JP3507591B2 - Heat treatment apparatus and heat treatment method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a heat treatment apparatus and heat treatment.
Regarding the method .

[0002]

2. Description of the Related Art A heat treatment step is one of the important steps in manufacturing a semiconductor wafer. This heat treatment includes, for example, formation of an oxide film, diffusion of a dopant, annealing, CVD, and the like, and recently, a vertical heat treatment apparatus has been often used instead of a horizontal furnace because of advantages such as less entrainment of air. ing.

As shown in FIG. 8, this vertical heat treatment apparatus is a wafer which is a vertical heat treatment furnace 11 and a wafer holder for holding a large number of wafers W arranged in a rack shape with vertical intervals. The boat 12 includes a boat 12, a transfer table 13 on which a wafer carrier (hereinafter, simply referred to as “carrier”) C is placed for transferring the wafer W, and other carrier loading / unloading ports and carrier stockers (not shown). The wafer W in the carrier C placed on the delivery table 13 is transferred to the wafer boat 12 by the transfer arm 14 and a predetermined number of wafers are loaded in the wafer boat 12, and then the wafer boat 12 is shown in the heat treatment 11 in the drawing. The wafer W is carried in by a boat elevator, and the wafer W is subjected to a predetermined heat treatment in the heat treatment 11.

Since the upper and lower ends of the wafer boat 12 are lower in temperature than the other portions due to the structure of the heat treatment furnace, dummy wafers are arranged in these portions in order to avoid non-uniformity of processing between the wafers W. A normal wafer to be processed is mounted on the portions other than the upper and lower ends. The holding area of the wafer to be processed in the wafer boat 12 is shown in FIG.
For example, when 25 wafers are set as one lot, lot areas P1 to P4 for four lots are designated. For example, when transferring the wafers to be processed from the four carriers to the wafer boat 12, The wafers in the carrier are transferred to the lot areas P1 to P4, respectively. When the number of wafers in each carrier is less than 25, the wafers are left chipped according to the array pattern in the carrier, that is, the number of wafers in the carrier corresponding to the empty wafers. The empty stage on the wafer boat 12 is left as it is or is replenished with a replenishment wafer.
Note that D in FIG. 9 is a holding area for the dummy wafer.

Here, for example, in an apparatus using a wafer boat capable of mounting wafers for four carriers,
The number of carriers may be less than 4 when performing one processing. This happens, for example, when the wafer is stuck due to trouble in the process before the heat treatment process,
In this case, among the holding areas P1 to P4, only the number corresponding to the number of carriers is used. For example, in the case of 3 carriers, the lot areas P1 to P3 or P2 to P4 are used according to the operator's selection.

[0006]

By the way, when the wafer boat 12 is loaded into the heat treatment furnace 11, the wafer boat 1
In the holding area of the wafer to be processed above 2, some variation in temperature in the height direction is unavoidable, and although the temperature distribution in the height direction is within the allowable range, there are good areas and slightly inferior areas. The reality is that there is a mixture of. Therefore, when the number of carriers is less than the maximum number of lots accommodated in the wafer boat 12, it is preferable to hold the wafers in a region having a good temperature distribution. Since only two transfer patterns can be selected when processing the wafer, it is not possible to freely use the desired area in the holding area, and it is not always possible to use a good area. It was

Further, when the number of wafers in the carrier is less than the maximum number of wafers that can be accommodated in each carrier, for example, 25 wafers, and when replenishing wafers are used, each lot area P
1 to P4, the replenishment wafer is transferred to the holding position corresponding to the vacant groove of the carrier. However, when the replenishment wafer enters between the wafers to be processed in this way, the replenishment wafer is not a product, Since a high level management such as a cleaning process is not performed like a processed wafer, there is a problem that contamination occurs between the processed wafer and the replenishment wafer and the processed wafer is easily contaminated. .

[0008] The present invention has been made under such circumstances, when the purpose of transferring the substrate to be processed holder, a heat treatment apparatus and capable of aligning the substrate to be processed in a large degree of freedom It is to provide a heat treatment method .

[0009]

According to a first aspect of the present invention, a plurality of substrates to be processed are taken out of the substrate carrier and the substrate carrier is removed.
In the heat treatment apparatus for holding the rear units in parallel with each other and carrying them into the reaction tube of the heating furnace to perform the heat treatment, the step number in the substrate holding area of the holder is set as the reference position. Based on the designated reference position designating unit and the holding position designated by the reference position designating unit , the substrates to be processed in all the substrate carriers for one batch processing are packed and transferred to the holder. The control unit that controls the substrate transfer machine and the designation of the reference position is such that the substrate to be processed holds the substrate to be processed.
Whether or not a mistake is specified to protrude from the area
Number of substrates to be processed in rear, substrate holding area and reference
A mistake is specified by making a calculation based on the number of steps in the position.
Sometimes the substrate to be processed fits within the substrate holding area.
And an arithmetic unit that automatically corrects the reference position.

