JPH03282472A - Projection aligner of substrate - Google Patents
Projection aligner of substrateInfo
- Publication number
- JPH03282472A JPH03282472A JP2081333A JP8133390A JPH03282472A JP H03282472 A JPH03282472 A JP H03282472A JP 2081333 A JP2081333 A JP 2081333A JP 8133390 A JP8133390 A JP 8133390A JP H03282472 A JPH03282472 A JP H03282472A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- vacuum
- stage
- vacuum suction
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 238000004891 communication Methods 0.000 claims description 19
- 235000012431 wafers Nutrition 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000037303 wrinkles Effects 0.000 description 4
- 238000007667 floating Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、基板上に像を投影露光するための装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for projecting and exposing an image onto a substrate.
例えばウェハ、ＦＰＣ，液晶基板等を製作する場合には
、フォトリソグラフィの技術が利用されている。For example, photolithography technology is used to manufacture wafers, FPCs, liquid crystal substrates, and the like.
しかるに、近年においては、ウェハ、プリント基板、液
晶基板のいずれにおいても、基板の大面積化が顕著な傾
向になっている。例えば、ウエハの場合には、６インチ
から８インチへの移行の必要性が強く主張されているし
、Ｔ Ａ Ｂ （Ｔａｐｅ Ａｕｔｏｍａｔｅｄ Ｂｏ
ｎｄｉｎｇ） に使われるフィルム回路基板のようなプ
リント基板でも、幅が１４０ｍｍで長さが１００ｍｍ以
上の大きなものが使用されるに至っている。However, in recent years, there has been a noticeable trend toward increasing the area of substrates, whether they are wafers, printed circuit boards, or liquid crystal substrates. For example, in the case of wafers, the need to transition from 6-inch to 8-inch is strongly advocated, and T A B (Tape Automated Bo
Even large printed circuit boards such as film circuit boards used in 2008 (anding), with a width of 140 mm and a length of 100 mm or more, are now being used.
一方、このフォｈｖソグラフィにおいては、転写すべき
回路パターンの像を投影して露光する投影露光工程があ
り、この投影露光工程では、露光中に投影された像のボ
ケや歪みがないように、ウェハ等の基板を真空吸着孔を
有するステージに真空吸着しながら露光している。On the other hand, in this photo-HV lithography, there is a projection exposure process in which an image of a circuit pattern to be transferred is projected and exposed. A substrate such as a wafer is exposed to light while being vacuum suctioned to a stage having vacuum suction holes.
しかし、基板が大型化されるに従って、ウェハ等の比較
的厚みのある基板においては“そり″が、モしてＦＰＣ
等の薄い基板にふいては“しわ”が残ったままでステー
ジに吸着されてしまい、投影露光による像のボケや歪み
が問題になっている。However, as substrates become larger, relatively thick substrates such as wafers tend to warp, which is becoming more common in FPCs.
When wiping a thin substrate such as the like, wrinkles remain and are adsorbed to the stage, causing problems such as blurring and distortion of the image due to projection exposure.
本発明の目的は、基板が大面積であってもしわやそりの
ない平坦な姿勢で吸着させることができる基板の投影露
光装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a projection exposure apparatus for a substrate that can suck a substrate in a flat posture without wrinkles or warpage even if the substrate has a large area.
上記目的を達成するため、この出願の第１の発明の基板
の投影露光装置は、基板を多数の真空吸着孔を有するス
テージに載置し真空吸着させて露光する基板の投影露光
装置において、ステージの真空吸着孔は、複数の真空吸
着孔群に区分けされ、各真空吸着孔群はそれぞれ対応す
る真空連通室に接続され、各真空連通室を順次吸着する
ように真空引きする手段が設けられていることを特徴と
する。In order to achieve the above object, a substrate projection exposure apparatus according to the first invention of this application is a substrate projection exposure apparatus in which a substrate is placed on a stage having a large number of vacuum suction holes and exposed by vacuum suction. The vacuum suction holes are divided into a plurality of vacuum suction hole groups, each vacuum suction hole group is connected to a corresponding vacuum communication chamber, and a means is provided for evacuating each vacuum communication chamber so as to sequentially attract suction. It is characterized by the presence of
この出願の第２の発明の基板の投影露光装置は、各真空
連通室を共通の真空ポンプに接続する各吸引路のそれぞ
れには絞り器が設けられ、基板の各部分がステージに順
次真空吸着されるように、各絞り器の絞り量を制御する
制御部が設けられていることを特徴とする。In the substrate projection exposure apparatus of the second invention of this application, each suction path that connects each vacuum communication chamber to a common vacuum pump is provided with a diaphragm, and each part of the substrate is sequentially vacuum-adsorbed on the stage. The present invention is characterized in that a control unit is provided to control the amount of squeezing of each squeezer.
