JPS61182587U - - Google Patents

Info

Publication number
JPS61182587U
JPS61182587U JP1985065628U JP6562885U JPS61182587U JP S61182587 U JPS61182587 U JP S61182587U JP 1985065628 U JP1985065628 U JP 1985065628U JP 6562885 U JP6562885 U JP 6562885U JP S61182587 U JPS61182587 U JP S61182587U
Authority
JP
Japan
Prior art keywords
light
emitting
surface side
emitting surface
envelope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985065628U
Other languages
Japanese (ja)
Other versions
JPH0328470Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985065628U priority Critical patent/JPH0328470Y2/ja
Publication of JPS61182587U publication Critical patent/JPS61182587U/ja
Application granted granted Critical
Publication of JPH0328470Y2 publication Critical patent/JPH0328470Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の実施例を示すもので、第１図は
その平面図、第２図は同縦断面図、第３図は発光
体素子の縦断面図、第４図は使用状態図、第５図
乃至第７図は別の実施例を示す縦断面図、第８図
及び第９図はさらに別の実施例を示す平面図、第
１０図は先行例の使用状態図である。 １…発光体素子、２１，２２…導電線、３…可
撓被包体、３１…発光面、３２…光反射層、４…
吸盤。 The drawings show an embodiment of the present invention; FIG. 1 is a plan view thereof, FIG. 2 is a vertical sectional view thereof, FIG. 3 is a vertical sectional view of the light emitting element, FIG. 5 to 7 are longitudinal cross-sectional views showing another embodiment, FIGS. 8 and 9 are plan views showing still another embodiment, and FIG. 10 is a usage state diagram of the previous example. DESCRIPTION OF SYMBOLS 1... Light emitter element, 21, 22... Conductive wire, 3... Flexible envelope, 31... Light emitting surface, 32... Light reflection layer, 4...
Sucker.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多数の発光体素子を列状に配して複数本の導電
線に接続すると共に、少なくとも発光面側を透光
性とした可撓性被包体にて全体を被包せしめた発
光表示体において、前記被包体の発光面側とは反
対側の背面部に光反射層を形成し、かつこの被包
体の発光面側もしくは背面側に複数個の吸盤を設
けたことを特徴とする発光表示体。 In a light-emitting display in which a large number of light-emitting elements are arranged in a row and connected to a plurality of conductive wires, and the entire body is covered with a flexible envelope whose light-emitting surface side is transparent. , a light-emitting device characterized in that a light-reflecting layer is formed on the back side of the envelope opposite to the light-emitting surface side, and a plurality of suction cups are provided on the light-emitting surface side or the back side of the envelope. Display body.
JP1985065628U 1985-04-30 1985-04-30 Expired JPH0328470Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985065628U JPH0328470Y2 (en) 1985-04-30 1985-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985065628U JPH0328470Y2 (en) 1985-04-30 1985-04-30

Publications (2)

Publication Number Publication Date
JPS61182587U true JPS61182587U (en) 1986-11-14
JPH0328470Y2 JPH0328470Y2 (en) 1991-06-19

Family

ID=30597797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985065628U Expired JPH0328470Y2 (en) 1985-04-30 1985-04-30

Country Status (1)

Country Link
JP (1) JPH0328470Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039154A (en) * 2006-09-12 2012-02-23 Hui Zhou Light Engine Ltd Integrally formed light emitting diode light wire
US8496351B2 (en) * 2006-09-12 2013-07-30 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
US8567992B2 (en) 2006-09-12 2013-10-29 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof
US8807796B2 (en) 2006-09-12 2014-08-19 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4892876U (en) * 1972-02-10 1973-11-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4892876U (en) * 1972-02-10 1973-11-07

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039154A (en) * 2006-09-12 2012-02-23 Hui Zhou Light Engine Ltd Integrally formed light emitting diode light wire
US8496351B2 (en) * 2006-09-12 2013-07-30 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
JP2013153224A (en) * 2006-09-12 2013-08-08 Hui Zhou Light Engine Ltd Single piece led light wire
US8567992B2 (en) 2006-09-12 2013-10-29 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof
US8789971B2 (en) * 2006-09-12 2014-07-29 Huizhou Light Engine Ltd Integrally formed single piece light emitting diode light wire
US8807796B2 (en) 2006-09-12 2014-08-19 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof

Also Published As

Publication number Publication date
JPH0328470Y2 (en) 1991-06-19

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