[0010] The invention of claim 2, based on a plurality of the substrate
In a heat treatment apparatus for taking out from a plate carrier and holding the substrate carriers in parallel in holders in parallel, and carrying them into a reaction tube of a heating furnace for heat treatment, a lot area is assigned to each substrate carrier in the substrate holding area of the holder. , A lot area fixing mode in which the substrate to be processed of each substrate carrier is transferred to each of the lot areas, and a step number holding position in the substrate holding area of the holder is designated as a reference position, Transfer based on this holding position, which selects one of a lot area variation mode in which the substrates to be processed in all the substrate carriers for one batch processing are packed and transferred to the holder A mode selection unit, a control unit that controls the substrate transfer machine so as to transfer the substrate to be processed to the holder based on the mode selected by the transfer mode selection unit, and a reference
The position is specified so that the substrate to be processed is
Whether or not it is a mistake to project is determined by checking whether or not it is a mistake in each substrate carrier.
Number of processed substrates, processed substrate holding area, and number of steps in the reference position
And make a judgment based on
Standard position so that the processed substrate fits within the substrate holding area
And an arithmetic unit that automatically corrects the position.

According to a third aspect of the present invention, there is provided a heat treatment apparatus in which a plurality of substrates to be processed are taken out of a substrate carrier , held in parallel by a holder in units of substrate carriers , and carried into a reaction tube of a heating furnace for heat treatment. A lot area is assigned to each substrate carrier in the substrate holding area of the holder, and a substrate to be processed in each substrate carrier is transferred to each of the lot areas in correspondence with an array pattern in the substrate carrier. The lot area fixed mode and the substrate key in the substrate holding area of the holder.
A second lot in which a lot area is assigned to each carrier and the processed substrate in each substrate carrier is packed and transferred in each of the lot areas regardless of whether or not there is a vacancy in the arrangement of wafers in the substrate carrier. The area fixing mode and the number of stages of the holding position in the substrate holding area of the holder to be used as the reference position are designated, and with this holding position as a reference, all substrate carriers in one batch processing A transfer mode setting section for selecting one of a lot area variation mode in which a substrate to be processed is transferred to a holder, and a mode selected by the transfer mode setting section. A control unit for controlling the substrate transfer machine so as to transfer the substrate to be processed to the holding tool from the inside of the substrate carrier.

According to a fourth aspect of the present invention, in the heat treatment apparatus according to the third aspect, in order to transfer the substrate to be processed between the substrate carrier and the holder, a mower that simultaneously conveys a plurality of substrates to be processed. The present invention is characterized in that it has a substrate transfer machine provided with both a mode and a mode for transporting the substrates to be processed one by one.

According to a fifth aspect of the present invention, in the heat treatment apparatus according to the first, second, third, or fourth aspect, in the lot area variation mode, the holding position of the stage in the substrate holding area of the holder is set as the reference position. It is a mode in which all the lots of substrates to be processed in one batch process are transferred to the holder while being packed with the reference position as the center.

According to a sixth aspect of the present invention, in the heat treatment apparatus according to the third aspect , it is determined whether or not the designation of the reference position is a mistake designation of the substrate to be processed protruding from the substrate holding area.
Determined by calculating based on the number of stages and the reference position of the number and the target substrate holding area of the substrate in the substrate carrier, Miss finger
Characterized by comprising an arithmetic unit for automatically correcting the reference position as the substrate to be processed falls target substrate holding area when a constant. The heat treatment method of the present invention is a heat treatment method in which a plurality of substrates to be processed are taken out of a substrate carrier , held in parallel by a holder for each substrate carrier , and carried into a reaction tube of a heating furnace for heat treatment. The step of arranging the substrate carrier on the transfer part, the step of designating which stage of the substrate holding area of the holder to use as the reference position, and the designation of the reference position are the substrate to be processed. Is covered
Whether or not it is an error specification that protrudes from the processing substrate holding area
The number of substrates to be processed in each substrate carrier and the substrates to be processed.
Judge by calculating based on the holding area and the number of steps of the reference position,
If the mistake is specified, the substrate to be processed is
Process to automatically correct the reference position so that it fits within the area
Then , the substrate to be processed is taken out from the substrate carrier of the transfer unit, and the substrates to be processed in all the substrate carriers related to one batch processing are packed and transferred to the holder with reference to the designated holding position. To control the substrate transfer machine,
Next, the step of carrying in the holder into the reaction tube of the heating furnace and performing the heat treatment on the substrate to be processed is included. Further, a heat treatment method according to another invention is a heat treatment method in which a plurality of substrates to be processed are held in parallel in a holder from a substrate carrier in a substrate carrier unit and carried into a reaction tube of a heating furnace for heat treatment. a step of positioning the carrier to the transfer section, the substrate on the substrate holding region of the holding device
A lot area is assigned to each carrier, and a lot area fixing mode in which the substrate to be processed in each substrate carrier is transferred to each of the lot areas and a holding position of a step in the substrate holding area of the holder are used as a reference. Position is specified, and the holding position is used as a reference, and the lot area variation mode in which the substrates to be processed in all the substrate carriers for one batch processing are packed and transferred to the holder, A step of selecting one mode, a step of controlling the substrate transfer machine so as to transfer the substrate to be processed to the holder based on the mode selected in this step, and then a furnace for heating the holder. including a step of performing heat treatment, the substrate to be processed and carried into the reaction tube of
However, when the lot area variation mode is selected,
The position is specified so that the substrate to be processed is
Whether or not it is a mistake to project is determined by checking whether or not it is a mistake in each substrate carrier.
Number of processed substrates, processed substrate holding area, and number of steps in the reference position
And make a judgment based on
Standard position so that the processed substrate fits within the substrate holding area
It is characterized by performing a step of automatically correcting the position . In addition Lot region fixed mode assigns a lot area for each substrate carrier on a substrate holding area of the holder, a substrate to be processed in each substrate carrier to each of the lot region sequences pattern in the substrate carrier - corresponding to emissions First to be transferred
Lot area fixing mode, and assigning a lot area to each substrate carrier in the substrate holding area of the holder, regardless of whether or not there is an empty wafer array in the substrate carrier,
A second lot area fixing mode in which substrates to be processed in each substrate carrier are packed and transferred in each of the lot areas may be selected.

[0015]

According to claim 1, the number of lots per batch is 1
When there are less than the maximum number of lots per batch, or when the number of substrates to be processed in each lot is less than the maximum number of substrates to be processed, all the lots of substrates to be processed are desired in the holder. It can be held in the area. Therefore, the substrate to be processed can be transferred with a large degree of freedom, and heat treatment can be performed in a region having good characteristics of the device.
Further, since the substrates to be processed are arranged close to each other on the basis of the reference position with no vacant stages, the substrates to be processed and the substrates to be supplemented are separated when the supplementary substrate is used, and contamination can be reduced. Then, the substrate to be processed is treated on the holder.
Automatic when a mistake is made to stick out from the processing board holding area
If the operator manually corrects the reference position,
No need to specify again considering the number of substrates to be processed
It is convenient because it can be done, and it is also necessary to correct it.
A decrease in put can be avoided.

If the transfer mode is set so that the substrates to be processed are arranged vertically (in the case of the vertical heat treatment apparatus) around the designated reference position as in the fifth aspect, for example, the center of a region having good characteristics is formed. By setting the reference position, the arrangement of the substrates to be processed can be efficiently positioned in the area regardless of the number of substrates to be processed, and thus the reference position can be easily specified. Further, as in claim 6, if the reference position is automatically corrected in the case where the mistaken designation of the substrate to be processed protruding from the substrate holding area on the holder is designated, the operator can re-process the number of substrates to be processed. This is convenient because it is not necessary to re-specify in consideration of the above, and it is possible to avoid a decrease in throughput due to the correction work.

According to a second aspect of the present invention, a lot area is allocated to the substrate holding area for each lot, and the lot area is fixed even in the case of the above-mentioned lot deficiency or substrate deficiency. Since the lot area fixing mode in which the transfer can be performed within the area is adopted and one of the mode and the lot area changing mode of claim 1 can be selected, the transfer mode of the substrate to be processed can be selected. Greater freedom. When the lot area fixing mode is selected, the lot area and the lot correspond to each other. Therefore, when checking the processing state of the substrate to be processed later, if the lot to be included is known, the holding area of the holder can be easily set. Since it is specified, subsequent analysis is easy.

Further, in claim 3, the lot area fixing mode is a first lot area fixing mode in which when the substrate to be processed is chipped in the carrier, the substrate to be processed is transferred to the lot area in the same arrangement pattern ( In this case, an empty stage occurs between the substrates to be processed in the lot area),
Since both the second lot area fixing mode in which the substrates to be processed are held in the lot area while holding the substrates to be processed are prepared and one of them can be selected, the transfer mode of the substrates to be processed can be selected. The degree of freedom of is even greater. When the first lot area fixing mode is selected, if a transfer machine capable of transferring a plurality of sheets at the same time as in claim 4 is used, a plurality of arms are inserted into the carrier to receive the substrate to be processed and the holder is held as it is. It is easy to transfer because it can be transferred to. Further, when the second fixed mode is selected, the substrate to be processed is brought close to the lot area. Therefore, when the empty stage is filled with the substrate to be supplemented, the substrate to be treated and the substrate to be supplemented can be distinguished from each other, so that contamination can be suppressed. You can

[0019]

1 and 2 are views showing a heat treatment apparatus according to an embodiment of the present invention, in which the heater is bent on the inner side of the apparatus body and outside a reaction tube which cannot be seen in the figure. The vertical heat treatment furnace 21 and the plurality of substrates to be processed, such as wafers, are vertically stacked and horizontally stacked and mounted on the heat treatment furnace 21 by the boat elevator 22 (see FIG. 2) and a wafer transfer machine 24 for loading and unloading wafers.

