JPS61182587U - - Google Patents

Info

Publication number
JPS61182587U
JPS61182587U JP1985065628U JP6562885U JPS61182587U JP S61182587 U JPS61182587 U JP S61182587U JP 1985065628 U JP1985065628 U JP 1985065628U JP 6562885 U JP6562885 U JP 6562885U JP S61182587 U JPS61182587 U JP S61182587U
Authority
JP
Japan
Prior art keywords
light
emitting
surface side
emitting surface
envelope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985065628U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0328470Y2 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985065628U priority Critical patent/JPH0328470Y2/ja
Publication of JPS61182587U publication Critical patent/JPS61182587U/ja
Application granted granted Critical
Publication of JPH0328470Y2 publication Critical patent/JPH0328470Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP1985065628U 1985-04-30 1985-04-30 Expired JPH0328470Y2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985065628U JPH0328470Y2 (de) 1985-04-30 1985-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985065628U JPH0328470Y2 (de) 1985-04-30 1985-04-30

Publications (2)

Publication Number Publication Date
JPS61182587U true JPS61182587U (de) 1986-11-14
JPH0328470Y2 JPH0328470Y2 (de) 1991-06-19

Family

ID=30597797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985065628U Expired JPH0328470Y2 (de) 1985-04-30 1985-04-30

Country Status (1)

Country Link
JP (1) JPH0328470Y2 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039154A (ja) * 2006-09-12 2012-02-23 Hui Zhou Light Engine Ltd 一体成形ledライトワイヤ
US8496351B2 (en) * 2006-09-12 2013-07-30 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
US8567992B2 (en) 2006-09-12 2013-10-29 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof
US8807796B2 (en) 2006-09-12 2014-08-19 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4892876U (de) * 1972-02-10 1973-11-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4892876U (de) * 1972-02-10 1973-11-07

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039154A (ja) * 2006-09-12 2012-02-23 Hui Zhou Light Engine Ltd 一体成形ledライトワイヤ
US8496351B2 (en) * 2006-09-12 2013-07-30 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
JP2013153224A (ja) * 2006-09-12 2013-08-08 Hui Zhou Light Engine Ltd 一体成形ledライトワイヤ
US8567992B2 (en) 2006-09-12 2013-10-29 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof
US8789971B2 (en) * 2006-09-12 2014-07-29 Huizhou Light Engine Ltd Integrally formed single piece light emitting diode light wire
US8807796B2 (en) 2006-09-12 2014-08-19 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof

Also Published As

Publication number Publication date
JPH0328470Y2 (de) 1991-06-19

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