この出願の第３の発明の基板の投影露光装置は、各真空
連通室を真空ポンプに接続する吸引路のそれぞれにはバ
ルブが設けられ、基板の各部分がステージに順次真空吸
着されるように、各バルブの開時を制御する制御部が設
けられていることを特徴とする。In the substrate projection exposure apparatus of the third invention of this application, each suction path connecting each vacuum communication chamber to a vacuum pump is provided with a valve, so that each part of the substrate is successively vacuum-adsorbed onto the stage. , is characterized in that it is provided with a control section that controls when each valve is opened.
この出願の第４の発明の基板の投影露光装置は、基板の
各部分がステージに順次真空吸着されるように、各真空
連通室間に適正な排気抵抗を有する接続路が設けられ、
一つの真空連通室に真空ポンプが接続されていることを
特徴とする。The substrate projection exposure apparatus according to the fourth invention of this application is provided with a connecting path having an appropriate exhaust resistance between each vacuum communication chamber so that each part of the substrate is successively vacuum-adsorbed to the stage;
A vacuum pump is connected to one vacuum communication chamber.
上記第１の発明では、各真空吸着孔群による吸着力を作
用させる時期を最適な順に個別に変えることができる。In the first invention, the timing at which the suction force of each vacuum suction hole group is applied can be individually changed in an optimal order.
また、上記第２の発明では、各真空吸着孔群による吸着
力を同時に作用させても、その最終吸着力に達するまで
の時間を、各絞り器の絞り量を制御することによって各
真空吸着孔群ごとに最適な順に調整できる。In addition, in the second invention, even if the suction force of each vacuum suction hole group is applied simultaneously, the time required to reach the final suction force can be reduced by controlling the amount of squeezing of each vacuum suction hole. Adjustments can be made in the optimal order for each group.
、また、上！己第３の発明では、各真空吸着孔群による
吸着力を作用させる時期を、各バルブの開時を制御する
ことによって各真空吸着孔群ごとに最適な順に調整でき
る。, also above! In the third invention, the timing at which the suction force of each vacuum suction hole group is applied can be adjusted in the optimum order for each vacuum suction hole group by controlling the opening time of each valve.
また、上言己第４の発明では、各真空吸着孔群による吸
着力を作用させる時期を、各真空連通室間に設けた適正
な排気抵抗を有する接続路における排気抵抗によって各
真空吸着孔群ごとに最適な順に調整できる。Furthermore, in the fourth aspect of the invention, the timing at which the suction force of each vacuum suction hole group is applied is determined by the exhaust resistance in the connection path having an appropriate exhaust resistance provided between each vacuum communication chamber. It can be adjusted in the optimal order for each.
第１図は本発明の一実施例に係る基板の投影露光装置の
説明図である。FIG. 1 is an explanatory diagram of a projection exposure apparatus for a substrate according to an embodiment of the present invention.
ｌＯはフィルムからなる基板、２０は多数の真空吸着孔
２１を有するステージである。IO is a substrate made of a film, and 20 is a stage having a large number of vacuum suction holes 21.
ステージ２０の真空吸着孔２１は、例えば４つの真空吸
着孔群２１Ａ、２１Ｂ、２１Ｃ，２１Ｄに区分けされて
いる。The vacuum suction holes 21 of the stage 20 are divided into, for example, four vacuum suction hole groups 21A, 21B, 21C, and 21D.
真空吸着孔群２１Ａ〜２１Ｄは、それぞれ独立の真空連
通室２２Ａ〜２２Ｄに接続されている。The vacuum suction hole groups 21A to 21D are connected to independent vacuum communication chambers 22A to 22D, respectively.
真空連通室２２Ａ〜２２Ｄは、それぞれ絞り器としての
速度調節器２３Ａ〜２３Ｄを介して、真空引きする手段
としての真空ポンプ２４に接続されている。The vacuum communication chambers 22A to 22D are connected to a vacuum pump 24, which serves as a means for evacuation, through speed regulators 23A to 23D, which serve as restrictors, respectively.
２５はバルブ、２６は真空予備室である。25 is a valve, and 26 is a vacuum preliminary chamber.
吸引路２７Ａ〜２７Ｄのそれぞれの速度ＶＡ −Ｖｎは
、速度調節器２３Ａ〜２３Ｄにより、ＶＡ＞Ｖｎ ＞Ｖ
Ｃ＞ＶＤとなるように調節されている。The respective speeds VA -Vn of the suction passages 27A to 27D are set to VA>Vn>V by the speed regulators 23A to 23D.
It is adjusted so that C>VD.
３１はコンプレッサ、３２はバルブであり、基板１０の
ステップ送り時には、真空吸着孔２１からエアを噴出さ
せて当該基板ｌＯをステージ２０から浮上させるための
ものである。31 is a compressor, and 32 is a valve, which is used to eject air from the vacuum suction hole 21 and float the substrate 1O from the stage 20 when the substrate 10 is fed in steps.
４１は照射部であり、超高圧水銀灯等のように紫外線を
効率的に放射するランプおよびレンズと、基板１０のス
テップ送りに対応して開閉するシャッタを内蔵している
。Reference numeral 41 denotes an irradiation unit, which includes a lamp and lens that efficiently radiates ultraviolet rays, such as an ultra-high pressure mercury lamp, and a shutter that opens and closes in response to the stepwise movement of the substrate 10.
Ｍはフォトマスクであり、照射部４１からの光が照射さ
れる位置に配置されている。M is a photomask, which is placed at a position where light from the irradiation section 41 is irradiated.
４２は投影レンズであり、照射されたフォトマスクＭの
像を投影するものである。A projection lens 42 projects an image of the irradiated photomask M.
５０は基板送り機構であり、フォトマスクＭの像の投影
位置に、基板１０としてのＦＰＣ用のフィルムを一コマ
ずつステップ送りするものである。５１は送りローラ、
５２は押えローラ、５３はテンションローラ、５４は押
えローラ、５５はモータ、５６はＣＰＵｃ内Ｈしたシス
テムコントローラである。送りｏ −５５１は、システ
ムコントローラ５６からの送り信号によって動作するモ
ータ５５によって駆動される。Reference numeral 50 denotes a substrate feeding mechanism, which feeds the FPC film as the substrate 10 one frame at a time to the projection position of the image of the photomask M. 51 is a feed roller;
52 is a presser roller, 53 is a tension roller, 54 is a presser roller, 55 is a motor, and 56 is a system controller installed in the CPUc. Feed o-551 is driven by motor 55 operated by a feed signal from system controller 56.
６１、６２は昇降ローラであり、ステージ２０を挟んで
基板送り方向の前後に設けられ、基板送りの際に基板１
０の前部および後部をステージ２０から浮上させるもの
である。６３．６４はそれぞれ昇降ローラ６１．６２を
駆動するエアシリンダである。６５．６６は回転の支点
である。Reference numerals 61 and 62 indicate lifting rollers, which are provided at the front and back in the substrate feeding direction with the stage 20 in between, and are used to raise and lower the substrate 1 during substrate feeding.
0 from the stage 20. 63 and 64 are air cylinders that drive the lifting rollers 61 and 62, respectively. 65.66 is the fulcrum of rotation.
第１図の装置の動作を説明すると、基板１０の一コマの
露光が終了すると、システムコントローラ５６によりバ
ルブ２５が閉状態となって真空吸着動作が解除されると
ともに、バルブ３２が開状態となってコンプレッサ３１
により真空吸着孔２１からエアが噴出して基板１０を浮
上させ、かつシステムコントローラ５６から２つのエア
シリンダ６３．６４に駆動信号が送られ、支点６５．６
６を中心に昇降ローラ６１６２が回動しながら上昇して
、第１図において二点鎖線で示すように基板１０の一コ
マの前部および後部が浮上する。To explain the operation of the apparatus shown in FIG. 1, when the exposure of one frame of the substrate 10 is completed, the system controller 56 closes the valve 25 to cancel the vacuum suction operation, and at the same time opens the valve 32. Compressor 31
Air is ejected from the vacuum suction hole 21 to levitate the substrate 10, and a drive signal is sent from the system controller 56 to the two air cylinders 63 and 64, and the fulcrums 65 and 6
6, the lifting roller 6162 rotates and rises, and the front and rear parts of one frame of the substrate 10 float up as shown by the two-dot chain line in FIG.
