassette to the boat based on the stored wafer array pattern data. [Embodiment] FIG. 1 is a diagram showing a semiconductor wafer alignment apparatus according to an embodiment of the present invention. In the figure, (1) and (2) are the same as the conventional one. (41) is the cassette unloader station. Cassette (2) containing unprocessed wafers (1)
is received from the outside, and the processed wafer (1) is sent out to the outside. (42> is the cassette dam. Cassette <2)
to be temporarily stored. (43) is a first cassette traverser that can simultaneously transport a plurality of cassettes (2) between the cassette unloader station (41) and the cassette dam (42). (44) is a cassette lifter; ) is the second
The cassette traverser can transport cassettes (2) one by one. (46) is an orientation flat aligner,
Align the oriented flat of the wafer (1) in the cassette (2). (46a) is an orientation flat aligner (46
) is a collection station located at In addition. Orientation flat aligner (46) and collection station (46a)
Each has a machine side that can be rotated every 180 degrees depending on the orientation when wafers are arranged. (47) is a cassette aligner, (48) is a wafer transfer, and the wafer (1) housed in the cassette (2) is transferred to the bow (49).
Also, on the contrary, the wafer held in the boat (49)
1) can be transferred to the cassette (2). (5
0) is a boat liner that moves the boat (49) between the wafer transfer (48) and the boat elevator (51). (52> is a boat rotor station, (53) is a boat loader. (54) is a diffusion furnace, which has multiple tubes (5 4 a). (5 4
b). (5 4 c ), (5 4 d).

FIG. 2 is a diagram showing the control system configuration and wafer arrangement data for the apparatus shown in FIG. 1. In the figure. The control system (60) includes a CP (J (20)), an input section (24) such as a sensor switch, an output section (25) for the mechanical section such as a solenoid, a relay, and a pulse motor, and a series of transfer processing. , a ROM (21) that stores an input processing program for wafer array data (61), and a ROM (21) that stores input processing programs for wafer array data (61);
61) and a keyboard <22) for inputting various operations. C that displays the wafer array pattern (not shown) generated from the wafer array data <6■> and the status of the equipment, etc.
RT (23), a first storage device (28), such as a floppy disk, for storing the wafer arrangement pattern, and a diffusion furnace tube (54a) to store the wafer arrangement pattern stored in the first storage device (28). ~(54d) A second storage device (29), such as a RAM, stores
) and has been sidelined.

Generally, the wafers on the wafer (49) have various patterns depending on the diffusion process, and it is necessary to arrange them according to a predetermined pattern. Figure 3 shows an example.
The wafer (1) is a main wafer (1a) that will be processed into a product.
and a monitor wafer (lb). There are in-dummy wafers (LC) and out-dummy wafers (LD) that are inserted to make the heat uniform at the edge, and the main wafer (LA>) and monitor wafer (1B) may be oriented in the forward or reverse direction, making it complicated. Furthermore, a replenishment method (65) is defined as a process to be performed when the number of cassettes is missing or when the number of wafers in the cassette is insufficient. Front-loading processing that ignores the wafer arrangement and arranges the wafers in front.If cassettes (2) are missing, there are cassette replenishment that replenishes dummy wafers (not shown) in units of cassettes, and number replenishment that replenishes wafers in units of number. .

