JPH0328753U - - Google Patents
Info
- Publication number
- JPH0328753U JPH0328753U JP8804489U JP8804489U JPH0328753U JP H0328753 U JPH0328753 U JP H0328753U JP 8804489 U JP8804489 U JP 8804489U JP 8804489 U JP8804489 U JP 8804489U JP H0328753 U JPH0328753 U JP H0328753U
- Authority
- JP
- Japan
- Prior art keywords
- die island
- inclined portion
- lead
- die
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000725 suspension Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8804489U JPH0745965Y2 (ja) | 1989-07-28 | 1989-07-28 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8804489U JPH0745965Y2 (ja) | 1989-07-28 | 1989-07-28 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0328753U true JPH0328753U (da) | 1991-03-22 |
JPH0745965Y2 JPH0745965Y2 (ja) | 1995-10-18 |
Family
ID=31637677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8804489U Expired - Lifetime JPH0745965Y2 (ja) | 1989-07-28 | 1989-07-28 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0745965Y2 (da) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005311214A (ja) * | 2004-04-26 | 2005-11-04 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
-
1989
- 1989-07-28 JP JP8804489U patent/JPH0745965Y2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005311214A (ja) * | 2004-04-26 | 2005-11-04 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP4515810B2 (ja) * | 2004-04-26 | 2010-08-04 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0745965Y2 (ja) | 1995-10-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |