JPH0328470Y2 - - Google Patents

Info

Publication number
JPH0328470Y2
JPH0328470Y2 JP1985065628U JP6562885U JPH0328470Y2 JP H0328470 Y2 JPH0328470 Y2 JP H0328470Y2 JP 1985065628 U JP1985065628 U JP 1985065628U JP 6562885 U JP6562885 U JP 6562885U JP H0328470 Y2 JPH0328470 Y2 JP H0328470Y2
Authority
JP
Japan
Prior art keywords
light
emitting
flexible envelope
surface side
emitting display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985065628U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61182587U (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985065628U priority Critical patent/JPH0328470Y2/ja
Publication of JPS61182587U publication Critical patent/JPS61182587U/ja
Application granted granted Critical
Publication of JPH0328470Y2 publication Critical patent/JPH0328470Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP1985065628U 1985-04-30 1985-04-30 Expired JPH0328470Y2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985065628U JPH0328470Y2 (de) 1985-04-30 1985-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985065628U JPH0328470Y2 (de) 1985-04-30 1985-04-30

Publications (2)

Publication Number Publication Date
JPS61182587U JPS61182587U (de) 1986-11-14
JPH0328470Y2 true JPH0328470Y2 (de) 1991-06-19

Family

ID=30597797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985065628U Expired JPH0328470Y2 (de) 1985-04-30 1985-04-30

Country Status (1)

Country Link
JP (1) JPH0328470Y2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2656198C (en) * 2006-09-12 2012-02-14 Paul Lo Integrally formed single piece light emitting diode light wire
US8052303B2 (en) * 2006-09-12 2011-11-08 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
US8567992B2 (en) 2006-09-12 2013-10-29 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof
US8807796B2 (en) 2006-09-12 2014-08-19 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5321920Y2 (de) * 1972-02-10 1978-06-07

Also Published As

Publication number Publication date
JPS61182587U (de) 1986-11-14

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