JPH0328757U - - Google Patents
Info
- Publication number
- JPH0328757U JPH0328757U JP8971589U JP8971589U JPH0328757U JP H0328757 U JPH0328757 U JP H0328757U JP 8971589 U JP8971589 U JP 8971589U JP 8971589 U JP8971589 U JP 8971589U JP H0328757 U JPH0328757 U JP H0328757U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- metal plate
- thin metal
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims 5
- 239000000088 plastic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の半導体集積回路装
置の斜視図、第２図は第１図の断面図、第３図は
従来の半導体集積回路装置の斜視図、第４図は第
３図の断面図である。 １，１′……半導体集積回路素子、２，２′…
…リードフレーム、３，３′……プラスチツク樹
脂、４，４′……リード、５，５′……ボンデイ
ングワイヤ。
置の斜視図、第２図は第１図の断面図、第３図は
従来の半導体集積回路装置の斜視図、第４図は第
３図の断面図である。 １，１′……半導体集積回路素子、２，２′…
…リードフレーム、３，３′……プラスチツク樹
脂、４，４′……リード、５，５′……ボンデイ
ングワイヤ。
Claims (1)
- 複数の半導体集積回路素子を搭載し、樹脂封止
してなる半導体集積回路装置において、第一の金
属薄板の主表面に第一の半導体集積回路素子が固
着され、第二の金属薄板の主表面に第二の半導体
集積回路素子が固着され、前記第一の金属薄板と
第二の金属薄板が互いに対向していることを特徴
とする半導体集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8971589U JPH0328757U (ja) | 1989-07-28 | 1989-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8971589U JPH0328757U (ja) | 1989-07-28 | 1989-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328757U true JPH0328757U (ja) | 1991-03-22 |
Family
ID=31639284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8971589U Pending JPH0328757U (ja) | 1989-07-28 | 1989-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328757U (ja) |
-
1989
- 1989-07-28 JP JP8971589U patent/JPH0328757U/ja active Pending