In the wafer boat 23, four pillars made of, for example, quartz are planted on the bottom plate along the contour of the wafer, and holding grooves for holding the wafer peripheral edge are formed at corresponding height positions of these pillars. Consists of Further, the wafer transfer machine 24
As shown in FIG. 1, it is equipped with a base 24a that can be raised and lowered and freely rotated, and five tweezers 24b that can be moved back and forth so that, for example, five wafers can be collectively transported, and one of the tweezers is It is configured so that it can be moved back and forth independently of the other four wafers, and can also carry one wafer. It should be noted that reference numeral 25 in FIG. 1 denotes a lid for closing the lower end opening of the heat treatment furnace 21 while the wafer is being transferred between the wafer boat 23 and the carrier C. A wafer transfer section 31 is arranged so as to face the lowered position of the wafer boat 23 via the wafer transfer device 24.
The wafer transfer unit 31 is configured so that, for example, the carriers C that store the wafers W can be placed in three stages.

A carrier storage shelf (carrier stocker) 32 is provided in the upper region of the wafer transfer section 31, and the carrier storage shelf 32 is, for example, the carrier C.
4 rows and 4 stages, the maximum number of 16 can be stored. The carriers C stored in the carrier storage shelves 32 include carriers that store wafers to be processed, carriers that store dummy wafers, carriers that store replenishment wafers, carriers that store monitor wafers, and the like.

A moving area of the carrier transfer machine 4 is secured at a position facing the wafer transfer section 31 and the carrier storage rack 32, and a carrier stage 33 is provided on the front side of the apparatus main body with the moving area sandwiched therebetween. ing. The carrier stage 33 is a portion that plays a role of an input / output port for loading and unloading a carrier C containing a wafer, and a state in which the wafer take-out port of the carrier C faces upward, that is, the wafer is vertical. Carrier C is 4 in this state
They are placed side by side (in the x direction).

Although the carrier stage 33 is conceptually shown as a single stage in FIG. 1, it is actually provided for each of the four carriers C and mounted on the carrier stage 33. As shown in FIG. 2, the carrier C is combined with a mechanism for rotating the carrier C to the inner side by rotating the carrier C to the inner side, and the carrier C is transferred by the carrier transfer device 4 in the sideways position. It will be. In the carrier transfer machine 4, an arm 43 rotatable about the Z-axis for holding and transferring the carrier C is attached to an elevating table 42 that moves up and down along a column 41 that is movable in the X direction. Composed. In FIG. 2, F is an air filter part.

A touch panel 5 for operating the device is provided on the front panel of the main body of the device, and the touch panel 5 also serves as an operation part and a display part. The heat treatment apparatus of the present embodiment is provided with a wafer transfer mode setting unit 6 for setting how to transfer the wafer to be processed to the wafer boat 23 as shown in FIG.

An example of the operation screen of the wafer transfer mode setting section 6 is shown in FIG. 4, and this screen sets the first lot area fixing mode, the second lot area fixing mode and the lot area changing mode, respectively. Switch sections S1 and S for
2 and S3. On the lower side of each of the switch units S1 to S3, FIGS. F1 and F that schematically show respective transfer modes.
2 and F3 are displayed. Both the first and second lot area fixing modes are modes in which lot areas are assigned to the wafer holding areas of the wafer boat 23 for each lot, and the wafers to be processed of the respective lots are transferred to these lot areas.

For example, when the wafer boat 23 having a holding groove of 150 steps is used and dummy wafers are arranged in upper and lower 25 steps and the wafers to be processed are held between them (100 steps), the 25 steps are divided into 4 sections. Lot area P
1 to P4, and when the number of wafers in one carrier corresponding to one lot is 25 or less than 24, the wafer for one carrier is divided into 25 lots in one lot area. Retained within. That is, the first and second lot area fixing modes are modes in which the positions of the lot areas P1 to P4 on the wafer boat 23 are fixed. The difference between the two modes will be described. The first lot area fixing mode is a mode in which wafers are transferred into the lot areas P1 to P4 corresponding to the wafer arrangement pattern in the carrier. That is, in this mode, even if there are not 25 wafers in the carrier and there are vacant grooves, the five tweezers 24b of the wafer transfer machine 24 are moved into the carrier to perform the receiving operation, and the wafer boat 23 is loaded. This is a mode in which the transfer operation is performed, and in the lot areas P1 to P4 of the wafer boat 23, the position corresponding to the empty groove in the carrier becomes an empty stage.

In the second lot area fixing mode, the wafers in each lot (carrier) are placed in each of the lot areas P1 to P4 regardless of whether the wafers in the carrier are vacant or not. In this mode, the data is packed and transferred in order. In this mode, the wafer transfer machine 24 carries out batch transfer by the five tweezers 24b when five wafers are packed in the carrier (so-called no tooth missing) and arranged. If there is one, one sheet is conveyed by one tweezer 24b. In the operation screen, horizontal solid lines in FIG. F1 represent wafers, and hatched portions in FIG. F2 represent wafer groups.
Represents a dummy wafer region.