Figure 3 shows the cassette <2> with two main wafers (1a),
Monitor wafer (lb), indummy wafer (1C). It is a diagram showing an example of arranging out-dummy wafers (1d) on a board [49] by replenishing the number of wafers. FIG. 4 is a diagram showing an operation flowchart of the apparatus shown in FIG. Figure 5 is a diagram showing the memory arrangement before and after wafer transfer. In the semiconductor wafer alignment apparatus that is elliptical as described above, in step (S20) of FIG. Input the aforementioned wafer arrangement data (61) using the keyboard (22). For example, when setting up an in-dummy wafer (IC).
Type of wafer (1) (62). Number of wafers (1) to be arrayed (6 4 ), replenishment method (65), groove number at the start of the wafer array (68), pitch between the wafers (69)
Enter . The direction (63) is. Indummy wafer (1C
> and out dummy ueno) (ld) do not require input. After inputting all the types of wafers (1) to be placed on the boat (49), enter the pattern number (66).
When the pattern name (67) and pattern name (67) are registered, the data is temporarily stored in the first storage device (28).Here, a floppy disk is used as the first storage device (28). The wafer arrangement pattern can be registered accordingly.Next, in step (S21>), when the pattern number (66) registered in step (S20>) corresponding to the tube is input, the second pattern is displayed as shown in (72) in FIG. The orientation and type (75) of the wafer (1) and the replenishment method (7) are stored in the address corresponding to the groove number (74) of the boat (49) in the storage device (29) (in this case, RAM is used).
6〉 coded data is written, and the cassette (2
The transfer of wafers (1) from
This is done using this pattern. continue. Step (
In step S22), wafer loading from the cassette (2> to the boat (49) is started, and the machine operates according to a predetermined program.
a> and the cassette (2) containing the monitor wafer (1b)
) on the unloader station (41), and the first cassette traverser (43) is temporarily moved. Cassette dam (42
) to temporarily store the cassette (2). Normally, the in-dummy wafer (LC), the out-dummy wafer (1d), and the supply dummy wafer are used continuously for several processes, so they are stored at the unloader station (41). cassette (2)
There is no entry or exit. At step (323>), move the boat liner (50> to the boat (49) so that the first row of the wafer arrangement on the boat (49) in the pre-transfer memory (72) matches the transfer position of the wafer transfer (48). When a processing request is received from the diffusion furnace (54), the cassette (2) containing the indummy wafer (1c) is taken out from the cassette dam (42) by the first cassette traverser (43). When the cassette lifter (44) descends and reaches the lower limit, the second cassette traverser (45) carries the cassette (2) onto the orientation flat aligner (46).
In step (S24), the cassette aligner (47
) moves the cassette (2〉) to the wafer transfer (48), and at the same time the boat liner (50》) moves the cassette (2〉) to the wafer transfer (48).
49) to the transfer position, and insert the ROM (21) in advance.
) with the program written in the memory before transfer (7
2>, the dummy wafer (48) is transferred from the cassette (2) to the board (49) by the wafer transfer (48).
1C) is transferred. When the transfer is completed, the cassette aligner <47> carries the cassette <2> to the collection station (46a). The cassette (2) is removed from the cassette dam (42) in the opposite manner to when it was taken out from the cassette dam (42).
2) is stored in its original position. Next, in step (S25), the main wafer (1a) is transferred to the bow [49] by the same procedure as above. If the wafer (1a) is in the opposite direction, use an orientation flat aligner (4
6) is reversed and the cassette <<2>> is reversed 180".

In step (S26>, it is determined whether the transfer of all cassettes (2) has been completed, and step (825) is delayed until the transfer is completed.In step (S27>), the transfer of the monitor wafer (1b) is is performed in the same procedure as step (S25>). In step (S28), the necessity of replenishing dummy wafers is checked, and step (S26>
The actual number of wafers (1a) is transferred to the memory (
72) if it is missing. Supply method is “1”
Or when it is “2”. In the next step (S29>, dummy wafers are supplied in the same manner as above.Finally, in step (S30), the out dummy wafer (1d) is transferred, and the wafers are arranged on the boat (49). The situation will be like memory (73) after transfer. Boat liner (
50) transports the boat (49) to the connection point (not shown) with the boat elevator (51). Next, the boat (49) is carried up to a predetermined shelf in the bottle loader station (52) by the boat elevator (51). Furthermore, it is inserted into a diffusion furnace (54) by a boat loader (53). A predetermined heat treatment is performed in a diffusion furnace (54). After transfer, the memory (73) corresponds to the bottom course number (74). The wafer type and orientation (75〉) are coded, and the contents of the pre-transfer memory (72) are updated.The wafer for which the diffusion process has been completed (1〉) is the reverse operation to the wafer loading, and the contents of the pre-transfer memory (72) are updated. The memory (73) is referenced and the cassette (2) is returned from the boat (49) to complete the series of operations. In the above embodiment, the first storage device is a floppy disk, and the second storage device is a RAM. However, there are other storage media such as cassette magnetic tape.
You can use any type of magnetic disk. Further, in the above embodiment, a 6-keyboard is used as a data input means, but other means such as a barcode reader may be used.
Paper tape readers, optical readers, and graphic input devices may also be used.