基板１０がステージ２０から浮上した状態で、システム
コントローラ５６からモータ５５にステップ送り信号が
送られ、送りローラ５１によって基板１０がステップ送
りされ、次の一コマが露光面に送られる。With the substrate 10 floating above the stage 20, a step feed signal is sent from the system controller 56 to the motor 55, the substrate 10 is step fed by the feed roller 51, and the next frame is sent to the exposure surface.
基板１０がステップ送りされると、システムコントロー
ラ５６により、バルブ３２が閉状態にバルブ２５が開状
態に切り換えられるとともに、２つのエアシリンダ６３
．６４に下降信号が送られて、昇降ローラ６１．６２に
よる浮上刃が解除されて基板１０がステージ２０に下降
する。このときバルブ２５が開状態となっているので、
速度調節器２３Ａ〜２３Ｄによりそれぞれ調整された速
度ＶＡ−Ｖｏで真空吸着孔群２１Ａ〜２１Ｄを介して基
板１０に吸引力が作用する。When the substrate 10 is fed in steps, the system controller 56 switches the valve 32 to the closed state and the valve 25 to the open state, and also switches the two air cylinders 63 to the closed state.
．． A lowering signal is sent to 64, the floating blades by the lifting rollers 61 and 62 are released, and the substrate 10 is lowered to the stage 20. At this time, since the valve 25 is in the open state,
Suction force acts on the substrate 10 via the vacuum suction hole groups 21A to 21D at speeds VA-Vo adjusted by the speed regulators 23A to 23D, respectively.
上記のようにＶＡからＶゎの順に速度が小さくなってい
るので同時に吸着はスタートするが、基板１０は、４つ
の真空吸着孔群２１Ａ〜２１Ｄによって、送りローラ５
１と押えローラ５２とによる、基板１０の送り位置精度
を支配する送りの駆動源に近い方から順次吸着力が増し
連続的にステージ２０に吸着されることとなる。従って
、基板１０はしわ等が生ぜず平坦な姿勢でステージ２０
に吸着されるようになる。As mentioned above, since the speed decreases in the order of VA to V, suction starts at the same time, but the substrate 10 is moved to the feed roller 5 by the four vacuum suction hole groups 21A to 21D.
1 and the holding roller 52, the suction force increases sequentially from the side closer to the feeding drive source that controls the accuracy of the feeding position of the substrate 10, and the substrate 10 is successively attracted to the stage 20. Therefore, the substrate 10 is placed on the stage 20 in a flat position without any wrinkles or the like.
Becomes adsorbed to.
なお、速度調節器２３Ａ〜２３Ｄは、通気抵抗が等しい
逆方向バイパス通路を有し、従って吹き上げ力は基板ｌ
υの全体に均一に作用する。Note that the speed regulators 23A to 23D have reverse bypass passages with equal ventilation resistance, so that the blowing force is equal to that of the substrate l.
It acts uniformly on the entire υ.
このように基板１０がステージ２０に吸着された状態で
シャフタが開かれて次の一コマの露光が行われ、以降上
記の動作が順次繰返して行われる。With the substrate 10 being attracted to the stage 20 in this manner, the shutter is opened to expose the next frame, and thereafter the above operations are repeated in sequence.
第２図は、本発胡の他の実施例の要部を示す説明図であ
る。コンプレッサ３１に対してはバルブ３２を設けると
ともに、真空ポンプ２４に対しては独立のバルブ２８Ａ
〜２８Ｄを各々設ける。FIG. 2 is an explanatory diagram showing the main parts of another embodiment of the present invention. A valve 32 is provided for the compressor 31, and an independent valve 28A is provided for the vacuum pump 24.
~28D are provided respectively.
基板の送り時には、コンプレッサ３１によって浮上刃を
つけて基板１０を送る。また、真空吸着の際には、シス
テムコントローラ５６からの信号により例えばｌ／４ｓ
ｅｃ間隔でずらしてバルブ２８Ａ〜２８Ｄを開にし、真
空吸着孔群２１Ａ〜２１Ｄによる吸着力を時間差をつけ
て作用させる。When feeding the substrate, the compressor 31 feeds the substrate 10 with a floating blade. In addition, during vacuum suction, a signal from the system controller 56 is used, for example, for l/4s.
The valves 28A to 28D are opened at intervals of ec, and the suction force by the vacuum suction hole groups 21A to 21D is applied with a time difference.