On the other hand, in the lot area change mode, the positions of the lot areas P1 to P4 are changed according to the number of wafers in one carrier corresponding to one lot or the number of lots (the number of carriers) in one batch processing. That is, this is a mode in which all the wafers are packed and arranged based on the designated reference position. A groove number display portion 61, which should be the reference position, for example, the center position of the wafer group, is provided immediately below the switch S3 in the lot area variation mode S3, and the groove number of the center position is designated in the vicinity thereof. Numeric keypad 6 for
Two are provided.

Next, returning to FIG. 3, the structure of the control system of the heat treatment apparatus of this embodiment will be described. In this heat treatment apparatus, the calculation unit 63, the parameter setting unit 7, the storage unit 8 and the drive control unit 70 are included. I have it. The calculation unit 63 takes in the number of carriers for one batch process, the number of wafers in each carrier, the total number of grooves in the wafer boat 23, and the dummy wafer regions (the number of dummy wafers arranged), and determines the center position when the lot region variation mode is selected. Whether or not the designation of the groove number is valid, that is, whether or not the wafer to be processed overlaps the holding area of the wafer to be processed excluding the dummy wafer area, and in the case of an invalid mistake designation, the wafer to be processed is It has a function of automatically calculating and determining the groove number of the central position so that the groove number fits within the holding area.

The parameter setting section 7 is composed of the operation screen of the operation panel 5, and the total number of grooves of the wafer boat 23,
This is a part for inputting the presence / absence (whether or not to use) of the dummy wafer region and the replenishment wafer, and for setting various parameters such as the presence / absence of other monitor wafers.
Programs 81, 82, 8 corresponding to the respective modes set by the transfer mode setting unit 6 are stored in the storage unit 8.
3 is stored. The drive control unit 70 includes a storage unit 8
Wafer transfer machine 24 based on the selected program in
It has a function of controlling the drive of the CPU and is composed of a CPU, a motor control circuit, and the like. In this embodiment, the storage unit 8 and the drive control unit 70 form a part of a control unit that controls the wafer transfer machine 24 based on the selected transfer mode. Next, the operation of the above embodiment will be described.
First, the case where the switch section S1 is pressed on the wafer transfer mode setting screen shown in FIG. 4 to select the first lot area fixing mode will be described. As shown in FIG. 1 and FIG. 2, the carrier C containing the wafers is carried into the carrier stage 33, and then temporarily stored in the carrier storage rack 32 by the carrier transfer machine 4 or directly afterwards.
Be transported to. Next, the wafer is taken out from the carrier C placed on the delivery table 31 by the wafer transfer device 24 and transferred to the wafer boat 23.

In this mode, wafer transfer is performed based on the first lot area fixing mode program 81.
That is, the wafer groups in the four carriers C are transferred into the lot areas P1 to P4 of the wafer boat 23, respectively. In this case, as shown in FIG. 5, the five arms 24b of the wafer transfer machine 24 are transferred.
Since the wafer W is transferred by simultaneously operating the wafer W and the wafer W in the carrier C, as already described in detail, the corresponding stage in the wafer boat 23 remains empty.

If the parameter setting unit 7 (see FIG. 3) is set to use the replenishment wafer, the replenishment wafer is replenished to the empty stage on the wafer boat 23. When not used, it remains empty. The replenishment wafer is used to prevent the gas flow from changing due to an empty stage, and is not used, for example, in an annealing process that is not easily affected by the gas flow. However, a mode in which a supplementary wafer is not used may be set in the CVD process or the like. In this way, after the wafers are loaded on the wafer boat 23, the wafer boat 23 is carried into the heat treatment furnace 21, and the wafer is subjected to heat treatment, for example, annealing treatment. After that, the wafer boat 23 is unloaded from the heat treatment furnace 21, and the wafer W on the wafer boat 23 is returned to the original carrier C.

Further, the parameter setting unit 7 may be set to use a monitor wafer. In this case, for example, one stage above the lot region P1 and 4 between lot regions P2, P3 and P4.
Monitor wafers for monitoring the processing states of the wafers of each lot are transferred from a dedicated carrier to the location. Therefore, although the positions of the lot areas P1 to P4 are slightly different between when the monitor wafer is used and when the monitor wafer is not used, the lot area fixed mode means that the wafer to be processed in each of the mode using the monitor and the mode not using the monitor. This means that the lot area is fixed regardless of the number of sheets.

Further, in the case where the second lot area fixing mode is selected, as described above, when 5 consecutive wafers are arranged in the carrier, the wafer transfer machine 24 is set to 5
The five tweezers 24b collectively transfer the five wafers to the wafer boat 23, but when any one of the continuous five-stage grooves in the carrier has an empty space, as shown in FIG. Wafers are transferred to the wafer boat 23 one by one using only the tweezers 24b. Then, the wafers in the four carriers C are transferred to the lot areas P1 to P4, respectively. The wafers are moved to the upper side of the lot area, and are transferred, for example, from the top of the lot area in order. On the lower side of the wafer group, empty stages are formed by the amount corresponding to the total of empty grooves for each carrier C. When the number of carriers is 3 or less in both the first and second lot area fixed modes, for example, P1, P2, P3 are designated and the designated area is used.