Furthermore, in the above embodiment, the creation of a wafer array pattern was explained as a case in which new data is input, but data can also be input by calling up the contents stored in the first or second storage device and partially modifying the contents. may be simplified, and the same effect as in the above embodiment can be achieved. [Effect of the invention 1 This invention is as explained above. Place wafers in all positions on the boat, and place various wafers in any position. Since it can be set by direction and number of sheets, it can be adapted to various processes, and since there is no need to change the program in the microcomputer, the equipment can be made at low cost.Furthermore, since it uses floppy disks, data can be shared, which saves the operator's labor. It has the effect of

[Brief explanation of drawings]

FIG. 1 is a configuration diagram of a semiconductor wafer alignment apparatus according to an embodiment of the present invention, FIG. 2 is a control system configuration diagram and input data diagram of the apparatus of FIG. 1, and FIG. 3 is a wafer arrangement diagram of the apparatus of FIG. 1. 4 is an operation flowchart of the device shown in FIG. 1, and FIG. 5 is a memory layout diagram of the device shown in FIG. 1 before and after wafer transfer. Fig. 6 is an external view of a conventional semiconductor wafer alignment device, and Fig. 7 is a control system elliptical diagram and input data diagram of the device shown in Fig. 6. Fig. 8 is an operational flowchart of the conventional device, and Fig. 9 is a layout diagram of the conventional device before and after wafer loading. In the figure, (1)... wafer. <2)...Cassette, (20>...CPU, (21>...ROM, (
22)...Keyboard, (24)...Input section, (2
5)...Output section. (28)...first storage device, (
29)...Second storage device, (42)...Cassette dam, (48)...Wafer transfer, (50...
・Boat liner, (52)...Boat rotor station, (54)...Diffusion furnace. Note that the same symbols in each figure indicate the same or equivalent parts. "Ao- 54b Saitoko! Furnace Tunifu also Figure 2 W) Figure 4, Figure 7, Figure 8 Figure 9 (0) Indication of procedural amendment case Patent application No. 1-162659 Name of invention Relationship with the case involving the person who filed the patent application Address: 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Name (601) Moriya Shiki, Representative of Mitsubishi Electric Corporation

Claims (1)

[Claims] A cassette dam for storing a cassette of semiconductor wafers, a wafer transfer for transferring the semiconductor wafer between the cassette taken out from the cassette dam and a boat, a diffusion furnace for heat-treating the semiconductor wafer, and holding the semiconductor wafer. a boat rotor station for inserting and pulling out the boat into and out of the diffusion furnace; a boat liner for transporting the boat between the wafer transfer and the boat rotor station; and a boat liner for transporting the boat between the wafer transfer and the boat rotor station; A diffusion furnace wafer handler apparatus having a control device that performs operations according to requests, a data input device for inputting the wafer arrangement on the boat, a processing means for creating wafer arrangement data input by the data input device, and a first storage device that stores the wafer arrangement pattern generated by the processing means;
a second storage device that stores the wafer arrangement pattern stored in the storage device in correspondence with the diffusion furnace;
1. A semiconductor wafer alignment device comprising: a device for transferring the wafers to arbitrary positions between the cassette and the boat based on a wafer alignment pattern stored in a storage device.