この実施例は、真空吸着のスタートの順がはっきりして
いるので、第１図の実施例よりさらに優れている。This embodiment is even better than the embodiment shown in FIG. 1 because the starting order of vacuum suction is clear.
第３図の実施例は、真空連通室２２Ａ〜２２Ｄを接続路
２９により直列に連通させ、送り方向の先頭側の真空連
通室２２Ａに、バルブ２５、真空予備室２６、真空ポン
プ２４を接続したものである。In the embodiment shown in FIG. 3, the vacuum communication chambers 22A to 22D are connected in series through a connection path 29, and a valve 25, a vacuum preparatory chamber 26, and a vacuum pump 24 are connected to the vacuum communication chamber 22A on the front side in the feeding direction. It is something.
この例では、真空ポンプ２４により吸引すると、真空吸
着孔群２１Ａ〜２１Ｄによる吸引は同時にスタートする
が、各接続路２９の排気抵抗により先頭側から順次増加
するので、基板１０はその先頭側から順次連続的に吸着
されることとなる。接続路２９の内径は、どの程度の吸
引力の勾配を与えればよいかで適宜決定される。In this example, when suction is performed by the vacuum pump 24, the suction by the vacuum suction hole groups 21A to 21D starts at the same time, but increases sequentially from the leading side due to the exhaust resistance of each connection path 29, so the substrate 10 is It will be continuously adsorbed. The inner diameter of the connection path 29 is appropriately determined depending on how much gradient of suction force should be applied.
本発明の適用の対象となる基板は、板状物であれば特に
限定されず、フィルム、ウェハ、液晶基板等の種々の基
板が包含される。The substrate to which the present invention is applied is not particularly limited as long as it is a plate-shaped substrate, and includes various substrates such as films, wafers, and liquid crystal substrates.
特に、ウェハの場合には、例えば中心部から同心円状に
真空吸着孔を区分けし、中心部から周辺部にかけて順次
連続的に真空吸着するのがよい。In particular, in the case of a wafer, it is preferable to divide the vacuum suction holes concentrically from the center, for example, and perform vacuum suction sequentially and continuously from the center to the periphery.
また、ウェハの特定部分から放射状に真空吸着するよう
にしてもよい。Alternatively, vacuum suction may be performed radially from a specific portion of the wafer.
本発明によれば、各真空吸着孔群の最終吸着力に達する
時間に差を持たせることができるので、必要な部分から
順次吸着し、基板が大面積であってもしわ、そり等を生
ぜずステージに平坦な姿勢で吸着されるので、ボケや歪
みのない像の投影露光装置を提供することができる。According to the present invention, since it is possible to differentiate the time required for each group of vacuum suction holes to reach the final suction force, suction can be made sequentially starting from the necessary parts, and even if the substrate has a large area, wrinkles, warpage, etc. will not occur. Since the image is attracted to the stage in a flat posture, it is possible to provide a projection exposure apparatus that produces images without blur or distortion.
第１図は本発明の一実施例に係るフィルム露光装置の説
明図、第２図は本発明の他の実施例の要部を示す説明図
、第３図は本発明のさらに他の実施例の要部を示す説明
図である。
１０・・・基板 ２０・・・ステージ２１
・・・真空吸着孔
２１Ａ、２１Ｂ、２ＩＣ，２１Ｄ・・・真空吸着孔群２
２Ａ、２２Ｂ、２２Ｃ，２２Ｄ・・・真空連通室２３Ａ
、２３Ｂ、２３Ｃ，２３Ｄ・・・速度調節器２４・・・
真空ポンプ ２５・・・バルブ２６・・・真空予
備室
２７Ａ、２７Ｂ、２７Ｃ１２７Ｄ・・・吸引路２８Ａ、
２８Ｂ、２８Ｃ１２８Ｄ・・・バルブ２９・・・接続路
３１・・・コンプレッサ３２・・・バルブ
４１・・・照射部Ｍ・・・フォトマスク
４２・・・投影レンズ５０・・・基板送り機構
５１・・・送りローラ５２、５４・・・押工ローラ
５３・・・テンションローラ５５″・・・モータ
５６・・・ンステムコントローラ
＋を図FIG. 1 is an explanatory diagram of a film exposure apparatus according to one embodiment of the present invention, FIG. 2 is an explanatory diagram showing the main part of another embodiment of the present invention, and FIG. 3 is a diagram showing still another embodiment of the present invention. FIG. 10... Board 20... Stage 21
...Vacuum suction holes 21A, 21B, 2IC, 21D...Vacuum suction hole group 2
2A, 22B, 22C, 22D...Vacuum communication chamber 23A
, 23B, 23C, 23D...speed regulator 24...