Next, description will be given of a case where the switch area S3 is pressed on the transfer mode setting screen of FIG. 4 to select the lot area variation mode and "75" is designated as the groove number of the center position. In this case, as in the second lot area fixing mode, the tweezers 24b of the wafer transfer machine 24 are selectively used according to the presence / absence of empty grooves in the carrier C. Then, as shown in FIG. 7, the wafers in each carrier C are arranged in a row centered on the 75th groove from the bottom without any empty step. However, when the number of all wafers is an even number (n /
2 + 1) or (n / 2-1) is arranged so as to be located at the groove number at the center position.

In the example of FIG. 7, for example, 10, 15, 15, and 15 wafers are stored in each of the four carriers C, and these 55 wafers are vertically arranged around the 75th stage. In other words, the state in which the lots are arranged in the order of lots from the 48th row to the 102nd row is shown. An empty step is formed between the holding area of the wafer to be processed and the dummy wafer area D, but this area is left as an empty step or filled with a refilling wafer depending on the processing. Here, the arithmetic unit 63 shown in FIG. 3 determines whether or not the designation of the groove number of the center position is valid, and if it is not valid (if a mistake is designated), all the wafers are placed within the holding area of the wafer to be processed. To fix. For example, when the holding area of the wafer to be processed is from the 26th stage to the 125th stage and the central position is specified as 100 stages (the groove number is 100) for 55 wafers, the wafer is cut into the upper dummy wafer region D. Therefore, the center position is automatically corrected to 98 steps so that the top wafer to be processed is located at the 125th step.

According to the above-mentioned embodiment, when the lot area variation mode is set, the wafers are arranged vertically in the carrier with the designated groove number of the holder 23 as the center position. When a lot is lacking, the wafer group can be positioned in a region where the characteristics of the device such as the temperature distribution are better, and the wafer to be processed and the replenishment wafer are held separately so that the replenishment wafer is used. It is possible to reduce the contamination (contamination) on the wafer to be processed. In this case, the reference position may specify the upper or lower end position of the wafer group. However, if the central position is specified, the central portion of a good region such as the temperature distribution is irrespective of the number of processed wafers. When the groove position corresponding to is designated, the group of wafers to be processed is efficiently positioned within that region, and thus the reference position can be designated easily. It is convenient because the reference position is automatically corrected when a mistaken designation is made so that the wafer to be processed protrudes from a predetermined area.

Further, when the first or second lot area fixing mode is set, the lot area on the wafer boat 23 is fixed regardless of the number of wafers.
When the wafer after the heat treatment is analyzed, the carrier and the holding area on the wafer boat 23 correspond to each other, and if the carrier is known, the holding area on the wafer boat 23 is specified, so that the analysis is easy. In the first lot area fixing mode, the five tweezers 24a can be collectively operated to transfer a plurality of wafers at the same time regardless of the presence or absence of missing teeth in the wafer in the carrier, so that transfer can be performed easily and quickly. be able to. Further, in the second lot area fixing mode, the wafer to be processed and the replenishment wafer can be divided for each lot area, so that contamination can be suppressed.

Since the three transfer modes of the wafer are prepared in this way, the degree of freedom of the transfer mode is high, and the state of the apparatus at that time (whether or not the apparatus is stable). An appropriate mode can be selected according to the type of heat treatment, the type of heat treatment, the type of wafer, and the like, and an appropriate process can be performed.

As described above, in the present invention, the maximum number of lots to be accommodated in the holding area of the wafer to be processed is not limited to four lots, and the heat treatment may be various treatments such as CVD, oxidation treatment and diffusion treatment. . The present invention can be applied not only to the vertical heat treatment apparatus described in the above embodiment but also to a horizontal heat treatment apparatus.

[0041]

According to the present invention, since the lot area variation mode can be selected as the transfer mode of the substrate to be processed, by using this mode, the number of lots per batch and the number of substrates to be processed can be changed. Is less than a predetermined number, the substrate to be processed can be heat-treated in a region having better characteristics. In addition, since the transfer mode is selected from the lot area variation mode and the lot area fixed mode, for example, the first and second lot area fixed modes, the transfer mode can be selected according to the state of the apparatus and the type of heat treatment. The heat treatment can be performed in the loading mode.

[Brief description of drawings]

FIG. 1 is a perspective view showing an entire heat treatment apparatus according to an embodiment of the present invention.

FIG. 2 is a vertical sectional side view showing the entire heat treatment apparatus according to the embodiment of the present invention.

FIG. 3 is a block diagram showing a main part of a heat treatment apparatus according to an embodiment of the present invention.

FIG. 4 is an explanatory diagram showing a setting screen for a transfer mode of a wafer to be processed.

