JPH0343609Y2 - - Google Patents
Info
- Publication number
- JPH0343609Y2 JPH0343609Y2 JP18883287U JP18883287U JPH0343609Y2 JP H0343609 Y2 JPH0343609 Y2 JP H0343609Y2 JP 18883287 U JP18883287 U JP 18883287U JP 18883287 U JP18883287 U JP 18883287U JP H0343609 Y2 JPH0343609 Y2 JP H0343609Y2
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- circuit board
- printed circuit
- contacts
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000003550 marker Substances 0.000 description 17
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18883287U JPH0343609Y2 (de) | 1987-12-14 | 1987-12-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18883287U JPH0343609Y2 (de) | 1987-12-14 | 1987-12-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0192705U JPH0192705U (de) | 1989-06-19 |
JPH0343609Y2 true JPH0343609Y2 (de) | 1991-09-12 |
Family
ID=31479899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18883287U Expired JPH0343609Y2 (de) | 1987-12-14 | 1987-12-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0343609Y2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009163997A (ja) * | 2008-01-08 | 2009-07-23 | Valens Electronics Co Ltd | 多種のランプユニットを適用する天井装着式ランプ台座 |
JP5601512B2 (ja) * | 2009-09-14 | 2014-10-08 | 東芝ライテック株式会社 | 発光装置および照明装置 |
-
1987
- 1987-12-14 JP JP18883287U patent/JPH0343609Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH0192705U (de) | 1989-06-19 |
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