Vacuum pump 25...Valve 26...Vacuum preliminary chamber 27A, 27B, 27C127D...Suction path 28A,
28B, 28C128D...Valve 29...Connection path 31...Compressor 32...Valve 41...Irradiation part M...Photomask
42... Projection lens 50... Substrate feeding mechanism
51... Feed rollers 52, 54... Push rollers
53...Tension roller 55''...Motor 56...Stem controller + diagram
Claims (4)
し真空吸着させて露光する基板の投影露光装置において
、 ステージの真空吸着孔は、複数の真空吸着孔群に区分け
され、各真空吸着孔群はそれぞれ対応する真空連通室に
接続され、各真空連通室を順次吸着するように真空引き
する手段が設けられていることを特徴とする基板の投影
露光装置。(1) In a substrate projection exposure apparatus in which a substrate is placed on a stage having a large number of vacuum suction holes and exposed by vacuum suction, the vacuum suction holes of the stage are divided into a plurality of vacuum suction hole groups, and each vacuum suction 1. A projection exposure apparatus for a substrate, characterized in that each hole group is connected to a corresponding vacuum communication chamber, and is provided with means for evacuating each vacuum communication chamber so as to sequentially attract the vacuum communication chambers.
引路のそれぞれには絞り器が設けられ、基板の各部分が
ステージに順次真空吸着されるように、各絞り器の絞り
量を制御する制御部が設けられていることを特徴とする
請求項１に記載の基板の投影露光装置。(2) Each suction path that connects each vacuum communication chamber to a common vacuum pump is provided with a constrictor, and the constriction amount of each constrictor is adjusted so that each part of the substrate is sequentially vacuum-adsorbed to the stage. 2. The projection exposure apparatus for a substrate according to claim 1, further comprising a control section for controlling the projection exposure apparatus.
れぞれにはバルブが設けられ、 基板の各部分がステージに順次真空吸着されるように、
各バルブの開時を制御する制御部が設けられていること
を特徴とする請求項１に記載の基板の投影露光装置。(3) Each suction path connecting each vacuum communication chamber to the vacuum pump is provided with a valve, so that each part of the substrate is successively vacuum-adsorbed to the stage.
2. The projection exposure apparatus for a substrate according to claim 1, further comprising a control section for controlling when each valve is opened.
うに、各真空連通室間に適正な排気抵抗を有する接続路
が設けられ、一つの真空連通室に真空ポンプが接続され
ていることを特徴とする請求項１に記載の基板の投影露
光装置。(4) A connection path with appropriate exhaust resistance is provided between each vacuum communication chamber, and a vacuum pump is connected to one vacuum communication chamber so that each part of the substrate is vacuum-adsorbed to the stage in sequence. 2. A projection exposure apparatus for a substrate according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2081333A JP2804151B2 (en) | 1990-03-30 | 1990-03-30 | Substrate projection exposure equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2081333A JP2804151B2 (en) | 1990-03-30 | 1990-03-30 | Substrate projection exposure equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03282472A true JPH03282472A (en) | 1991-12-12 |
| JP2804151B2 JP2804151B2 (en) | 1998-09-24 |
Family
ID=13743455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2081333A Expired - Fee Related JP2804151B2 (en) | 1990-03-30 | 1990-03-30 | Substrate projection exposure equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2804151B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002251017A (en) * | 2001-02-23 | 2002-09-06 | Adtec Engineeng Co Ltd | Aligner |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102187532B1 (en) * | 2018-07-12 | 2020-12-07 | 주식회사 테스 | Vacuum susceptor for substrate processing apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5689744A (en) * | 1979-12-24 | 1981-07-21 | Fujitsu Ltd | X-ray transfer device |
-
1990
- 1990-03-30 JP JP2081333A patent/JP2804151B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5689744A (en) * | 1979-12-24 | 1981-07-21 | Fujitsu Ltd | X-ray transfer device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002251017A (en) * | 2001-02-23 | 2002-09-06 | Adtec Engineeng Co Ltd | Aligner |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2804151B2 (en) | 1998-09-24 |
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