FIG. 5 is an explanatory diagram showing how wafers are transferred when the first lot area fixing mode is selected.

FIG. 6 is an explanatory diagram showing how wafers are transferred when the second lot area fixing mode is selected.

FIG. 7 is an explanatory diagram showing how wafers are transferred when the lot area variation mode is selected.

FIG. 8 is an explanatory diagram showing an outline of a conventional heat treatment apparatus.

FIG. 9 is an explanatory diagram showing a wafer holding region in a wafer boat used in a conventional heat treatment apparatus.

[Explanation of symbols]

21 heat treatment furnace 23 Wafer Boat 24 Wafer transfer machine 24a tweezers 31 Delivery stand 5 touch panel 6 Transfer mode setting section 63 arithmetic unit 7 Parameter setting section 70 Drive control unit 8 memory

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI H01L 21/31 H01L 21/31 E 21/324 21/324 Z (56) Reference JP-A-6-87511 (JP, A) JP-A-6-97263 (JP, A) JP-A-6-127621 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/68 B65G 1/00 535 H01L 21 / 02 H01L 21/205 H01L 21/22 511

Claims (12)

(57) [Claims] 1. A plurality of substrates to be processed from within a substrate carrier.
In a heat treatment apparatus for taking out and holding the substrate carriers in parallel in a holder and carrying them into a reaction tube of a heating furnace for heat treatment, the holding position of the stage in the substrate holding area of the holder is set as a reference position. Based on the reference position designating section for designating whether or not to perform, and the holding position designated by the reference position designating section, 1
The control unit that controls the substrate transfer machine so that the substrates to be processed in all the substrate carriers related to the batch processing of one time are packed and transferred to the holder, and the reference position is specified so that the substrates to be processed are processed. Substrate holding area
In each board carrier, check whether or not the mistake is specified.
Of the number of substrates to be processed, the substrate holding area and the reference position
When it is a mistake designation, it is judged by calculating based on the number of steps
Is so that the substrate to be processed fits within the substrate holding area.
A heat treatment apparatus comprising: a calculation unit that automatically corrects the quasi-position . 2. A plurality of substrates to be processed from within a substrate carrier
In a heat treatment apparatus for taking out and holding the substrate carriers in parallel in a holder and carrying them into a reaction tube of a heating furnace for heat treatment, a lot region is assigned to each substrate carrier in the substrate holding region of the holder, and the lot region is The lot area fixing mode in which the substrate to be processed of each substrate carrier is transferred to each of the above, and the number of the stage holding position in the substrate holding area of the holder is designated as the reference position, With this holding position as a reference, a lot area variation mode in which the substrates to be processed in all the substrate carriers for one batch processing are packed and transferred to a holder,
One of the transfer mode selection units, and the substrate transfer so that the substrate to be processed is transferred to the holder based on the mode selected by the transfer mode selection unit. The control unit that controls the machine and the designation of the reference position are whether the target substrate is the target substrate holding area.
In each board carrier, check whether or not the mistake is specified.
Of the number of substrates to be processed, the substrate holding area and the reference position
When it is a mistake designation, it is judged by calculating based on the number of steps
Is so that the substrate to be processed fits within the substrate holding area.
A heat treatment apparatus comprising: a calculation unit that automatically corrects the quasi-position . 3. A plurality of substrates to be processed from within a substrate carrier
In a heat treatment apparatus for taking out and holding the substrate carriers in parallel in a holder and carrying them into a reaction tube of a heating furnace for heat treatment, a lot region is assigned to each substrate carrier in the substrate holding region of the holder, and the lot region is Each of the substrate carriers
A first lot area fixing mode in which the substrates to be processed in the substrate carrier are transferred corresponding to the arrangement pattern in the substrate carrier, and a lot area is assigned to each substrate carrier in the substrate holding area of the holder, Irrespective of whether or not there is a vacancy in the wafer array of each substrate carrier in each of the lot areas.
A) A second lot area fixing mode in which the substrates to be processed are packed and transferred, and which stage of the substrate holding area of the holder is used as a reference position is designated. A transfer mode setting unit that selects one of a lot area variation mode in which the substrates to be processed in all the substrate carriers related to one batch processing are transferred to the holder with reference to And a control unit for controlling the substrate transfer machine so as to transfer the substrate to be processed from the substrate carrier to the holder based on the mode selected by the transfer mode setting unit. A heat treatment apparatus characterized by being provided. 4. A mode for simultaneously transporting a plurality of substrates to be processed and a mode for transporting the substrates to be processed one by one in order to transfer the substrates to be processed between the substrate carrier and the holder. 4. The heat treatment apparatus according to claim 3, further comprising a substrate transfer machine provided with both. 5. The substrate to be processed of all lots related to one batch processing is set to the reference position by designating which stage of the substrate holding area of the holder is used as the reference position. The heat treatment apparatus according to claim 1, wherein the heat treatment apparatus is transferred to the holder in a packed state as a center. 6. Whether or not the designation of the reference position is an erroneous designation of the substrate to be processed protruding from the substrate holding area is to be determined.
Determined by calculating based on the number of sheets and the target substrate holding area and the reference position of the substrate in the substrate carrier, Miss finger
The heat treatment apparatus according to claim 3, further comprising a calculation unit for automatically correcting the reference position as the substrate to be processed falls target substrate holding area when a constant. 7. A plurality of substrates to be processed from within a substrate carrier
In a heat treatment method of taking out and holding the substrate carriers in parallel in a holder in parallel with each other, and carrying in the reaction tube of a heating furnace to perform heat treatment, a step of arranging the substrate carrier in a transfer part, and a substrate holding area of the holder. The step of designating which stage of the holding position to use as the reference position and the designation of the reference position are whether the target substrate is the target substrate holding area.
In each board carrier, check whether or not the mistake is specified.
Of the number of substrates to be processed, the substrate holding area and the reference position
When it is a mistake designation, it is judged by calculating based on the number of steps
Is so that the substrate to be processed fits within the substrate holding area.
The process of automatically correcting the sub-position, and taking out the substrate to be processed from the substrate carrier of the transfer part,
A step of controlling the substrate transfer machine so that the substrates to be processed in all the substrate carriers involved in one batch processing are packed and transferred to the holder on the basis of the designated holding position; Is carried into the reaction tube of the heating furnace to perform heat treatment on the substrate to be processed, the heat treatment method. 8. A plurality of substrates to be processed are provided from within a substrate carrier.
In a heat treatment method in which a substrate carrier is taken out and held in parallel with a holder in a holder and carried into a reaction tube of a heating furnace to perform heat treatment, a step of positioning the substrate carrier in a transfer part, and a substrate holding area of the holder. A lot area is assigned to each substrate carrier, and each substrate carrier is assigned to each of the lot areas.
The lot area fixing mode in which the substrate to be processed is transferred and the number of the holding position in the substrate holding area of the holder to be used as the reference position is specified.
A process of selecting one of the lot region variation mode in which the substrates to be processed in all the substrate carriers for one batch processing are packed and transferred to the holder, and the mode selected in this process. -A step of controlling the substrate transfer machine so as to transfer the substrate to be processed to the holder based on the code, and then carrying the holder into the reaction tube of the heating furnace to perform heat treatment on the substrate to be processed. Process, and when the lot area variation mode is selected, the reference position
Is specified, the processed substrate is out of the processed substrate holding area.
Whether or not a mistake is specified, whether or not it is processed in each substrate carrier
The number of substrates, the substrate holding area and the number of steps in the reference position
Based on the calculation, if the mistake is specified, it will be processed.
Set the reference position so that the substrate fits within the substrate holding area.
A heat treatment method characterized by performing a step of automatically correcting . 9. A plurality of substrates to be processed are provided from within a substrate carrier.
In a heat treatment method in which a substrate carrier is taken out and held in parallel with a holder in a holder and carried into a reaction tube of a heating furnace to perform heat treatment, a step of positioning the substrate carrier in a transfer part, and a substrate holding area of the holder. A lot area is assigned to each substrate carrier, and each substrate carrier is assigned to each of the lot areas.
A first lot area fixing mode in which the substrates to be processed in the substrate carrier are transferred corresponding to the arrangement pattern in the substrate carrier, and a lot area is assigned to each substrate carrier in the substrate holding area of the holder, Irrespective of whether or not there is a vacancy in the wafer array of each substrate carrier in each of the lot areas.
A ) A second lot area fixing mode in which the substrates to be processed are packed and transferred, and which stage of the substrate holding area of the holder is used as a reference position is designated. A step of selecting one of a lot area variation mode in which the substrates to be processed in all the substrate carriers related to one batch processing are transferred to the holding tool with reference to The step of controlling the substrate transfer machine so as to transfer the substrate to be processed to the holder based on the mode selected by, and then carrying the holder into the reaction tube of the heating furnace to be the substrate to be processed. And a step of performing heat treatment to the heat treatment method. 10. The substrate transfer machine, in order to transfer a substrate to be processed between a substrate carrier and a holder, a mode for simultaneously transporting a plurality of substrates to be processed and a substrate to be processed one by one. 10. The heat treatment method according to claim 9, which is provided with both of a mode for carrying and 11. The number of steps in the substrate holding area of the holder is designated as the reference position to thereby set the 1
11. The heat treatment method according to claim 7, 8, 9 or 10, wherein all the lots of substrates to be processed in one batch processing are transferred to the holder while being packed around the reference position. 12. Whether or not the designation of the reference position is a mistake designation of the substrate to be processed protruding from the substrate holding area to be processed,
A mistake is made by making a calculation based on the number of substrates to be processed in each substrate carrier, the substrate holding area to be processed, and the number of steps at the reference position.
10. The heat treatment method according to claim 9 , wherein when the designation is made, the reference position is automatically corrected so that the substrate to be processed fits within the substrate holding region.